{"id":"https://openalex.org/W4210416331","doi":"https://doi.org/10.1115/imece2021-72040","title":"Micro Fin Array Configuration in Heat Transfer Enhancement in Mini-Channels","display_name":"Micro Fin Array Configuration in Heat Transfer Enhancement in Mini-Channels","publication_year":2021,"publication_date":"2021-11-01","ids":{"openalex":"https://openalex.org/W4210416331","doi":"https://doi.org/10.1115/imece2021-72040"},"language":"en","primary_location":{"id":"doi:10.1115/imece2021-72040","doi":"https://doi.org/10.1115/imece2021-72040","is_oa":false,"landing_page_url":"https://doi.org/10.1115/imece2021-72040","pdf_url":null,"source":{"id":"https://openalex.org/S4363606942","display_name":"ASME International Mechanical Engineering Congress and Exposition (IMECE)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Volume 11: Heat Transfer and Thermal Engineering","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5060395571","display_name":"Gerardo Carbajal","orcid":"https://orcid.org/0009-0009-8112-2838","observed_orcids":["https://orcid.org/0009-0009-8112-2838"]},"institutions":[{"id":"https://openalex.org/I32480017","display_name":"Florida Polytechnic University","ror":"https://ror.org/01e5mdj42","country_code":"US","type":"education","lineage":["https://openalex.org/I32480017"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gerardo Carbajal","raw_affiliation_strings":["Florida Polytechnic University, Lakeland, Florida, United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Florida Polytechnic University, Lakeland, Florida, United States","institution_ids":["https://openalex.org/I32480017"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001648767","display_name":"Colton Frear","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I32480017","display_name":"Florida Polytechnic University","ror":"https://ror.org/01e5mdj42","country_code":"US","type":"education","lineage":["https://openalex.org/I32480017"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Colton Frear","raw_affiliation_strings":["Florida Polytechnic University, Lakeland, Florida, United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Florida Polytechnic University, Lakeland, Florida, United States","institution_ids":["https://openalex.org/I32480017"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051885265","display_name":"Charisma Clarke","orcid":"https://orcid.org/0000-0002-7677-6003","observed_orcids":["https://orcid.org/0000-0002-7677-6003"]},"institutions":[{"id":"https://openalex.org/I32480017","display_name":"Florida Polytechnic University","ror":"https://ror.org/01e5mdj42","country_code":"US","type":"education","lineage":["https://openalex.org/I32480017"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Charisma Clarke","raw_affiliation_strings":["Florida Polytechnic University, Lakeland, Florida, United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Florida Polytechnic University, Lakeland, Florida, United States","institution_ids":["https://openalex.org/I32480017"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5043537329","display_name":"Edwar Romero-Ramirez","orcid":"https://orcid.org/0000-0002-4864-5911","observed_orcids":["https://orcid.org/0000-0002-4864-5911","https://orcid.org/0000-0003-1761-4909"]},"institutions":[{"id":"https://openalex.org/I32480017","display_name":"Florida Polytechnic University","ror":"https://ror.org/01e5mdj42","country_code":"US","type":"education","lineage":["https://openalex.org/I32480017"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Edwar Romero-Ramirez","raw_affiliation_strings":["Florida Polytechnic University, Lakeland, Florida, United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Florida Polytechnic University, Lakeland, Florida, United States","institution_ids":["https://openalex.org/I32480017"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I32480017"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11945","display_name":"Heat Transfer Mechanisms","score":0.004800000227987766,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.0034000000450760126,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/minichannels","display_name":"minichannels","score":0.7139999866485596},{"id":"https://openalex.org/keywords/heat-transfer-enhancement","display_name":"heat transfer enhancement","score":0.9829999804496765},{"id":"https://openalex.org/keywords/microchannel-cooling","display_name":"microchannel cooling","score":0.6439999938011169},{"id":"https://openalex.org/keywords/pressure-drop","display_name":"pressure drop","score":0.8090000152587891},{"id":"https://openalex.org/keywords/electronic-cooling","display_name":"electronics cooling","score":0.8550000190734863},{"id":"https://openalex.org/keywords/heat-removal-rate","display_name":"heat extraction rate","score":0.35899999737739563}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7843853235244751},{"id":"https://openalex.org/C63662833","wikidata":"https://www.wikidata.org/wiki/Q6839341","display_name":"Microchannel","level":2,"score":0.7656643390655518},{"id":"https://openalex.org/C114088122","wikidata":"https://www.wikidata.org/wiki/Q1261069","display_name":"Pressure