{"id":"https://openalex.org/W3200765626","doi":"https://doi.org/10.1016/j.mtcomm.2021.102772","title":"The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach","display_name":"The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach","publication_year":2021,"publication_date":"2021-09-10","ids":{"openalex":"https://openalex.org/W3200765626","doi":"https://doi.org/10.1016/j.mtcomm.2021.102772","mag":"3200765626"},"language":"en","primary_location":{"id":"doi:10.1016/j.mtcomm.2021.102772","doi":"https://doi.org/10.1016/j.mtcomm.2021.102772","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mtcomm.2021.102772","pdf_url":null,"source":{"id":"https://openalex.org/S2765035490","display_name":"Materials Today Communications","issn_l":"2352-4928","issn":["2352-4928"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Today Communications","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100704607","display_name":"Yong-Jae Kim","orcid":"https://orcid.org/0000-0001-5377-1851","observed_orcids":["https://orcid.org/0000-0001-5377-1851"]},"institutions":[{"id":"https://openalex.org/I191879574","display_name":"Inha University","ror":"https://ror.org/01easw929","country_code":"KR","type":"education","lineage":["https://openalex.org/I191879574"]},{"id":"https://openalex.org/I4405285765","display_name":"Joining and Welding Research Institute, The University of Osaka","ror":"https://ror.org/006xm6j14","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4405285765","https://openalex.org/I98285908"]}],"countries":["JP","KR"],"is_corresponding":false,"raw_author_name":"Yong-Jae Kim","raw_affiliation_strings":["Department of Materials Science and Engineering, Inha University, Incheon 22212, Republic of Korea","Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, Inha University, Incheon 22212, Republic of Korea","institution_ids":["https://openalex.org/I191879574"]},{"raw_affiliation_string":"Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan","institution_ids":["https://openalex.org/I4405285765"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075281813","display_name":"Byung\u2010Ho Park","orcid":"https://orcid.org/0000-0002-6818-6687","observed_orcids":["https://orcid.org/0000-0002-6818-6687"]},"institutions":[{"id":"https://openalex.org/I4405285765","display_name":"Joining and Welding Research Institute, The University of Osaka","ror":"https://ror.org/006xm6j14","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4405285765","https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Byung-Ho Park","raw_affiliation_strings":["Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan","institution_ids":["https://openalex.org/I4405285765"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016813508","display_name":"Soong\u2010Keun Hyun","orcid":"https://orcid.org/0000-0002-3434-8465","observed_orcids":["https://orcid.org/0000-0002-3434-8465"]},"institutions":[{"id":"https://openalex.org/I191879574","display_name":"Inha University","ror":"https://ror.org/01easw929","country_code":"KR","type":"education","lineage":["https://openalex.org/I191879574"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Soong-Keun Hyun","raw_affiliation_strings":["Department of Materials Science and Engineering, Inha University, Incheon 22212, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, Inha University, Incheon 22212, Republic of Korea","institution_ids":["https://openalex.org/I191879574"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5089636779","display_name":"Hiroshi Nishikawa","orcid":"https://orcid.org/0000-0002-4363-9520","observed_orcids":["https://orcid.org/0000-0002-4363-9520"]},"institutions":[{"id":"https://openalex.org/I4405285765","display_name":"Joining and Welding Research Institute, The University of Osaka","ror":"https://ror.org/006xm6j14","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4405285765","https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Hiroshi Nishikawa","raw_affiliation_strings":["Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan","institution_ids":["https://openalex.org/I4405285765"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5016813508","https://openalex.org/A5089636779"],"corresponding_institution_ids":["https://openalex.org/I191879574","https://openalex.org/I4405285765"],"apc_list":{"value":2000,"currency":"USD","value_usd":2000},"apc_paid":null,"fwci":2.1297,"has_fulltext":false,"cited_by_count":52,"citation_normalized_percentile":{"value":0.87945343,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":96,"max":99},"biblio":{"volume":"29","issue":null,"first_page":"102772","last_page":"102772"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.8295999765396118,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.8295999765396118,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.13930000364780426,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.004100000020116568,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/die-attach","display_name":"die