{"id":"https://openalex.org/W4200292292","doi":"https://doi.org/10.3390/mi12121554","title":"A Thermopile Detector Based on Micro-Bridges for Heat Transfer","display_name":"A Thermopile Detector Based on Micro-Bridges for Heat Transfer","publication_year":2021,"publication_date":"2021-12-13","ids":{"openalex":"https://openalex.org/W4200292292","doi":"https://doi.org/10.3390/mi12121554","pmid":"https://pubmed.ncbi.nlm.nih.gov/34945404","pmcid":"https://www.ncbi.nlm.nih.gov/pmc/articles/8708090"},"language":"en","primary_location":{"id":"doi:10.3390/mi12121554","doi":"https://doi.org/10.3390/mi12121554","is_oa":true,"landing_page_url":"https://doi.org/10.3390/mi12121554","pdf_url":"https://www.mdpi.com/2072-666X/12/12/1554/pdf?version=1639400729","source":{"id":"https://openalex.org/S96702057","display_name":"Micromachines","issn_l":"2072-666X","issn":["2072-666X"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","doaj","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/2072-666X/12/12/1554/pdf?version=1639400729","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Na Zhou","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Na Zhou","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China","University of Chinese Academy of Sciences (UCAS), Beijing 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"University of Chinese Academy of Sciences (UCAS), Beijing 100029, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065044003","display_name":"Xuefeng Ding","orcid":"https://orcid.org/0000-0001-8803-320X","observed_orcids":["https://orcid.org/0000-0001-8803-320X"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Xuefeng Ding","raw_affiliation_strings":["Jiangsu Hinovaic Technologies Co., Ltd., Wuxi 214135, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangsu Hinovaic Technologies Co., Ltd., Wuxi 214135, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007393983","display_name":"Hongbo Li","orcid":"https://orcid.org/0000-0001-5649-6066","observed_orcids":["https://orcid.org/0000-0001-5649-6066"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hongbo Li","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China","University of Chinese Academy of Sciences (UCAS), Beijing 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"University of Chinese Academy of Sciences (UCAS), Beijing 100029, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022922045","display_name":"Yue Ni","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yue Ni","raw_affiliation_strings":["Jiangsu Hinovaic Technologies Co., Ltd., Wuxi 214135, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangsu Hinovaic Technologies Co., Ltd., Wuxi 214135, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061679468","display_name":"Yonglong Pu","orcid":"https://orcid.org/0009-0006-2199-937X","observed_orcids":["https://orcid.org/0009-0006-2199-937X"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yonglong Pu","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China","University of Chinese Academy of Sciences (UCAS), Beijing 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"University of Chinese Academy of Sciences (UCAS), Beijing 100029, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101631234","display_name":"Haiyang Mao","orcid":"https://orcid.org/0000-0001-5620-2910","observed_orcids":["https://orcid.org/0000-0001-5620-2910","https://orcid.org/0000-0001-9713-5144"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Haiyang Mao","raw_affiliation_strings":["Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China","Jiangsu Hinovaic Technologies Co., Ltd., Wuxi 214135, China","University of Chinese Academy of Sciences (UCAS), Beijing 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Jiangsu Hinovaic Technologies Co., Ltd., Wuxi 214135, China","institution_ids":[]},{"raw_affiliation_string":"University of Chinese Academy of Sciences (UCAS), Beijing 100029, China","institution_ids":["https://openalex.org/I4210165038"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5101631234"],"corresponding_institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392","https://openalex.org/I4210165038"],"apc_list":{"value":1800,"currency":"CHF","value_usd":1944},"apc_paid":{"value":1800,"currency":"CHF","value_usd":1944},"fwci":0.2938,"has_fulltext":true,"cited_by_count":6,"citation_normalized_percentile":{"value":0.47555791,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":"12","issue":"12","first_page":"1554","last_page":"1554"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9750999808311462,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9750999808311462,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.009200000204145908,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.007199999876320362,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermopile-detectors","display_name":"thermopile