{"id":"https://openalex.org/W325486","doi":"https://doi.org/10.1007/978-1-4684-8205-8_44","title":"Relationship Between Densification and High Temperature Mechanical Properties of HIPed Silicon Nitride","display_name":"Relationship Between Densification and High Temperature Mechanical Properties of HIPed Silicon Nitride","publication_year":1984,"publication_date":"1984-01-01","ids":{"openalex":"https://openalex.org/W325486","doi":"https://doi.org/10.1007/978-1-4684-8205-8_44","mag":"325486"},"language":"en","primary_location":{"id":"doi:10.1007/978-1-4684-8205-8_44","doi":"https://doi.org/10.1007/978-1-4684-8205-8_44","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-1-4684-8205-8_44","pdf_url":null,"source":{"id":"https://openalex.org/S4306463937","display_name":"Springer eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Emergent Process Methods for High-Technology Ceramics","raw_type":"book-chapter"},"volume":{"id":"https://openalex.org/W1582111906","display_name":"Emergent Process Methods for High-Technology Ceramics"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5065593368","display_name":"Roger R. Wills","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1325736334","display_name":"Battelle","ror":"https://ror.org/01h5tnr73","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I1325736334"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. R. Wills","raw_affiliation_strings":["Battelle, Columbus Laboratories, 505 King Avenue, 43201, Columbus, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Battelle, Columbus Laboratories, 505 King Avenue, 43201, Columbus, Ohio, USA","institution_ids":["https://openalex.org/I1325736334"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030582693","display_name":"Molly C. Brockway","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1325736334","display_name":"Battelle","ror":"https://ror.org/01h5tnr73","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I1325736334"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. C. Brockway","raw_affiliation_strings":["Battelle, Columbus Laboratories, 505 King Avenue, 43201, Columbus, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Battelle, Columbus Laboratories, 505 King Avenue, 43201, Columbus, Ohio, USA","institution_ids":["https://openalex.org/I1325736334"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072825055","display_name":"Girraj K. Bansal","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1325736334","display_name":"Battelle","ror":"https://ror.org/01h5tnr73","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I1325736334"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. K. Bansal","raw_affiliation_strings":["Battelle, Columbus Laboratories, 505 King Avenue, 43201, Columbus, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Battelle, Columbus Laboratories, 505 King Avenue, 43201, Columbus, Ohio, USA","institution_ids":["https://openalex.org/I1325736334"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I1325736334"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"597","last_page":"607"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10840","display_name":"High Temperature Alloys and Creep","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/silicon-nitride","display_name":"silicon nitride","score":0.9279999732971191},{"id":"https://openalex.org/keywords/hot-isostatic-pressing","display_name":"hot isostatic pressing","score":0.9739999771118164},{"id":"https://openalex.org/keywords/densification","display_name":"densification","score":0.9869999885559082},{"id":"https://openalex.org/keywords/high-temperature-mechanical-properties","display_name":"high-temperature mechanical properties","score":0.890999972820282},{"id":"https://openalex.org/keywords/creep-resistance","display_name":"creep resistance","score":0.7950000166893005},{"id":"https://openalex.org/keywords/subcritical-crack-growth","display_name":"subcritical crack growth","score":0.9670000076293945}],"concepts":[{"id":"https://openalex.org/C2777431650","wikidata":"https://www.wikidata.org/wiki/Q413828","display_name":"Silicon nitride","level":3,"score":0.8586651682853699},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8375383615493774},{"id":"https://openalex.org/C194760766","wikidata":"https://www.wikidata.org/wiki/Q410851","display_name":"Nitride","level":3,"score":0.7184512615203857},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.6584131717681885},{"id":"https://openalex.org/C96410337","wikidata":"https://www.wikidata.org/wiki/Q4383445","display_name":"Yttria-stabilized zirconia","level":4,"score":0.5821363925933838},{"id":"https://openalex.org/C149912024","wikidata":"https://www.wikidata.org/wiki/Q462188","display_name":"Creep","level":2,"score":0.5818544626235962},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.553739070892334},{"id":"https://openalex.org/C2779476251","wikidata":"https://www.wikidata.org/wiki/Q7515030","display_name":"Silicon oxynitride","level":4,"score":0.5336808562278748},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5254230499267578},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4970414936542511},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3514491021633148},{"id":"https://openalex.org/C123609680","wikidata":"https://www.wikidata.org/wiki/Q225666","display_name":"Cubic zirconia","level":3,"score":0.05717802047729492},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.049155741930007935},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/978-1-4684-8205-8_44","doi":"https://doi.org/10.1007/978-1-4684-8205-8_44","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-1-4684-8205-8_44","pdf_url":null,"source":{"id":"https://openalex.org/S4306463937","display_name":"Springer eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Emergent Process Methods for High-Technology Ceramics","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1524326454","https://openalex.org/W1525578379","https://openalex.org/W1605635201","https://openalex.org/W1969577350","https://openalex.org/W1977489885","https://openalex.org/W2029563950","https://openalex.org/W2044431154","https://openalex.org/W2048895643","https://openalex.org/W2060681650","https://openalex.org/W2063519976","https://openalex.org/W2067086824","https://openalex.org/W2074407912","https://openalex.org/W2084018953","https://openalex.org/W2156110994","https://openalex.org/W2327244342"],"related_works":["https://openalex.org/W71650149","https://openalex.org/W2951022498","https://openalex.org/W4210344758","https://openalex.org/W7061427219","https://openalex.org/W2041557609","https://openalex.org/W2057368463","https://openalex.org/W272245055","https://openalex.org/W4248242964","https://openalex.org/W2136150786","https://openalex.org/W7027854450"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-10-10T09:11:00.788812","created_date":"2016-06-24T00:00:00"}