drop","level":2,"score":0.6934506893157959},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.6370572447776794},{"id":"https://openalex.org/C172120300","wikidata":"https://www.wikidata.org/wiki/Q1134348","display_name":"Volumetric flow rate","level":2,"score":0.5834168195724487},{"id":"https://openalex.org/C16644385","wikidata":"https://www.wikidata.org/wiki/Q1327735","display_name":"Hydraulic diameter","level":4,"score":0.5481030941009521},{"id":"https://openalex.org/C168068576","wikidata":"https://www.wikidata.org/wiki/Q190241","display_name":"Thermocouple","level":2,"score":0.545068621635437},{"id":"https://openalex.org/C91721477","wikidata":"https://www.wikidata.org/wiki/Q778612","display_name":"Fin","level":2,"score":0.5243123769760132},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.5026202201843262},{"id":"https://openalex.org/C2777777821","wikidata":"https://www.wikidata.org/wiki/Q25111513","display_name":"Heat transfer enhancement","level":4,"score":0.4803149104118347},{"id":"https://openalex.org/C75892298","wikidata":"https://www.wikidata.org/wiki/Q1366187","display_name":"Mass flow rate","level":2,"score":0.4260503649711609},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.42336490750312805},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.3654558062553406},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.33115267753601074},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.32803186774253845},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.3221281170845032},{"id":"https://openalex.org/C29700514","wikidata":"https://www.wikidata.org/wiki/Q634340","display_name":"Heat transfer coefficient","level":3,"score":0.3164726197719574},{"id":"https://openalex.org/C182748727","wikidata":"https://www.wikidata.org/wiki/Q178932","display_name":"Reynolds number","level":3,"score":0.2990432381629944},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0932236909866333},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09050783514976501},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C196558001","wikidata":"https://www.wikidata.org/wiki/Q190132","display_name":"Turbulence","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1115/imece2021-72040","doi":"https://doi.org/10.1115/imece2021-72040","is_oa":false,"landing_page_url":"https://doi.org/10.1115/imece2021-72040","pdf_url":null,"source":{"id":"https://openalex.org/S4363606942","display_name":"ASME International Mechanical Engineering Congress and Exposition (IMECE)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Volume 11: Heat Transfer and Thermal Engineering","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4296885915","https://openalex.org/W2922277033","https://openalex.org/W4390638594","https://openalex.org/W2522056750","https://openalex.org/W2992738410","https://openalex.org/W4230314711","https://openalex.org/W4414165464","https://openalex.org/W1808478435","https://openalex.org/W7030337660","https://openalex.org/W4319588464"],"abstract_inverted_index":{"Abstract":[0],"An":[1],"experimental":[2,123,145],"study":[3,148],"was":[4,26,108,171],"conducted":[5,109],"on":[6,110],"a":[7,14,111],"novel":[8,67,135,168,189],"cooling":[9,21,154,202],"device":[10,114,136,190],"that":[11,54,187],"consists":[12],"of":[13,46,59,133],"rectangular":[15,158],"micro-fins":[16,159],"array":[17],"placed":[18],"inside":[19,160],"the":[20,32,42,47,55,60,89,94,101,120,129,134,139,144,153,161,167,181,193],"device.":[22,141,162],"A":[23,105],"unique":[24],"cover":[25],"designed":[27],"and":[28,37,39,44,77,82,91,97,200],"fabricated":[29],"to":[30,115,143,173],"allow":[31],"mass":[33],"flow":[34,75,103,165],"rate":[35,132,196],"in":[36,128,152,198],"out":[38],"for":[40,100],"measuring":[41],"temperature":[43,98],"pressure":[45,84,95],"fluid.":[48],"Scanning":[49],"electronic":[50,201],"microscope":[51],"measurements":[52],"showed":[53,125],"average":[56],"hydraulic":[57],"diameter":[58],"mini":[61,68],"channel":[62],"is":[63,185],"155":[64],"microns.":[65],"The":[66,122],"channels":[69],"were":[70],"tested":[71],"with":[72,119,138],"different":[73,102],"volume":[74],"rates":[76],"heat":[78,130,179,194],"inputs.":[79],"Two":[80],"thermocouples":[81],"two":[83],"transducer":[85],"sensors":[86],"installed":[87],"at":[88],"inlet":[90],"outlet":[92],"recorded":[93],"drop":[96],"difference":[99],"conditions.":[104],"similar":[106],"experiment":[107],"dummy":[112,140],"finless":[113,182],"compare":[116],"its":[117],"performance":[118],"minichannels.":[121],"results":[124],"an":[126,150],"improvement":[127,151],"transfer":[131,195],"compared":[137],"According":[142],"results,":[146],"this":[147,188],"revealed":[149],"process":[155],"by":[156],"having":[157],"For":[163],"constant":[164],"rates,":[166],"microchannel":[169],"design":[170],"able":[172],"remove":[174],"5.6":[175],"times":[176],"as":[177,180],"much":[178],"plate.":[183],"It":[184],"expected":[186],"may":[191],"increase":[192],"significantly":[197],"aerospace":[199],"applications.":[203]},"counts_by_year":[],"updated_date":"2026-11-01T11:40:01.658920","created_date":"2022-02-08T00:00:00"}