attach","score":0.9580000042915344},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.9950000047683716},{"id":"https://openalex.org/keywords/porosity","display_name":"porosity","score":0.9980000257492065},{"id":"https://openalex.org/keywords/pore-shape","display_name":"pore shape","score":0.9660000205039978},{"id":"https://openalex.org/keywords/pore-size","display_name":"pore size","score":0.9679999947547913},{"id":"https://openalex.org/keywords/sintering-temperature","display_name":"sintering temperature","score":0.9739999771118164}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.9468727707862854},{"id":"https://openalex.org/C2777581544","wikidata":"https://www.wikidata.org/wiki/Q844613","display_name":"Sintering","level":2,"score":0.915289044380188},{"id":"https://openalex.org/C6648577","wikidata":"https://www.wikidata.org/wiki/Q622669","display_name":"Porosity","level":2,"score":0.9023752212524414},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.8616642951965332},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6685686111450195},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.6612021923065186},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4376770257949829},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.06804880499839783},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C170154142","wikidata":"https://www.wikidata.org/wiki/Q150737","display_name":"Architectural engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.mtcomm.2021.102772","doi":"https://doi.org/10.1016/j.mtcomm.2021.102772","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mtcomm.2021.102772","pdf_url":null,"source":{"id":"https://openalex.org/S2765035490","display_name":"Materials Today Communications","issn_l":"2352-4928","issn":["2352-4928"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Today Communications","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G8027163069","display_name":null,"funder_award_id":"P0008750","funder_id":"https://openalex.org/F4320321681","funder_display_name":"Ministry of Trade, Industry and Energy"}],"funders":[{"id":"https://openalex.org/F4320321681","display_name":"Ministry of Trade, Industry and Energy","ror":"https://ror.org/008nkqk13"},{"id":"https://openalex.org/F4320322064","display_name":"Korea Institute for Advancement of Technology","ror":"https://ror.org/015w1qa96"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":43,"referenced_works":["https://openalex.org/W853268249","https://openalex.org/W1149649649","https://openalex.org/W1485225117","https://openalex.org/W1641896143","https://openalex.org/W1974475626","https://openalex.org/W1977349012","https://openalex.org/W1997014239","https://openalex.org/W1999262988","https://openalex.org/W2007707425","https://openalex.org/W2015304389","https://openalex.org/W2032213317","https://openalex.org/W2038165083","https://openalex.org/W2046340695","https://openalex.org/W2050870760","https://openalex.org/W2064523248","https://openalex.org/W2065030863","https://openalex.org/W2065041380","https://openalex.org/W2076978869","https://openalex.org/W2092307784","https://openalex.org/W2156505933","https://openalex.org/W2162998404","https://openalex.org/W2278880676","https://openalex.org/W2317998301","https://openalex.org/W2406639794","https://openalex.org/W2504619654","https://openalex.org/W2540482047","https://openalex.org/W2553401671","https://openalex.org/W2584856888","https://openalex.org/W2621096516","https://openalex.org/W2792037849","https://openalex.org/W2798521970","https://openalex.org/W2897833788","https://openalex.org/W2913489363","https://openalex.org/W2925803900","https://openalex.org/W2972349035","https://openalex.org/W3036309536","https://openalex.org/W3082476321","https://openalex.org/W3093584293","https://openalex.org/W3094382338","https://openalex.org/W3107323053","https://openalex.org/W3184518629","https://openalex.org/W4230327365","https://openalex.org/W4256153402"],"related_works":["https://openalex.org/W4383645763","https://openalex.org/W2795328348","https://openalex.org/W4317381876","https://openalex.org/W4394711414","https://openalex.org/W4400411417","https://openalex.org/W3013514471","https://openalex.org/W2526057129","https://openalex.org/W7221523257","https://openalex.org/W2406639794","https://openalex.org/W3044401458"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":8},{"year":2025,"cited_by_count":15},{"year":2024,"cited_by_count":11},{"year":2023,"cited_by_count":14},{"year":2022,"cited_by_count":4}],"updated_date":"2026-11-10T11:39:43.021295","created_date":"2021-09-27T00:00:00"}