{"id":"https://openalex.org/W4232774254","doi":"https://doi.org/10.1115/msec_icmp2008-72514","title":"Spatially Resolved Characterization of Geometrically Necessary Dislocation Dependent Deformation in Micro-Scale Laser Shock Peening","display_name":"Spatially Resolved Characterization of Geometrically Necessary Dislocation Dependent Deformation in Micro-Scale Laser Shock Peening","publication_year":2008,"publication_date":"2008-01-01","ids":{"openalex":"https://openalex.org/W4232774254","doi":"https://doi.org/10.1115/msec_icmp2008-72514"},"language":"en","primary_location":{"id":"doi:10.1115/msec_icmp2008-72514","doi":"https://doi.org/10.1115/msec_icmp2008-72514","is_oa":false,"landing_page_url":"https://doi.org/10.1115/msec_icmp2008-72514","pdf_url":null,"source":{"id":"https://openalex.org/S4306503479","display_name":"ASME International Manufacturing Science and Engineering Conference (MSEC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ASME 2008 International Manufacturing Science and Engineering Conference, Volume 1","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5074501183","display_name":"Youneng Wang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I78577930","display_name":"Columbia University","ror":"https://ror.org/00hj8s172","country_code":"US","type":"education","lineage":["https://openalex.org/I78577930"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Youneng Wang","raw_affiliation_strings":["Columbia University, New York, NY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Columbia University, New York, NY","institution_ids":["https://openalex.org/I78577930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069642492","display_name":"Sini\u0161a Vukeli\u0107","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I78577930","display_name":"Columbia University","ror":"https://ror.org/00hj8s172","country_code":"US","type":"education","lineage":["https://openalex.org/I78577930"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sinisa Vukelic","raw_affiliation_strings":["Columbia University, New York, NY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Columbia University, New York, NY","institution_ids":["https://openalex.org/I78577930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084602377","display_name":"Jeffrey W. Kysar","orcid":"https://orcid.org/0000-0003-3655-1077","observed_orcids":["https://orcid.org/0000-0003-3655-1077"]},"institutions":[{"id":"https://openalex.org/I78577930","display_name":"Columbia University","ror":"https://ror.org/00hj8s172","country_code":"US","type":"education","lineage":["https://openalex.org/I78577930"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jeffrey W. Kysar","raw_affiliation_strings":["Columbia University, New York, NY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Columbia University, New York, NY","institution_ids":["https://openalex.org/I78577930"]}]},{"author_position":"last","author":{"id":null,"display_name":"Y. Lawrence Yao","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I78577930","display_name":"Columbia University","ror":"https://ror.org/00hj8s172","country_code":"US","type":"education","lineage":["https://openalex.org/I78577930"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Y. Lawrence Yao","raw_affiliation_strings":["Columbia University, New York, NY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Columbia University, New York, NY","institution_ids":["https://openalex.org/I78577930"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I78577930"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.47413442,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"293","last_page":"302"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12106","display_name":"Surface Treatment and Residual Stress","score":0.9878000020980835,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12106","display_name":"Surface Treatment and Residual Stress","score":0.9878000020980835,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10204","display_name":"Microstructure and mechanical properties","score":0.0027000000700354576,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10386","display_name":"Microstructure and Mechanical Properties of Steels","score":0.0019000000320374966,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/geometrically-necessary-dislocations","display_name":"geometrically necessary dislocations","score":0.996999979019165},{"id":"https://openalex.org/keywords/length-scale-effects","display_name":"length scale effects","score":0.722000002861023},{"id":"https://openalex.org/keywords/lattice-rotation","display_name":"lattice rotation","score":0.8830000162124634},{"id":"https://openalex.org/keywords/grain-anisotropy","display_name":"grain anisotropy","score":0.8510000109672546},{"id":"https://openalex.org/keywords/taylor-model","display_name":"Taylor model","score":0.722000002861023},{"id":"https://openalex.org/keywords/single-crystal-plasticity","display_name":"single crystal plasticity","score":0.9710000157356262},{"id":"https://openalex.org/keywords/finite-element-analysis","display_name":"finite