{"id":"https://openalex.org/W4237616280","doi":"https://doi.org/10.1109/33.52876","title":"Direct chip interconnect using polymer bonding","display_name":"Direct chip interconnect using polymer bonding","publication_year":1990,"publication_date":"1990-03-01","ids":{"openalex":"https://openalex.org/W4237616280","doi":"https://doi.org/10.1109/33.52876"},"language":"en","primary_location":{"id":"doi:10.1109/33.52876","doi":"https://doi.org/10.1109/33.52876","is_oa":false,"landing_page_url":"https://doi.org/10.1109/33.52876","pdf_url":null,"source":{"id":"https://openalex.org/S3582665","display_name":"IEEE Transactions on Components Hybrids and Manufacturing Technology","issn_l":"0148-6411","issn":["0148-6411","1558-3082"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Components, Hybrids, and Manufacturing Technology","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5038487739","display_name":"Ken Gilleo","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"K. Gilleo","raw_affiliation_strings":["Sheldahl Inc., Northfield, MN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Sheldahl Inc., Northfield, MN, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":["https://openalex.org/A5038487739"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.8716,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.85994502,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"13","issue":"1","first_page":"229","last_page":"234"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0010999999940395355,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/polymer-bonding","display_name":"polymer bonding","score":0.9829999804496765},{"id":"https://openalex.org/keywords/anisotropic-conductive-adhesive","display_name":"anisotropic conductive adhesive","score":0.9639999866485596},{"id":"https://openalex.org/keywords/tape-automated-bonding","display_name":"tape automated bonding","score":0.796999990940094},{"id":"https://openalex.org/keywords/flip-chip-bonding","display_name":"flip-chip bonding","score":0.9940000176429749},{"id":"https://openalex.org/keywords/isotropically-conductive-adhesives","display_name":"isotropically conductive adhesives","score":0.8119999766349792},{"id":"https://openalex.org/keywords/fine-pitch-interconnects","display_name":"fine pitch interconnects","score":0.8040000200271606},{"id":"https://openalex.org/keywords/high-density-interconnects","display_name":"high-density interconnects","score":0.8019999861717224},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"integrated circuit packaging","score":0.609000027179718}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.8101783990859985},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.7321518063545227},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7213054895401001},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.553652822971344},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.5466270446777344},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.5328396558761597},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4875759482383728},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.48417431116104126},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4738774001598358},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3956279754638672},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3521210849285126},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3205100893974304},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.28960609436035156},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.27617284655570984},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1205126941204071},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08581393957138062},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.07968279719352722}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/33.52876","doi":"https://doi.org/10.1109/33.52876","is_oa":false,"landing_page_url":"https://doi.org/10.1109/33.52876","pdf_url":null,"source":{"id":"https://openalex.org/S3582665","display_name":"IEEE Transactions on Components Hybrids and Manufacturing Technology","issn_l":"0148-6411","issn":["0148-6411","1558-3082"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Components, Hybrids, and Manufacturing Technology","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.651199996471405}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W164188512","https://openalex.org/W2133383455","https://openalex.org/W2134936297","https://openalex.org/W2166792218"],"related_works":["https://openalex.org/W4241595757","https://openalex.org/W2131677798","https://openalex.org/W1591958175","https://openalex.org/W1745967590","https://openalex.org/W4385893383","https://openalex.org/W4285103068","https://openalex.org/W1982688761","https://openalex.org/W3126475909","https://openalex.org/W1504707317","https://openalex.org/W2315893532"],"abstract_inverted_index":{"Polymer":[0,32],"bonding":[1,79,100,104,114,141],"methods":[2,80],"for":[3,22,81,97,116],"the":[4,42,48,86],"direct":[5,23,117],"high-density,":[6],"fine-pitch":[7],"interconnection":[8],"of":[9,28,54,60,108,122,133,142],"integrated":[10],"circuit":[11,87,126],"(IC)":[12],"components":[13,144],"are":[14,30,88],"discussed.":[15,57],"Emerging":[16],"approaches":[17],"using":[18],"polymer":[19,78,113],"materials":[20,63],"engineered":[21],"mechanical":[24,118],"and":[25,51,64,102,111,119],"electrical":[26,120],"connection":[27,121],"ICs":[29,84],"covered.":[31],"thick-film":[33],"(PTF)":[34],"technology,":[35,95],"which":[36],"has":[37,145],"only":[38],"recently":[39],"moved":[40],"from":[41],"simple":[43],"membrane":[44],"switch":[45],"arena":[46],"to":[47,85,125],"more":[49],"complex":[50],"demanding":[52],"realm":[53],"circuitry,":[55],"is":[56,128],"Innovative":[58],"combinations":[59],"advanced":[61],"polymeric":[62],"techniques":[65],"with":[66],"traditional":[67],"processes":[68],"have":[69],"made":[70],"PTF":[71],"a":[72],"leading-edge":[73],"interconnect":[74],"technology.":[75],"Several":[76],"new":[77],"directly":[82],"interconnecting":[83],"explored,":[89],"focusing":[90],"on":[91],"anisotropic":[92,138],"conductive":[93,110,139],"adhesive":[94,140],"both":[96],"tape":[98],"automated":[99],"(TAB)":[101],"flip-chip":[103],"strategies.":[105],"The":[106],"use":[107],"isotropically":[109],"nonconductive":[112],"agents":[115],"bare":[123],"die":[124],"boards":[127],"also":[129],"examined.":[130],"Although":[131],"some":[132],"these":[134],"technologies":[135],"remain":[136],"experimental,":[137],"electronic":[143],"reached":[146],"high-volume":[147],"production":[148],"status.>":[149]},"counts_by_year":[],"updated_date":"2026-10-12T09:40:04.860316","created_date":"2022-05-12T00:00:00"}