{"id":"https://openalex.org/W4206644397","doi":"https://doi.org/10.1109/iccca52192.2021.9666364","title":"Electric Stress Control Using Field-Grading Material Rings on Polymeric Insulators","display_name":"Electric Stress Control Using Field-Grading Material Rings on Polymeric Insulators","publication_year":2021,"publication_date":"2021-12-17","ids":{"openalex":"https://openalex.org/W4206644397","doi":"https://doi.org/10.1109/iccca52192.2021.9666364"},"language":"en","primary_location":{"id":"doi:10.1109/iccca52192.2021.9666364","doi":"https://doi.org/10.1109/iccca52192.2021.9666364","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccca52192.2021.9666364","pdf_url":null,"source":{"id":"https://openalex.org/S4306423450","display_name":"International Conference on Computing, Communication and Automation","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE 6th International Conference on Computing, Communication and Automation (ICCCA)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5063446054","display_name":"Ashok Narayan Tripathi","orcid":"https://orcid.org/0000-0003-1857-3619","observed_orcids":["https://orcid.org/0000-0003-1857-3619"]},"institutions":[{"id":"https://openalex.org/I94234084","display_name":"Indian Institute of Technology Kanpur","ror":"https://ror.org/05pjsgx75","country_code":"IN","type":"education","lineage":["https://openalex.org/I94234084"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Ashok Narayan Tripathi","raw_affiliation_strings":["Indian Institute of Technology Kanpur, Kanpur, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indian Institute of Technology Kanpur, Kanpur, India","institution_ids":["https://openalex.org/I94234084"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102300046","display_name":"Alok Ranjan Verma","orcid":"https://orcid.org/0000-0002-3789-0671","observed_orcids":["https://orcid.org/0000-0002-3789-0671"]},"institutions":[{"id":"https://openalex.org/I94234084","display_name":"Indian Institute of Technology Kanpur","ror":"https://ror.org/05pjsgx75","country_code":"IN","type":"education","lineage":["https://openalex.org/I94234084"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Alok Ranjan Verma","raw_affiliation_strings":["Indian Institute of Technology Kanpur, Kanpur, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indian Institute of Technology Kanpur, Kanpur, India","institution_ids":["https://openalex.org/I94234084"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I94234084"],"apc_list":null,"apc_paid":null,"fwci":1.9895,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.8734104,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":95},"biblio":{"volume":"4","issue":null,"first_page":"734","last_page":"737"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10511","display_name":"High voltage insulation and dielectric phenomena","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10511","display_name":"High voltage insulation and dielectric phenomena","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11608","display_name":"Dielectric materials and actuators","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14311","display_name":"Electrical and Electromagnetic Research","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/field-grading-materials","display_name":"field grading materials","score":0.8050000071525574},{"id":"https://openalex.org/keywords/composite-insulators","display_name":"composite insulators","score":0.871999979019165},{"id":"https://openalex.org/keywords/electric-field-distribution","display_name":"electric field distribution","score":0.5730000138282776},{"id":"https://openalex.org/keywords/partial-discharge","display_name":"partial discharge","score":0.4440000057220459}],"concepts":[{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.7875981330871582},{"id":"https://openalex.org/C60799052","wikidata":"https://www.wikidata.org/wiki/Q46221","display_name":"Electric field","level":2,"score":0.7218858599662781},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7097554206848145},{"id":"https://openalex.org/C212702","wikidata":"https://www.wikidata.org/wiki/Q178150","display_name":"Insulator (electricity)","level":2,"score":0.6122860908508301},{"id":"https://openalex.org/C158622935","wikidata":"https://www.wikidata.org/wiki/Q660848","display_name":"Nonlinear system","level":2,"score":0.516135573387146},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4520932137966156},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4114549160003662},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3590322732925415},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.2965157628059387},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2280149757862091},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12817752361297607},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccca52192.2021.9666364","doi":"https://doi.org/10.1109/iccca52192.2021.9666364","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccca52192.2021.9666364","pdf_url":null,"source":{"id":"https://openalex.org/S4306423450","display_name":"International Conference on Computing, Communication and Automation","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE 6th International Conference on Computing, Communication and Automation (ICCCA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.428600013256073}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1927675903","https://openalex.org/W1975000821","https://openalex.org/W2014882942","https://openalex.org/W2021054960","https://openalex.org/W2038656442","https://openalex.org/W2065903913","https://openalex.org/W2100304110","https://openalex.org/W2101956196","https://openalex.org/W2108689441","https://openalex.org/W2165304911","https://openalex.org/W2216340709","https://openalex.org/W2606646253","https://openalex.org/W2964584041","https://openalex.org/W2985476635","https://openalex.org/W3131312069","https://openalex.org/W3154895810"],"related_works":["https://openalex.org/W1876073474","https://openalex.org/W6987417680","https://openalex.org/W2504989984","https://openalex.org/W4226197640","https://openalex.org/W2323186819","https://openalex.org/W7147572710","https://openalex.org/W3145306015","https://openalex.org/W4382068899","https://openalex.org/W6889200719","https://openalex.org/W1487662106"],"abstract_inverted_index":{"Recently,":[0],"Field":[1],"grading":[2],"materials":[3],"(FGM)":[4],"have":[5],"been":[6],"finding":[7],"many":[8],"applications":[9],"for":[10,23,43],"electric":[11,26],"stress":[12,27,71],"control.":[13,72],"This":[14],"paper":[15],"deals":[16],"with":[17],"the":[18,25,29,36,54],"application":[19],"of":[20,56],"nonlinear":[21],"FGM":[22,50],"controlling":[24],"along":[28],"polymeric":[30,47],"insulator.":[31,48],"Numerical":[32],"simulations":[33],"based":[34],"on":[35,62],"finite":[37],"element":[38],"method":[39],"(FEM)":[40],"are":[41],"performed":[42],"a":[44],"66":[45],"kV":[46],"Here,":[49],"is":[51],"used":[52],"in":[53,65],"form":[55],"rings,":[57],"which":[58],"can":[59],"be":[60],"placed":[61],"insulators":[63],"already":[64],"operation.":[66],"Simulation":[67],"results":[68],"show":[69],"effective":[70]},"counts_by_year":[{"year":2023,"cited_by_count":2}],"updated_date":"2026-10-27T15:51:10.671819","created_date":"2022-01-25T00:00:00"}