{"id":"https://openalex.org/W4281556751","doi":"https://doi.org/10.1117/12.2608319","title":"Overlay challenges in 3D heterogeneous integration","display_name":"Overlay challenges in 3D heterogeneous integration","publication_year":2022,"publication_date":"2022-05-26","ids":{"openalex":"https://openalex.org/W4281556751","doi":"https://doi.org/10.1117/12.2608319"},"language":"en","primary_location":{"id":"doi:10.1117/12.2608319","doi":"https://doi.org/10.1117/12.2608319","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2608319","pdf_url":null,"source":{"id":"https://openalex.org/S4363607273","display_name":"Metrology, Inspection, and Process Control XXXVI","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Metrology, Inspection, and Process Control XXXVI","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083766657","display_name":"Yoav Grauer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210146828","display_name":"KLA (Israel)","ror":"https://ror.org/04hm0cn69","country_code":"IL","type":"company","lineage":["https://openalex.org/I4210146828","https://openalex.org/I70745867"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"Yoav Grauer","raw_affiliation_strings":["KLA Israel (Israel)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA Israel (Israel)","institution_ids":["https://openalex.org/I4210146828"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087597143","display_name":"Andy Miller","orcid":"https://orcid.org/0000-0001-6103-1685","observed_orcids":["https://orcid.org/0000-0001-6103-1685"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Andy Miller","raw_affiliation_strings":["imec (Belgium)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec (Belgium)","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085613015","display_name":"Douglas Charles La Tulipe","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Douglas Charles La Tulipe","raw_affiliation_strings":["imec (Belgium)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec (Belgium)","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016748501","display_name":"Amnon Manassen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210146828","display_name":"KLA (Israel)","ror":"https://ror.org/04hm0cn69","country_code":"IL","type":"company","lineage":["https://openalex.org/I4210146828","https://openalex.org/I70745867"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"Amnon Manassen","raw_affiliation_strings":["KLA Israel (Israel)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA Israel (Israel)","institution_ids":["https://openalex.org/I4210146828"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060385640","display_name":"Shlomo Eisenbach","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210146828","display_name":"KLA (Israel)","ror":"https://ror.org/04hm0cn69","country_code":"IL","type":"company","lineage":["https://openalex.org/I4210146828","https://openalex.org/I70745867"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"Shlomo Eisenbach","raw_affiliation_strings":["KLA Israel (Israel)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA Israel (Israel)","institution_ids":["https://openalex.org/I4210146828"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087128358","display_name":"Ohad Bachar","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210146828","display_name":"KLA (Israel)","ror":"https://ror.org/04hm0cn69","country_code":"IL","type":"company","lineage":["https://openalex.org/I4210146828","https://openalex.org/I70745867"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"Ohad Bachar","raw_affiliation_strings":["KLA Israel (Israel)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA Israel (Israel)","institution_ids":["https://openalex.org/I4210146828"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051148994","display_name":"Roel Gronheid","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Roel Gronheid","raw_affiliation_strings":["KLA Corp. (Belgium)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"KLA Corp. (Belgium)","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.2353,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.92875078,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"27","last_page":"27"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-heterogeneous-integration","display_name":"3D heterogeneous integration","score":0.9419999718666077},{"id":"https://openalex.org/keywords/overlay-metrology","display_name":"overlay metrology","score":0.9900000095367432},{"id":"https://openalex.org/keywords/wafer-to-wafer-bonding","display_name":"wafer-to-wafer