sensors","score":0.9940000176429749},{"id":"https://openalex.org/keywords/microbridges","display_name":"microbridges","score":0.9620000123977661},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"heat transfer","score":0.6660000085830688},{"id":"https://openalex.org/keywords/cmos-fabrication","display_name":"CMOS fabrication","score":0.5580000281333923},{"id":"https://openalex.org/keywords/thermal-devices","display_name":"thermal devices","score":0.3619999885559082},{"id":"https://openalex.org/keywords/output-voltage-enhancement","display_name":"output voltage enhancement","score":0.6919999718666077}],"concepts":[{"id":"https://openalex.org/C47279676","wikidata":"https://www.wikidata.org/wiki/Q915693","display_name":"Thermopile","level":3,"score":0.9960323572158813},{"id":"https://openalex.org/C168068576","wikidata":"https://www.wikidata.org/wiki/Q190241","display_name":"Thermocouple","level":2,"score":0.8407497406005859},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6792721748352051},{"id":"https://openalex.org/C94915269","wikidata":"https://www.wikidata.org/wiki/Q1834857","display_name":"Detector","level":2,"score":0.6514226198196411},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5747323036193848},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.46654462814331055},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.4387659430503845},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.43761202692985535},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.32393938302993774},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.300226628780365},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.2425996959209442},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2107793092727661},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16605272889137268},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07010748982429504},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C158355884","wikidata":"https://www.wikidata.org/wiki/Q11388","display_name":"Infrared","level":2,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.3390/mi12121554","doi":"https://doi.org/10.3390/mi12121554","is_oa":true,"landing_page_url":"https://doi.org/10.3390/mi12121554","pdf_url":"https://www.mdpi.com/2072-666X/12/12/1554/pdf?version=1639400729","source":{"id":"https://openalex.org/S96702057","display_name":"Micromachines","issn_l":"2072-666X","issn":["2072-666X"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","doaj","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines","raw_type":"journal-article"},{"id":"pmh:oai:pubmedcentral.nih.gov:8708090","doi":null,"is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/8708090","pdf_url":null,"source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines (Basel)","raw_type":"Text"},{"id":"pmid:34945404","doi":null,"is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/34945404","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines","raw_type":"Journal Article"},{"id":"pmh:oai:doaj.org/article:4d5a13acccdd42bba7315601d1e8f6eb","doi":null,"is_oa":true,"landing_page_url":"https://doaj.org/article/4d5a13acccdd42bba7315601d1e8f6eb","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Micromachines, Vol 12, Iss 12, p 1554 (2021)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.3390/mi12121554","doi":"https://doi.org/10.3390/mi12121554","is_oa":true,"landing_page_url":"https://doi.org/10.3390/mi12121554","pdf_url":"https://www.mdpi.com/2072-666X/12/12/1554/pdf?version=1639400729","source":{"id":"https://openalex.org/S96702057","display_name":"Micromachines","issn_l":"2072-666X","issn":["2072-666X"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","doaj","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Micromachines","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.651199996471405,"id":"https://metadata.un.org/sdg/9"}],"study_designs":[],"awards":[{"id":"https://openalex.org/G165142878","display_name":null,"funder_award_id":"2018153","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G1676378711","display_name":null,"funder_award_id":"2019B010117001","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G1806951345","display_name":null,"funder_award_id":"61771467","funder_id":"https://openalex.org/F4320322847","funder_display_name":"Youth Innovation Promotion Association of the Chinese Academy of