{"id":"https://openalex.org/W3145328504","doi":null,"title":"LPCVD Tungsten Filled vias for Multilayer Metallization","display_name":"LPCVD Tungsten Filled vias for Multilayer Metallization","publication_year":1987,"publication_date":"1987-01-01","ids":{"openalex":"https://openalex.org/W3145328504","mag":"3145328504"},"language":"en","primary_location":{"id":"mag:3145328504","doi":null,"is_oa":false,"landing_page_url":"http://yadda.icm.edu.pl/yadda/element/bwmeta1.element.ieee-000005436565","pdf_url":null,"source":{"id":"https://openalex.org/S4306418380","display_name":"European Solid-State Device Research Conference","issn_l":"1930-8876","issn":["1930-8876","2378-6558"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["jufo-1","norway-1"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"European Solid-State Device Research Conference","raw_type":null},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111366618","display_name":"Zhang","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Zhang","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Buchta","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Buchta","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113940571","display_name":"Johansson","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Johansson","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067630591","display_name":"Norstrom","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Norstrom","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5005850970","display_name":"Wennstrom","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Wennstrom","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.54599407,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"201","last_page":"204"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9932000041007996,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9932000041007996,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.0035000001080334187,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.0008999999845400453,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tungsten","display_name":"tungsten","score":0.7250000238418579},{"id":"https://openalex.org/keywords/low-pressure-chemical-vapor-deposition","display_name":"low-pressure chemical vapor deposition","score":0.6290000081062317},{"id":"https://openalex.org/keywords/multilayer-metallization","display_name":"multilayer metallization","score":0.9229999780654907},{"id":"https://openalex.org/keywords/via-filling","display_name":"via filling","score":0.44699999690055847},{"id":"https://openalex.org/keywords/interconnects","display_name":"interconnects","score":0.5270000100135803}],"concepts":[{"id":"https://openalex.org/C57410435","wikidata":"https://www.wikidata.org/wiki/Q505668","display_name":"Chemical vapor deposition","level":2,"score":0.7614693641662598},{"id":"https://openalex.org/C542268612","wikidata":"https://www.wikidata.org/wiki/Q743","display_name":"Tungsten","level":2,"score":0.7403953075408936},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6651994585990906},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5394287109375},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.41766855120658875},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3694819211959839},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.2134740650653839},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19428256154060364}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:3145328504","doi":null,"is_oa":false,"landing_page_url":"http://yadda.icm.edu.pl/yadda/element/bwmeta1.element.ieee-000005436565","pdf_url":null,"source":{"id":"https://openalex.org/S4306418380","display_name":"European Solid-State Device Research Conference","issn_l":"1930-8876","issn":["1930-8876","2378-6558"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["jufo-1","norway-1"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"European Solid-State Device Research Conference","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3146863454","https://openalex.org/W2742452835","https://openalex.org/W4237045026","https://openalex.org/W3140557993","https://openalex.org/W2608761178","https://openalex.org/W121025727","https://openalex.org/W2148781836","https://openalex.org/W2318661290","https://openalex.org/W4242125661","https://openalex.org/W3141705161"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-09-29T14:09:16.559479","created_date":"2021-04-13T00:00:00"}