bonding","score":0.8130000233650208},{"id":"https://openalex.org/keywords/die-to-wafer-bonding","display_name":"die-to-wafer bonding","score":0.8989999890327454},{"id":"https://openalex.org/keywords/pick-and-place-assembly","display_name":"pick-and-place assembly","score":0.871999979019165},{"id":"https://openalex.org/keywords/more-than-moore","display_name":"More than Moore","score":0.8199999928474426}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6281180381774902},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6035359501838684},{"id":"https://openalex.org/C136085584","wikidata":"https://www.wikidata.org/wiki/Q910289","display_name":"Overlay","level":2,"score":0.5072948336601257},{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.5068257451057434},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.4409607946872711},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.4328969120979309},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.4272440969944},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3559454083442688},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3497812747955322},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.3252381682395935},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.26734521985054016},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.24667420983314514},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2038540542125702},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1720043122768402},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09729629755020142},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.2608319","doi":"https://doi.org/10.1117/12.2608319","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2608319","pdf_url":null,"source":{"id":"https://openalex.org/S4363607273","display_name":"Metrology, Inspection, and Process Control XXXVI","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Metrology, Inspection, and Process Control XXXVI","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4366254122","https://openalex.org/W4395484404","https://openalex.org/W1984213746","https://openalex.org/W7152113652","https://openalex.org/W7151773246","https://openalex.org/W4394892072","https://openalex.org/W4385893347","https://openalex.org/W4416883556","https://openalex.org/W4408325599","https://openalex.org/W7164206649"],"abstract_inverted_index":{"3D":[0,57],"heterogeneous":[1,58],"integration":[2,59],"is":[3],"an":[4],"evolving":[5,142],"segment":[6],"of":[7],"the":[8,31,50,135],"world":[9],"semiconductor":[10],"industry":[11],"roadmap":[12],"to":[13,61,71,89,96,113],"enable":[14,72],"improvements":[15,36],"in":[16,37],"device":[17],"performance":[18,28],"beyond":[19],"Moore\u2019s":[20],"law":[21],"expectations.":[22],"These":[23],"\u201cMore":[24],"than":[25],"Moore\u201d":[26],"(MtM)":[27],"enhancements":[29],"have":[30],"potential":[32],"for":[33],"realizing":[34],"dramatic":[35],"communication":[38],"bandwidth,":[39],"design":[40],"flexibility":[41],"that":[42],"enables":[43],"new":[44,108],"system":[45],"architectures":[46],"on-chip":[47],"or":[48,121],"at":[49],"wafer":[51,88,90,97,120],"level,":[52],"and":[53,67,78,94,104,124,138,155,157,163],"overall":[54],"cost":[55],"reduction.":[56],"strives":[60],"increase":[62],"electrical":[63],"connectivity":[64],"through":[65],"pitch":[66,74],"contact":[68],"dimensional":[69],"scaling":[70],"<10\u03bcm":[73],"solder":[75],"bump":[76],"scaling,":[77],"sub-micrometer":[79],"hybrid":[80],"Cu/dielectric":[81],"fusion":[82],"bond":[83],"connectivity.":[84],"Integration":[85],"options":[86],"include":[87],"(W2W),":[91],"pick-and-place":[92],"(P&P),":[93],"die":[95,122],"(D2W)":[98],"assembly":[99],"strategies.":[100],"Enhanced":[101],"process":[102],"capability":[103],"systems":[105],"architecture":[106],"imposes":[107],"overlay":[109],"(OVL)":[110],"metrology":[111],"challenges":[112,139],"address":[114],"variable":[115],"silicon":[116],"substrate":[117],"thickness,":[118],"stressinduced":[119],"distortions,":[123],"tight":[125],"OVL":[126,136,148],"error":[127,165],"specifications.":[128],"In":[129],"this":[130,141],"work,":[131],"we":[132],"will":[133,145],"cover":[134,146],"trends":[137],"surrounding":[140],"segment.":[143],"We":[144],"different":[147],"aspects":[149],"such":[150],"as":[151],"accuracy,":[152],"measurability,":[153],"reproducibility,":[154],"throughput":[156],"discuss":[158],"their":[159],"impact":[160],"on":[161],"pre":[162],"post-bonding":[164],"budgets.":[166]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1}],"updated_date":"2026-10-01T08:54:57.152042","created_date":"2022-05-27T00:00:00"}