{"id":"https://openalex.org/W4285103255","doi":"https://doi.org/10.1109/ectc51906.2022.00120","title":"QFN (Quad Flat No\u2013lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms","display_name":"QFN (Quad Flat No\u2013lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms","publication_year":2022,"publication_date":"2022-05-01","ids":{"openalex":"https://openalex.org/W4285103255","doi":"https://doi.org/10.1109/ectc51906.2022.00120"},"language":"en","primary_location":{"id":"doi:10.1109/ectc51906.2022.00120","doi":"https://doi.org/10.1109/ectc51906.2022.00120","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc51906.2022.00120","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5066284614","display_name":"Emna Ben Romdhane","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4394709072","display_name":"IRT Saint Exup\u00e9ry","ror":"https://ror.org/01qew1n19","country_code":"FR","type":"nonprofit","lineage":["https://openalex.org/I4394709072"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"E. Ben Romdhane","raw_affiliation_strings":["Institut de Recherche Technologique Saint-Exupéry,Toulouse,France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institut de Recherche Technologique Saint-Exupéry,Toulouse,France","institution_ids":["https://openalex.org/I4394709072"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037251304","display_name":"P. Roumanille","orcid":"https://orcid.org/0000-0003-2415-8251","observed_orcids":["https://orcid.org/0000-0003-2415-8251"]},"institutions":[{"id":"https://openalex.org/I4394709072","display_name":"IRT Saint Exup\u00e9ry","ror":"https://ror.org/01qew1n19","country_code":"FR","type":"nonprofit","lineage":["https://openalex.org/I4394709072"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"P. Roumanille","raw_affiliation_strings":["Institut de Recherche Technologique Saint-Exupéry,Toulouse,France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institut de Recherche Technologique Saint-Exupéry,Toulouse,France","institution_ids":["https://openalex.org/I4394709072"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030593907","display_name":"Alexandrine Gu\u00e9don-Gracia","orcid":"https://orcid.org/0000-0002-9566-7961","observed_orcids":["https://orcid.org/0000-0002-9566-7961"]},"institutions":[{"id":"https://openalex.org/I15057530","display_name":"Universit\u00e9 de Bordeaux","ror":"https://ror.org/057qpr032","country_code":"FR","type":"education","lineage":["https://openalex.org/I15057530"]},{"id":"https://openalex.org/I4210157089","display_name":"Laboratoire de l'Int\u00e9gration du Mat\u00e9riau au Syst\u00e8me","ror":"https://ror.org/04nabhy78","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I15057530","https://openalex.org/I4210091158","https://openalex.org/I4210095849","https://openalex.org/I4210157089","https://openalex.org/I4210160189"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"A. Guedon-Gracia","raw_affiliation_strings":["University of Bordeaux,IMS Laboratory,Talence,France","IMS Laboratory, University of Bordeaux, Talence, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Bordeaux,IMS Laboratory,Talence,France","institution_ids":["https://openalex.org/I15057530","https://openalex.org/I4210157089"]},{"raw_affiliation_string":"IMS Laboratory, University of Bordeaux, Talence, France","institution_ids":["https://openalex.org/I15057530","https://openalex.org/I4210157089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080426891","display_name":"S. Pin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4394709072","display_name":"IRT Saint Exup\u00e9ry","ror":"https://ror.org/01qew1n19","country_code":"FR","type":"nonprofit","lineage":["https://openalex.org/I4394709072"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"S. Pin","raw_affiliation_strings":["Institut de Recherche Technologique Saint-Exupéry,Toulouse,France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institut de Recherche Technologique Saint-Exupéry,Toulouse,France","institution_ids":["https://openalex.org/I4394709072"]}]},{"author_position":"middle","author":{"id":null,"display_name":"P. Nguyen","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"P. Nguyen","raw_affiliation_strings":["Elemca, Toulouse, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Elemca, Toulouse, France","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5105889273","display_name":"H. Fr\u00e9mont","orcid":"https://orcid.org/0000-0003-3747-5774","observed_orcids":["https://orcid.org/0000-0003-3747-5774"]},"institutions":[{"id":"https://openalex.org/I15057530","display_name":"Universit\u00e9 de