{"id":"https://openalex.org/W4282007307","doi":"https://doi.org/10.1117/12.2614262","title":"High-transmission EUV pellicles supporting >400W source power","display_name":"High-transmission EUV pellicles supporting >400W source power","publication_year":2022,"publication_date":"2022-05-26","ids":{"openalex":"https://openalex.org/W4282007307","doi":"https://doi.org/10.1117/12.2614262"},"language":"en","primary_location":{"id":"doi:10.1117/12.2614262","doi":"https://doi.org/10.1117/12.2614262","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2614262","pdf_url":null,"source":{"id":"https://openalex.org/S7407106495","display_name":"SPIE Optical and EUV Nanolithography","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Optical and EUV Nanolithography XXXV","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5087347788","display_name":"Mark A. van de Kerkhof","orcid":"https://orcid.org/0000-0001-6837-6897","observed_orcids":["https://orcid.org/0000-0001-6837-6897"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Mark A. van de Kerkhof","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Alexander Klein","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Alexander Klein","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026283583","display_name":"Paul Vermeulen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Paul Vermeulen","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010124977","display_name":"Ties van der Woord","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Ties van der Woord","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029884365","display_name":"\u0130nci D\u00f6nmez","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Inci Donmez","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010742318","display_name":"Guido Salmaso","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Guido Salmaso","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110745166","display_name":"Raymond Maas","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Raymond Maas","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":5.0994,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.97066638,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":93,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"26","last_page":"26"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11723","display_name":"Optical Coatings and Gratings","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11183","display_name":"Advanced X-ray Imaging Techniques","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3108","display_name":"Radiation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/euv-pellicle","display_name":"EUV pellicle","score":0.9919999837875366},{"id":"https://openalex.org/keywords/euv-lithography","display_name":"EUV lithography","score":0.8980000019073486},{"id":"https://openalex.org/keywords/high-volume-manufacturing","display_name":"high-volume manufacturing","score":0.796999990940094}],"concepts":[{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.9941489696502686},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6637504696846008},{"id":"https://openalex.org/C146024833","wikidata":"https://www.wikidata.org/wiki/Q1385457","display_name":"Extreme ultraviolet","level":3,"score":0.6038385033607483},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.5404193997383118},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.5104207396507263},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4948062300682068},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.44859611988067627},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.41209548711776733},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.38231348991394043},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3588452935218811},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3329167366027832},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3259795010089874},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.2796659469604492},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.24173229932785034},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.21955135464668274},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.09591424465179443},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.08490920066833496},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.2614262","doi":"https://doi.org/10.1117/12.2614262","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2614262","pdf_url":null,"source":{"id":"https://openalex.org/S7407106495","display_name":"SPIE Optical and EUV Nanolithography","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Optical and EUV Nanolithography XXXV","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.4943999946117401,"id":"https://metadata.un.org/sdg/9"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4404556887","https://openalex.org/W4308790534","https://openalex.org/W4367297027","https://openalex.org/W4388895739","https://openalex.org/W2535148601","https://openalex.org/W4415977801","https://openalex.org/W4388856017","https://openalex.org/W2953535625","https://openalex.org/W4404170915","https://openalex.org/W3202338108"],"abstract_inverted_index":{"EUV":[0,17,54,66,75],"lithography":[1,100],"has":[2],"been":[3],"adopted":[4],"worldwide":[5],"for":[6],"High-Volume":[7],"Manufacturing":[8],"(HVM)":[9],"of":[10,52,70,78,84,94],"sub-10nm":[11],"node":[12],"semiconductors.":[13],"To":[14],"support":[15,40,98],"HVM,":[16],"pellicles":[18,28,67,87],"were":[19,33],"introduced":[20],"by":[21],"ASML":[22],"in":[23],"2016,":[24],"and":[25,39,73],"more":[26],"recently,":[27],"made":[29],"from":[30],"novel":[31,86],"materials":[32,96],"developed":[34],"to":[35,64,68,97],"offer":[36],"higher":[37,41],"transmission":[38],"source":[42,76],"powers.":[43],"In":[44],"this":[45],"paper,":[46],"we":[47,57],"will":[48,58,88],"give":[49],"an":[50],"overview":[51],"current":[53],"pellicles.":[55],"Also,":[56],"report":[59],"on":[60],"our":[61],"continuing":[62],"research":[63],"optimize":[65],"transmissions":[69],"above":[71,79],"90%,":[72],"supporting":[74],"powers":[77],"400W.":[80],"Key":[81],"performance":[82],"indicators":[83],"such":[85],"be":[89],"presented,":[90],"showing":[91],"the":[92],"promise":[93],"these":[95],"upcoming":[99],"nodes.":[101]},"counts_by_year":[{"year":2026,"cited_by_count":7},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":2}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2022-06-13T00:00:00"}