{"id":"https://openalex.org/W4254869998","doi":"https://doi.org/10.1142/9789811209666_0007","title":"Encapsulating Plastic Microelectronics","display_name":"Encapsulating Plastic Microelectronics","publication_year":2019,"publication_date":"2019-08-28","ids":{"openalex":"https://openalex.org/W4254869998","doi":"https://doi.org/10.1142/9789811209666_0007"},"language":"en","primary_location":{"id":"doi:10.1142/9789811209666_0007","doi":"https://doi.org/10.1142/9789811209666_0007","is_oa":false,"landing_page_url":"https://doi.org/10.1142/9789811209666_0007","pdf_url":null,"source":{"id":"https://openalex.org/S4306464320","display_name":"WORLD SCIENTIFIC eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319815","host_organization_name":"World Scientific","host_organization_lineage":["https://openalex.org/P4310319815"],"host_organization_lineage_names":["World Scientific"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Encyclopedia of Packaging Materials, Processes, and Mechanics","raw_type":"book-chapter"},"volume":null,"type":"reference-entry","is_traditional":false,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5049713089","display_name":"Eric Kuah","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"ERIC KUAH","raw_affiliation_strings":["ASM Technology Singapore, Pte., Ltd., 535 Yishun Industrial Park A, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASM Technology Singapore, Pte., Ltd., 535 Yishun Industrial Park A, Singapore","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":["https://openalex.org/A5049713089"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"257","last_page":"288"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.8306000232696533,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.8306000232696533,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.02280000038444996,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.019899999722838402,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/encapsulation","display_name":"encapsulation","score":0.8090000152587891},{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"flexible electronics","score":0.574999988079071},{"id":"https://openalex.org/keywords/polymer-substrates","display_name":"polymer substrates","score":0.3479999899864197}],"concepts":[{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.8586402535438538},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4826367497444153},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2556876540184021}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1142/9789811209666_0007","doi":"https://doi.org/10.1142/9789811209666_0007","is_oa":false,"landing_page_url":"https://doi.org/10.1142/9789811209666_0007","pdf_url":null,"source":{"id":"https://openalex.org/S4306464320","display_name":"WORLD SCIENTIFIC eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319815","host_organization_name":"World Scientific","host_organization_lineage":["https://openalex.org/P4310319815"],"host_organization_lineage_names":["World Scientific"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Encyclopedia of Packaging Materials, Processes, and Mechanics","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3023531583","https://openalex.org/W4280654148","https://openalex.org/W4413024817","https://openalex.org/W7204048485","https://openalex.org/W4240520266","https://openalex.org/W2497394243","https://openalex.org/W2497342907","https://openalex.org/W4245113963","https://openalex.org/W2529832000","https://openalex.org/W4415753813"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2022-05-12T00:00:00"}