{"id":"https://openalex.org/W356254541","doi":"https://doi.org/10.11491/scej.2008.0.202.0","title":"\u9178\u5316\u9084\u5143\u3092\u5229\u7528\u3057\u305fULSI-Cu\u914d\u7dda\u5f62\u6210\u7528CVD\u30d7\u30ed\u30bb\u30b9\u306e\u901f\u5ea6\u8ad6 (2)","display_name":"\u9178\u5316\u9084\u5143\u3092\u5229\u7528\u3057\u305fULSI-Cu\u914d\u7dda\u5f62\u6210\u7528CVD\u30d7\u30ed\u30bb\u30b9\u306e\u901f\u5ea6\u8ad6 (2)","publication_year":2008,"publication_date":"2008-01-01","ids":{"openalex":"https://openalex.org/W356254541","doi":"https://doi.org/10.11491/scej.2008.0.202.0","mag":"356254541"},"language":"ja","primary_location":{"id":"mag:356254541","doi":"https://doi.org/10.11491/scej.2008.0.202.0","is_oa":false,"landing_page_url":"http://ci.nii.ac.jp/naid/130004665946","pdf_url":null,"source":{"id":"https://openalex.org/S4306544486","display_name":"\u5316\u5b66\u5de5\u5b66\u4f1a\u3000\u7814\u7a76\u767a\u8868\u8b1b\u6f14\u8981\u65e8\u96c6 \u5316\u5b66\u5de5\u5b66\u4f1a\u7b2c73\u5e74\u4f1a","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"\u5316\u5b66\u5de5\u5b66\u4f1a\u3000\u7814\u7a76\u767a\u8868\u8b1b\u6f14\u8981\u65e8\u96c6 \u5316\u5b66\u5de5\u5b66\u4f1a\u7b2c73\u5e74\u4f1a","raw_type":null},"volume":null,"type":"article","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5050281003","display_name":"\u572d\u96c4 \u9808\u4f50","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"\u572d\u96c4 \u9808\u4f50","raw_affiliation_strings":["\u6771\u5927\u9662(\u5de5)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"\u6771\u5927\u9662(\u5de5)","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030516709","display_name":"\u5e78\u6d69 \u971c\u57a3","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"\u5e78\u6d69 \u971c\u57a3","raw_affiliation_strings":["\u6771\u5927\u9662(\u5de5)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"\u6771\u5927\u9662(\u5de5)","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"2008","issue":null,"first_page":"202","last_page":"202"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9901999831199646,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9901999831199646,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.006500000134110451,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11907","display_name":"Copper-based nanomaterials and applications","score":0.000699999975040555,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ulsi","display_name":"ULSI","score":0.6819999814033508},{"id":"https://openalex.org/keywords/copper-interconnects","display_name":"copper interconnects","score":0.8799999952316284},{"id":"https://openalex.org/keywords/cvd-deposition","display_name":"CVD deposition","score":0.6430000066757202},{"id":"https://openalex.org/keywords/reduction-oxidation","display_name":"reduction-oxidation","score":0.6050000190734863},{"id":"https://openalex.org/keywords/reaction-kinetics","display_name":"reaction kinetics","score":0.7369999885559082}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3218199610710144}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:356254541","doi":"https://doi.org/10.11491/scej.2008.0.202.0","is_oa":false,"landing_page_url":"http://ci.nii.ac.jp/naid/130004665946","pdf_url":null,"source":{"id":"https://openalex.org/S4306544486","display_name":"\u5316\u5b66\u5de5\u5b66\u4f1a\u3000\u7814\u7a76\u767a\u8868\u8b1b\u6f14\u8981\u65e8\u96c6 \u5316\u5b66\u5de5\u5b66\u4f1a\u7b2c73\u5e74\u4f1a","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"\u5316\u5b66\u5de5\u5b66\u4f1a\u3000\u7814\u7a76\u767a\u8868\u8b1b\u6f14\u8981\u65e8\u96c6 \u5316\u5b66\u5de5\u5b66\u4f1a\u7b2c73\u5e74\u4f1a","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W261166970","https://openalex.org/W3027019592","https://openalex.org/W7053244458","https://openalex.org/W2748665487","https://openalex.org/W3163845767","https://openalex.org/W561551276","https://openalex.org/W4247970892","https://openalex.org/W7146055161","https://openalex.org/W623353952","https://openalex.org/W117412843"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-10-12T09:40:04.860316","created_date":"2016-06-24T00:00:00"}