{"id":"https://openalex.org/W3137469769","doi":"https://doi.org/10.6180/jase.201909_22(3).0019","title":"Bi-cubic Spline Based Temperature Measurement in the Thermal Field for Navigation and Time System","display_name":"Bi-cubic Spline Based Temperature Measurement in the Thermal Field for Navigation and Time System","publication_year":2019,"publication_date":"2019-01-01","ids":{"openalex":"https://openalex.org/W3137469769","doi":"https://doi.org/10.6180/jase.201909_22(3).0019","mag":"3137469769"},"language":"en","primary_location":{"id":"mag:3137469769","doi":"https://doi.org/10.6180/jase.201909_22(3).0019","is_oa":false,"landing_page_url":"http://jase.tku.edu.tw/articles/jase-201909-22-3-0019.pdf","pdf_url":null,"source":{"id":"https://openalex.org/S4306515328","display_name":"Journal of Applied Science and Engineering","issn_l":null,"issn":["2708-9967","2708-9975"],"is_oa":false,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","doaj","dongbi-d","norway-1","poland-20","russia-white-list-3"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"Journal of Applied Science and Engineering","raw_type":null},"volume":null,"type":"article","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5033662031","display_name":"Madhusudan Singh","orcid":"https://orcid.org/0000-0001-6913-5200","observed_orcids":["https://orcid.org/0000-0001-6913-5200"]},"institutions":[{"id":"https://openalex.org/I85389745","display_name":"Woosong University","ror":"https://ror.org/02srty072","country_code":"KR","type":"education","lineage":["https://openalex.org/I85389745"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Madhusudan Singh","raw_affiliation_strings":["School of Technology Studies, Endicott College of International Studies, Woosong University, Daejeon, Korea"],"raw_orcid":"https://orcid.org/0000-0001-6913-5200","affiliations":[{"raw_affiliation_string":"School of Technology Studies, Endicott College of International Studies, Woosong University, Daejeon, Korea","institution_ids":["https://openalex.org/I85389745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033923866","display_name":"Hakimjon N. Zaynidinov","orcid":"https://orcid.org/0000-0002-8098-5246","observed_orcids":["https://orcid.org/0000-0002-8098-5246"]},"institutions":[{"id":"https://openalex.org/I21256249","display_name":"Tashkent University of Information Technology","ror":"https://ror.org/05987a729","country_code":"UZ","type":"education","lineage":["https://openalex.org/I21256249"]}],"countries":["UZ"],"is_corresponding":false,"raw_author_name":"Hakimjon Zaynidinov","raw_affiliation_strings":["Tashkent University of Information Technologies, Tashkent, Uzbekistan#TAB#"],"raw_orcid":"https://orcid.org/0000-0002-8098-5246","affiliations":[{"raw_affiliation_string":"Tashkent University of Information Technologies, Tashkent, Uzbekistan#TAB#","institution_ids":["https://openalex.org/I21256249"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047234356","display_name":"Mastura Zaynutdinova","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I21256249","display_name":"Tashkent University of Information Technology","ror":"https://ror.org/05987a729","country_code":"UZ","type":"education","lineage":["https://openalex.org/I21256249"]}],"countries":["UZ"],"is_corresponding":false,"raw_author_name":"Mastura Zaynutdinova","raw_affiliation_strings":["Tashkent University of Information Technologies, Tashkent, Uzbekistan#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tashkent University of Information Technologies, Tashkent, Uzbekistan#TAB#","institution_ids":["https://openalex.org/I21256249"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5057407138","display_name":"Dhananjay Singh","orcid":"https://orcid.org/0000-0003-3822-9348","observed_orcids":["https://orcid.org/0000-0003-3822-9348"]},"institutions":[{"id":"https://openalex.org/I83436808","display_name":"Hankuk University of Foreign Studies","ror":"https://ror.org/051q2m369","country_code":"KR","type":"education","lineage":["https://openalex.org/I83436808"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Dhananjay Singh","raw_affiliation_strings":["ReSENSE Lab, Department of Electronics Engineering, Hankuk University of Foreign Studies, Yongin, Korea"],"raw_orcid":"https://orcid.org/0000-0003-3822-9348","affiliations":[{"raw_affiliation_string":"ReSENSE Lab, Department of Electronics Engineering, Hankuk University of Foreign Studies, Yongin, Korea","institution_ids":["https://openalex.org/I83436808"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.8104,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.61167236,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"22","issue":"3","first_page":"579","last_page":"586"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.9868000149726868,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.9868000149726868,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13806","display_name":"Mathematical and Computational Methods","score":0.0027000000700354576,"subfield":{"id":"https://openalex.org/subfields/2611","display_name":"Modeling and Simulation"},"field":{"id":"https://openalex.org/fields/26","display_name":"Mathematics"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11245","display_name":"Advanced Numerical Analysis Techniques","score":0.0017000000225380063,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bicubic-splines","display_name":"bicubic splines","score":0.8849999904632568},{"id":"https://openalex.org/keywords/printed-circuit-boards","display_name":"printed circuit boards","score":0.9089999794960022},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"heat