{"id":"https://openalex.org/W3209195692","doi":"https://doi.org/10.1109/icept52650.2021.9567999","title":"Modeling and Simulation of Interconnection Structure Compensation Design in High-speed Modules","display_name":"Modeling and Simulation of Interconnection Structure Compensation Design in High-speed Modules","publication_year":2021,"publication_date":"2021-09-14","ids":{"openalex":"https://openalex.org/W3209195692","doi":"https://doi.org/10.1109/icept52650.2021.9567999","mag":"3209195692"},"language":"en","primary_location":{"id":"doi:10.1109/icept52650.2021.9567999","doi":"https://doi.org/10.1109/icept52650.2021.9567999","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icept52650.2021.9567999","pdf_url":null,"source":{"id":"https://openalex.org/S4363607763","display_name":"International Conference on Electronic Packaging Technology (ICEPT)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 22nd International Conference on Electronic Packaging Technology (ICEPT)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5082450653","display_name":"Qi Zheng","orcid":"https://orcid.org/0000-0001-9807-6860","observed_orcids":["https://orcid.org/0000-0001-9807-6860"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qi Zheng","raw_affiliation_strings":["Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012150505","display_name":"Huimin He","orcid":"https://orcid.org/0000-0003-1992-1750","observed_orcids":["https://orcid.org/0000-0003-1992-1750"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Huimin He","raw_affiliation_strings":["Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056342256","display_name":"Lijuan Bai","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lijuan Bai","raw_affiliation_strings":["Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100383184","display_name":"Y\u00fcbo Wang","orcid":"https://orcid.org/0000-0002-2708-3526","observed_orcids":["https://orcid.org/0000-0002-2708-3526","https://orcid.org/0000-0001-8248-8959","https://orcid.org/0009-0000-2206-7562","https://orcid.org/0009-0001-3677-5479","https://orcid.org/0009-0001-5292-4593"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yubo Wang","raw_affiliation_strings":["Beijing smartchip microelectronics technology company limited, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing smartchip microelectronics technology company limited, Beijing, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100712057","display_name":"Dejian Li","orcid":"https://orcid.org/0009-0001-0547-2264","observed_orcids":["https://orcid.org/0009-0001-0547-2264","https://orcid.org/0000-0002-7875-5986","https://orcid.org/0000-0001-5733-1124"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dejian Li","raw_affiliation_strings":["Beijing smartchip microelectronics technology company limited, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing smartchip microelectronics technology company limited, Beijing, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014449601","display_name":"Shunfeng Han","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Shunfeng Han","raw_affiliation_strings":["Beijing smartchip microelectronics technology company limited, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing smartchip microelectronics technology company limited, Beijing, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018236481","display_name":"Bofu Li","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Bofu Li","raw_affiliation_strings":["Beijing smartchip microelectronics technology company limited, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing smartchip microelectronics technology company limited, Beijing, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038281170","display_name":"Dameng Li","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dameng Li","raw_affiliation_strings":["Beijing smartchip microelectronics technology company limited, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing smartchip microelectronics technology company limited, Beijing, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075413332","display_name":"Fengman Liu","orcid":"https://orcid.org/0000-0002-3579-1151","observed_orcids":["https://orcid.org/0000-0002-3579-1151","https://orcid.org/0000-0001-5134-3079"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fengman Liu","raw_affiliation_strings":["Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5055266571","display_name":"Liqiang Cao","orcid":"https://orcid.org/0000-0002-5772-0151","observed_orcids":["https://orcid.org/0000-0002-5772-0151"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liqiang Cao","raw_affiliation_strings":["Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.7737,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.63864171,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.6929000020027161,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.6929000020027161,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.10040000081062317,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.04039999842643738,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/optical-module","display_name":"optical