Bordeaux","ror":"https://ror.org/057qpr032","country_code":"FR","type":"education","lineage":["https://openalex.org/I15057530"]},{"id":"https://openalex.org/I4210157089","display_name":"Laboratoire de l'Int\u00e9gration du Mat\u00e9riau au Syst\u00e8me","ror":"https://ror.org/04nabhy78","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I15057530","https://openalex.org/I4210091158","https://openalex.org/I4210095849","https://openalex.org/I4210157089","https://openalex.org/I4210160189"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"H. Fremont","raw_affiliation_strings":["University of Bordeaux,IMS Laboratory,Talence,France","IMS Laboratory, University of Bordeaux, Talence, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Bordeaux,IMS Laboratory,Talence,France","institution_ids":["https://openalex.org/I15057530","https://openalex.org/I4210157089"]},{"raw_affiliation_string":"IMS Laboratory, University of Bordeaux, Talence, France","institution_ids":["https://openalex.org/I15057530","https://openalex.org/I4210157089"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.9613,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.84983463,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"716","last_page":"722"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/qfn-package","display_name":"QFN package","score":0.8889999985694885},{"id":"https://openalex.org/keywords/sn-ag-cu-solder","display_name":"Sn-Ag-Cu solder","score":0.800000011920929},{"id":"https://openalex.org/keywords/lead-free-solder-joints","display_name":"lead-free solder joints","score":0.777999997138977},{"id":"https://openalex.org/keywords/thermal-cycling","display_name":"thermal cycling","score":0.8930000066757202},{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.9100000262260437},{"id":"https://openalex.org/keywords/intergranular-fracture","display_name":"intergranular fracture","score":0.9610000252723694},{"id":"https://openalex.org/keywords/interfacial-fracture","display_name":"interfacial fracture","score":0.9200000166893005},{"id":"https://openalex.org/keywords/thermomechanical-fatigue","display_name":"thermomechanical fatigue","score":0.8859999775886536},{"id":"https://openalex.org/keywords/solder-joint-failure-mechanisms","display_name":"solder joint failure mechanisms","score":0.5770000219345093}],"concepts":[{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.8712592124938965},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8327214121818542},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.7621363401412964},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7494523525238037},{"id":"https://openalex.org/C184102282","wikidata":"https://www.wikidata.org/wiki/Q600055","display_name":"Intergranular corrosion","level":3,"score":0.6672895550727844},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5325820446014404},{"id":"https://openalex.org/C27805521","wikidata":"https://www.wikidata.org/wiki/Q1326017","display_name":"Electron backscatter diffraction","level":3,"score":0.5138735771179199},{"id":"https://openalex.org/C136478896","wikidata":"https://www.wikidata.org/wiki/Q898288","display_name":"Brittleness","level":2,"score":0.4851585030555725},{"id":"https://openalex.org/C195702682","wikidata":"https://www.wikidata.org/wiki/Q623318","display_name":"Recrystallization (geology)","level":2,"score":0.481456458568573},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.39053916931152344},{"id":"https://openalex.org/C77595967","wikidata":"https://www.wikidata.org/wiki/Q3151013","display_name":"Forensic engineering","level":1,"score":0.33889585733413696},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.29541730880737305},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.2463916838169098},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.07719573378562927},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/ectc51906.2022.00120","doi":"https://doi.org/10.1109/ectc51906.2022.00120","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc51906.2022.00120","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"},{"id":"pmh:oai:HAL:hal-03781126v1","doi":null,"is_oa":false,"landing_page_url":"https://hal.science/hal-03781126","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4405252976","host_organization_name":"Centre pour la Communication Scientifique Directe","host_organization_lineage":["https://openalex.org/I4405252976"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), May 2022, San Diego, United States. ⟨10.1109/ectc51906.2022.00120⟩","raw_type":"info:eu-repo/semantics/conferenceObject"},{"id":"pmh:oai:oskar-bordeaux.fr:20.500.12278/140607","doi":null,"is_oa":false,"landing_page_url":"https://oskar-bordeaux.fr/handle/20.500.12278/140607","pdf_url":null,"source":{"id":"https://openalex.org/S4306402569","display_name":"Oskar-Bordeaux (Universite de Bordeaux)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I15057530","host_organization_name":"Universit\u00e9 de Bordeaux","host_organization_lineage":["https://openalex.org/I15057530"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"crossref","raw_type":"Communication dans un congr\u00e8s avec actes"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1964553618","https://openalex.org/W2015848050","https://openalex.org/W2076927279","https://openalex.org/W2083424790","https://openalex.org/W2103605379","https://openalex.org/W2139495772","https://openalex.org/W2149046391","https://openalex.org/W2612555473","https://openalex.org/W2791809622","https://openalex.org/W2886255005","https://openalex.org/W2958460288","https://openalex.org/W3042932790","https://openalex.org/W3097442054","https://openalex.org/W3187180884","https://openalex.org/W3205154045","https://openalex.org/W3207458184","https://openalex.org/W6922638554"],"related_works":["https://openalex.org/W2037303235","https://openalex.org/W2134216772","https://openalex.org/W2338681797","https://openalex.org/W2744493412","https://openalex.org/W2119835998","https://openalex.org/W4416877764","https://openalex.org/W4416880480","https://openalex.org/W4285032122","https://openalex.org/W4416876131","https://openalex.org/W4416404049"],"abstract_inverted_index":{"One":[0],"of":[1,58,73,110,200,226,233,251],"the":[2,13,17,23,33,84,90,96,108,153,167,201,224,227,249,277],"main":[3],"barriers":[4],"for":[5,43,282],"using":[6],"QFN":[7,34,111,139,173,183,234,283],"(Quad":[8],"Flat":[9],"No-lead)":[10],"packages":[11],"in":[12,55,83,131],"semiconductor":[14],"industry":[15],"is":[16,62,129],"board-level":[18],"solder":[19,44,60,91,112,140,174,239,278],"joint":[20,45,175,279],"reliability.":[21],"Despite":[22],"small":[24],"form":[25],"factor":[26],"and":[27,66,126,205,259],"better":[28],"heat":[29],"dissipation":[30],"that":[31,119,182,210],"offer":[32],"devices,":[35],"their":[36],"reduced":[37],"standoff":[38],"height":[39],"remains":[40],"a":[41,198,206],"concern":[42],"thermal":[46,115,158,178],"fatigue":[47,57],"failure.":[48],"The":[49,71,219,230,256],"primary":[50],"failure":[51,102,127,191,280],"mechanism":[52,103,195,221,281],"often":[53],"involved":[54],"thermomechanical":[56],"lead-free":[59],"joints":[61,113,141,235],"tin":[63,214],"grain":[64,215],"recrystallization":[65,216],"strain-enhanced":[67],"Ag3Sn":[68],"precipitate":[69],"coarsening.":[70],"combination":[72],"these":[74],"microstructural":[75,124,154,168],"processes":[76],"leads":[77],"to":[78,95,134,138,151,166,171,187,217,237,244],"intergranular":[79,203],"cracks":[80],"which":[81],"propagate":[82],"high":[85],"strain":[86],"region":[87],"depending":[88],"on":[89],"geometry":[92],"(generally":[93],"close":[94],"package":[97],"or":[98],"PCB).":[99],"However,":[100],"another":[101],"was":[104,149],"observed":[105],"when":[106],"studying":[107],"behavior":[109,232],"during":[114,177],"cycling.":[116,179],"An":[117],"approach":[118],"combines":[120],"in-situ":[121],"electrical":[122],"monitoring,":[123],"investigation":[125],"analysis":[128,148,170],"presented":[130],"this":[132],"study":[133],"identify":[135],"phenomena":[136],"leading":[137],"cracking.":[142],"Electron":[143],"Back":[144],"Scattered":[145],"Diffraction":[146],"(EBSD)":[147],"conducted":[150],"assess":[152],"changes":[155],"at":[156],"different":[157,231],"cycling":[159],"levels.":[160],"Lifetime":[161],"data":[162],"are":[163,185],"then":[164],"correlated":[165],"evolution":[169],"understand":[172],"damaging":[176],"Results":[180],"show":[181],"solders":[184],"likely":[186],"fail":[188],"by":[189,197],"two":[190],"mechanisms.":[192],"A":[193],"first":[194],"characterized":[196],"mixture":[199],"known":[202],"crack":[204,209],"brittle":[207],"interfacial":[208,228],"does":[211],"not":[212],"need":[213],"propagate.":[218],"other":[220,238],"illustrates":[222],"only":[223],"presence":[225,250],"cracks.":[229],"compared":[236],"geometries":[240],"can":[241],"be":[242],"due":[243],"several":[245],"factors":[246],"such":[247],"as":[248],"an":[252],"unusual":[253],"as-reflowed":[254],"microstructure.":[255],"assembly":[257],"design":[258],"its":[260],"materials":[261],"properties":[262],"(aspect":[263],"ratio,":[264],"green":[265],"epoxy":[266],"molding":[267],"compound":[268],"with":[269],"low":[270],"CTE,":[271],"copper":[272],"lead-frame)":[273],"may":[274],"also":[275],"affect":[276],"packages.":[284]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2022-07-14T00:00:00"}