transfer","score":0.4729999899864197},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"temperature measurement","score":0.578000009059906}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.565950334072113},{"id":"https://openalex.org/C65559279","wikidata":"https://www.wikidata.org/wiki/Q16667694","display_name":"Cubic function","level":2,"score":0.5574832558631897},{"id":"https://openalex.org/C64485984","wikidata":"https://www.wikidata.org/wiki/Q4044484","display_name":"Monotone cubic interpolation","level":5,"score":0.548629105091095},{"id":"https://openalex.org/C28719098","wikidata":"https://www.wikidata.org/wiki/Q44946","display_name":"Point (geometry)","level":2,"score":0.5152378678321838},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.48590222001075745},{"id":"https://openalex.org/C10390562","wikidata":"https://www.wikidata.org/wiki/Q581809","display_name":"Spline (mechanical)","level":2,"score":0.46212291717529297},{"id":"https://openalex.org/C182365436","wikidata":"https://www.wikidata.org/wiki/Q50701","display_name":"Variable (mathematics)","level":2,"score":0.44152578711509705},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.43220359086990356},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.4226019084453583},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4073895812034607},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.3721327781677246},{"id":"https://openalex.org/C44154836","wikidata":"https://www.wikidata.org/wiki/Q45045","display_name":"Simulation","level":1,"score":0.36018019914627075},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3360062837600708},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.31085678935050964},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2827128767967224},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.26195642352104187},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.26079338788986206},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.17485082149505615},{"id":"https://openalex.org/C31447003","wikidata":"https://www.wikidata.org/wiki/Q545002","display_name":"Spline interpolation","level":3,"score":0.17385128140449524},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.16171827912330627},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1429043412208557},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.11319926381111145},{"id":"https://openalex.org/C205203396","wikidata":"https://www.wikidata.org/wiki/Q612143","display_name":"Bilinear interpolation","level":2,"score":0.0},{"id":"https://openalex.org/C188325010","wikidata":"https://www.wikidata.org/wiki/Q861176","display_name":"Trilinear interpolation","level":4,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:3137469769","doi":"https://doi.org/10.6180/jase.201909_22(3).0019","is_oa":false,"landing_page_url":"http://jase.tku.edu.tw/articles/jase-201909-22-3-0019.pdf","pdf_url":null,"source":{"id":"https://openalex.org/S4306515328","display_name":"Journal of Applied Science and Engineering","issn_l":null,"issn":["2708-9967","2708-9975"],"is_oa":false,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","doaj","dongbi-d","norway-1","poland-20","russia-white-list-3"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"Journal of Applied Science and Engineering","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W7162541509","https://openalex.org/W1586555505","https://openalex.org/W2104619967","https://openalex.org/W261766039","https://openalex.org/W4309327896","https://openalex.org/W1984200328","https://openalex.org/W4400909061","https://openalex.org/W1621645437","https://openalex.org/W3035940610","https://openalex.org/W4290719170"],"abstract_inverted_index":{"ABSTRACT\r\n\r\nThis":[0],"paper":[1],"highlights":[2],"the":[3,11,28,41,57,65,81,95,102,145,151,154,161],"use":[4],"of":[5,30,33,35,55,73,124,163],"Bi-cubic":[6,53],"splines":[7,32,54],"sets":[8,34],"for":[9,80,91,113],"measuring":[10],"temperatures":[12,36,146],"at":[13,38,147,160],"any":[14],"point":[15],"(x,":[16,61],"y)":[17,62],"on":[18,40,150],"printed":[19],"circuit":[20],"boards":[21,116],"(PCB).":[22],"This":[23],"has":[24],"accomplished":[25],"by":[26,70],"approximating":[27],"system":[29,85],"bi-cubic":[31],"measured":[37],"points":[39,149],"PCB":[42,128],"in":[43,99,101,109],"a":[44,71,89,107],"graphical":[45],"view.":[46],"The":[47,115],"proposed":[48],"approximation":[49],"method":[50],"is":[51,88,106,140],"using":[52],"modeling":[56],"temperature":[58,164],"field":[59],"T":[60],"and":[63,83,93],"replace":[64],"continuous":[66],"two":[67],"variable":[68,75],"function":[69],"combination":[72],"single":[74],"functions.":[76],"While":[77],"developing":[78],"designs":[79],"navigation":[82],"time":[84],"(NTS),":[86],"there":[87],"need":[90],"calculating":[92],"analyzing":[94],"heat":[96,125],"generation":[97],"processes":[98],"units":[100],"NTS":[103],"equipment,":[104],"which":[105,129],"factor":[108],"choosing":[110],"design":[111],"solutions":[112],"systems.":[114],"currently":[117],"used":[118],"can":[119],"conduct":[120],"full-fledged":[121],"3D":[122],"simulations":[123],"transfers":[126],"to":[127,136,143],"are":[130,157],"about":[131],"10":[132],"percent":[133],"accurate":[134,155],"compared":[135],"full-scale":[137],"tests.":[138],"It":[139],"always":[141],"difficult":[142],"determine":[144],"specific":[148],"PCB.":[152],"Therefore":[153],"numbers":[156],"only":[158],"available":[159],"boundaries":[162],"zones.":[165]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2018,"cited_by_count":1}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2021-03-29T00:00:00"}