module","score":0.7820000052452087},{"id":"https://openalex.org/keywords/interconnect-structures","display_name":"interconnect structures","score":0.5609999895095825},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"signal integrity","score":0.9350000023841858},{"id":"https://openalex.org/keywords/gold-wire-bonding","display_name":"gold wire bonding","score":0.8289999961853027},{"id":"https://openalex.org/keywords/inductive-compensation","display_name":"inductive compensation","score":0.7590000033378601},{"id":"https://openalex.org/keywords/capacitive-compensation","display_name":"capacitive compensation","score":1.0},{"id":"https://openalex.org/keywords/low-pass-filter","display_name":"low-pass filter","score":0.7590000033378601},{"id":"https://openalex.org/keywords/pcb-substrate","display_name":"PCB substrate","score":0.6299999952316284}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7798326015472412},{"id":"https://openalex.org/C2780023022","wikidata":"https://www.wikidata.org/wiki/Q1338171","display_name":"Compensation (psychology)","level":2,"score":0.7748777866363525},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5761929154396057},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.4824591279029846},{"id":"https://openalex.org/C106131492","wikidata":"https://www.wikidata.org/wiki/Q3072260","display_name":"Filter (signal processing)","level":2,"score":0.47549447417259216},{"id":"https://openalex.org/C33441834","wikidata":"https://www.wikidata.org/wiki/Q693004","display_name":"Transmission line","level":2,"score":0.4726395010948181},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.45986151695251465},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.43571534752845764},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.42844030261039734},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.42303037643432617},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.42293494939804077},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.4111185073852539},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.34653934836387634},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.27997612953186035},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27237600088119507},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.16523408889770508},{"id":"https://openalex.org/C11171543","wikidata":"https://www.wikidata.org/wiki/Q41630","display_name":"Psychoanalysis","level":1,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icept52650.2021.9567999","doi":"https://doi.org/10.1109/icept52650.2021.9567999","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icept52650.2021.9567999","pdf_url":null,"source":{"id":"https://openalex.org/S4363607763","display_name":"International Conference on Electronic Packaging Technology (ICEPT)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 22nd International Conference on Electronic Packaging Technology (ICEPT)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5378999710083008,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2097421090","https://openalex.org/W2123094459","https://openalex.org/W2153589554","https://openalex.org/W2156848499","https://openalex.org/W2785540003","https://openalex.org/W2905232448","https://openalex.org/W3088654340"],"related_works":["https://openalex.org/W4327759330","https://openalex.org/W2785540003","https://openalex.org/W6984864744","https://openalex.org/W4391895181","https://openalex.org/W4295038576","https://openalex.org/W4415003530","https://openalex.org/W2149859114","https://openalex.org/W2925472418","https://openalex.org/W2030489087","https://openalex.org/W4385624979"],"abstract_inverted_index":{"As":[0],"a":[1,20],"basic":[2],"component":[3],"of":[4,10,27,52,83],"optical":[5,11,32],"communication":[6],"network,":[7],"the":[8,24,50,67,71,81,84],"speed":[9],"modules":[12],"is":[13,58,64],"evolving":[14],"towards":[15],"56G":[16],"bit/s,":[17],"which":[18],"brings":[19],"great":[21],"challenge":[22],"to":[23],"signal":[25],"integrity":[26],"interconnect":[28],"structures.":[29],"At":[30],"present,":[31],"chip":[33],"and":[34],"PCB":[35],"board":[36],"or":[37],"substrate":[38],"are":[39],"interconnected":[40],"mainly":[41],"through":[42],"gold":[43],"wire":[44,47],"bonding.":[45],"Gold":[46],"bonding":[48],"has":[49],"property":[51],"low":[53,75],"pass.":[54],"The":[55],"compensation":[56,69,73],"method":[57],"studied":[59],"in":[60],"this":[61],"paper.":[62],"It":[63],"confirmed":[65],"that":[66],"inductive":[68],"after":[70],"capacitive":[72],"using":[74],"pass":[76],"filter":[77],"theory":[78],"can":[79],"improve":[80],"performance":[82],"transmission":[85],"line.":[86]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2022,"cited_by_count":2}],"updated_date":"2026-10-05T09:50:58.205359","created_date":"2021-11-08T00:00:00"}