Sciences"},{"id":"https://openalex.org/G2270267393","display_name":null,"funder_award_id":"2019B010117001","funder_id":"https://openalex.org/F4320322847","funder_display_name":"Youth Innovation Promotion Association of the Chinese Academy of Sciences"},{"id":"https://openalex.org/G6094177462","display_name":"\u590d\u5408\u7eb3\u7c73\u68ee\u6797\u7684\u7b49\u79bb\u6fc0\u5143\u591a\u91cd\u6742\u5316\u5149\u5438\u6536\u7279\u6027\u57fa\u7840\u7814\u7a76","funder_award_id":"61771467","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G616983396","display_name":null,"funder_award_id":"2018153","funder_id":"https://openalex.org/F4320322847","funder_display_name":"Youth Innovation Promotion Association of the Chinese Academy of Sciences"},{"id":"https://openalex.org/G7490089330","display_name":null,"funder_award_id":"2018153","funder_id":"https://openalex.org/F4320335892","funder_display_name":"Youth Innovation Promotion Association"},{"id":"https://openalex.org/G8977752878","display_name":null,"funder_award_id":"2018153","funder_id":"https://openalex.org/F4320321133","funder_display_name":"Chinese Academy of Sciences"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320321133","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35"},{"id":"https://openalex.org/F4320322847","display_name":"Youth Innovation Promotion Association of the Chinese Academy of Sciences","ror":"https://ror.org/031141b54"},{"id":"https://openalex.org/F4320335892","display_name":"Youth Innovation Promotion Association","ror":null}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4200292292.pdf","grobid_xml":"https://content.openalex.org/works/W4200292292.grobid-xml"},"referenced_works_count":30,"referenced_works":["https://openalex.org/W1591983163","https://openalex.org/W1681511557","https://openalex.org/W1974294660","https://openalex.org/W2025187827","https://openalex.org/W2028334974","https://openalex.org/W2049582610","https://openalex.org/W2051793518","https://openalex.org/W2052689493","https://openalex.org/W2066350383","https://openalex.org/W2091122494","https://openalex.org/W2160477414","https://openalex.org/W2168766227","https://openalex.org/W2169581025","https://openalex.org/W2176294143","https://openalex.org/W2606822161","https://openalex.org/W2625887608","https://openalex.org/W2894669287","https://openalex.org/W2901033713","https://openalex.org/W2995591055","https://openalex.org/W3006410386","https://openalex.org/W3025322823","https://openalex.org/W3044018636","https://openalex.org/W3082298881","https://openalex.org/W3088113090","https://openalex.org/W3128734034","https://openalex.org/W3137322559","https://openalex.org/W3163694130","https://openalex.org/W3163849302","https://openalex.org/W3175161513","https://openalex.org/W3199968177"],"related_works":["https://openalex.org/W2030086548","https://openalex.org/W1982074144","https://openalex.org/W4282587081","https://openalex.org/W2169546617","https://openalex.org/W2004020593","https://openalex.org/W4300822632","https://openalex.org/W2130805504","https://openalex.org/W1497220320","https://openalex.org/W2051304327","https://openalex.org/W1827283694"],"abstract_inverted_index":{"A":[0],"thermopile":[1,17,61,115],"detector":[2,18],"with":[3,59],"their":[4],"thermocouples":[5],"distributed":[6],"in":[7,13,97,101],"micro-bridges":[8,36],"is":[9,94],"designed":[10],"and":[11,48,89,117],"investigated":[12],"this":[14],"work.":[15],"The":[16,35],"consists":[19],"of":[20,23,74],"16":[21],"pairs":[22],"n-poly-Si/p-poly-Si":[24],"thermocouples,":[25],"which":[26],"are":[27,37],"fabricated":[28],"using":[29,63],"a":[30,60,64,82,95],"low-cost,":[31],"high-throughput":[32],"CMOS":[33],"process.":[34],"realized":[38],"by":[39,78],"forming":[40],"micro":[41],"trenches":[42],"at":[43,54],"the":[44,51,55,67,75,87,102],"front":[45],"side":[46],"first":[47],"then":[49],"releasing":[50],"silicon":[52],"substrate":[53],"back":[56],"side.":[57],"Compared":[58],"device":[62],"continuous":[65],"membrane,":[66],"micro-bridge-based":[68],"one":[69],"can":[70],"achieve":[71],"an":[72,109],"improvement":[73],"output":[76],"voltage":[77],"13.8%":[79],"due":[80],"to":[81],"higher":[83],"temperature":[84],"difference":[85],"between":[86],"hot":[88],"cold":[90],"junctions":[91],"as":[92],"there":[93],"decrease":[96],"thermal":[98,119],"conduction":[99],"loss":[100],"partially":[103],"hollowed":[104],"structure.":[105],"This":[106],"technique":[107],"provides":[108],"effective":[110],"way":[111],"for":[112],"developing":[113],"high-performance":[114],"detectors":[116],"other":[118],"devices.":[120]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1}],"updated_date":"2026-10-28T10:33:24.094632","created_date":"2021-12-31T00:00:00"}