element analysis","score":0.7919999957084656},{"id":"https://openalex.org/keywords/electron-backscatter-diffraction","display_name":"electron backscatter diffraction","score":0.8399999737739563}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8511519432067871},{"id":"https://openalex.org/C27805521","wikidata":"https://www.wikidata.org/wiki/Q1326017","display_name":"Electron backscatter diffraction","level":3,"score":0.7933655977249146},{"id":"https://openalex.org/C84566556","wikidata":"https://www.wikidata.org/wiki/Q484884","display_name":"Peening","level":3,"score":0.7700324058532715},{"id":"https://openalex.org/C79186407","wikidata":"https://www.wikidata.org/wiki/Q472074","display_name":"Plasticity","level":2,"score":0.6157017946243286},{"id":"https://openalex.org/C179428855","wikidata":"https://www.wikidata.org/wiki/Q1069216","display_name":"Microscale chemistry","level":2,"score":0.5354592800140381},{"id":"https://openalex.org/C44255700","wikidata":"https://www.wikidata.org/wiki/Q978423","display_name":"Hardening (computing)","level":3,"score":0.5241748690605164},{"id":"https://openalex.org/C541310201","wikidata":"https://www.wikidata.org/wiki/Q1791166","display_name":"Shot peening","level":3,"score":0.4814454913139343},{"id":"https://openalex.org/C2781300812","wikidata":"https://www.wikidata.org/wiki/Q178061","display_name":"Shock (circulatory)","level":2,"score":0.4532212018966675},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.4198988080024719},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.40426328778266907},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.3301161527633667},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.31276774406433105},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.09661811590194702},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09547227621078491},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C145420912","wikidata":"https://www.wikidata.org/wiki/Q853077","display_name":"Mathematics education","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C126322002","wikidata":"https://www.wikidata.org/wiki/Q11180","display_name":"Internal medicine","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1115/msec_icmp2008-72514","doi":"https://doi.org/10.1115/msec_icmp2008-72514","is_oa":false,"landing_page_url":"https://doi.org/10.1115/msec_icmp2008-72514","pdf_url":null,"source":{"id":"https://openalex.org/S4306503479","display_name":"ASME International Manufacturing Science and Engineering Conference (MSEC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ASME 2008 International Manufacturing Science and Engineering Conference, Volume 1","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2039009613","https://openalex.org/W2062183737","https://openalex.org/W2898469985","https://openalex.org/W7098008191","https://openalex.org/W1996508871","https://openalex.org/W2004183055","https://openalex.org/W2896910835","https://openalex.org/W2954139959","https://openalex.org/W2071982783","https://openalex.org/W2062162782"],"abstract_inverted_index":{"As":[0],"the":[1,12,19,34,51,56,59,76,89,96,110,124,138,146,150],"laser":[2,7,65],"spot":[3],"size":[4],"in":[5,11,42,63],"micro-scale":[6],"shock":[8,66],"peening":[9,67],"is":[10],"order":[13],"of":[14,16,22,33,123,137],"magnitude":[15],"several":[17],"microns,":[18],"anisotropic":[20],"response":[21],"grains":[23],"will":[24],"have":[25,68],"a":[26],"dominant":[27],"influence":[28],"on":[29,131],"its":[30],"mechanical":[31],"behavior":[32],"target":[35],"material.":[36],"Furthermore,":[37],"conventional":[38],"plasticity":[39],"theory":[40],"employed":[41],"previous":[43],"studies":[44],"needs":[45],"to":[46,50],"be":[47],"reexamined":[48],"due":[49],"length":[52,60],"scale":[53,61],"effect.":[54],"In":[55],"present":[57],"work,":[58],"effects":[62],"microscale":[64],"been":[69,100,153],"investigated.":[70],"The":[71,102],"crystal":[72,133],"lattice":[73],"rotation":[74],"underneath":[75],"shocked":[77],"surface":[78],"was":[79,106],"determined":[80],"via":[81],"Electron":[82],"Backscatter":[83],"Diffraction":[84],"(EBSD).":[85],"From":[86],"these":[87],"measurements,":[88],"geometrically":[90],"necessary":[91],"dislocations":[92],"(GND)":[93],"density":[94],"that":[95],"material":[97,121],"contains":[98],"has":[99,152],"estimated.":[101],"yield":[103],"strength":[104],"increment":[105],"then":[107],"calculated":[108],"from":[109],"GND":[111,147],"distribution":[112],"by":[113],"using":[114],"Taylor":[115],"model":[116],"and":[117,143,149],"integrated":[118],"into":[119],"each":[120],"point":[122],"FEM":[125],"simulation.":[126],"Finite":[127],"element":[128],"simulations,":[129],"based":[130],"single":[132],"plasticity,":[134],"were":[135],"performed":[136],"process":[139],"for":[140],"both":[141],"with":[142],"without":[144],"considering":[145],"hardening":[148],"comparison":[151],"conducted.":[154]},"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2026-10-14T16:39:01.820549","created_date":"2022-05-12T00:00:00"}