{"id":"https://openalex.org/W3135810367","doi":"https://doi.org/10.15199/48.2021.03.18","title":"The influence of the PCB design and the process of their manufacturing on the possibility of a defect-free production","display_name":"The influence of the PCB design and the process of their manufacturing on the possibility of a defect-free production","publication_year":2021,"publication_date":"2021-03-01","ids":{"openalex":"https://openalex.org/W3135810367","doi":"https://doi.org/10.15199/48.2021.03.18","mag":"3135810367"},"language":"en","primary_location":{"id":"doi:10.15199/48.2021.03.18","doi":"https://doi.org/10.15199/48.2021.03.18","is_oa":false,"landing_page_url":"https://doi.org/10.15199/48.2021.03.18","pdf_url":null,"source":{"id":"https://openalex.org/S197975706","display_name":"PRZEGL\u0104D ELEKTROTECHNICZNY","issn_l":"0033-2097","issn":["0033-2097","2449-9544"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","erih-plus","norway-1","poland-70","russia-white-list-4"],"host_organization":"https://openalex.org/P4310317252","host_organization_name":"Stowarzyszenie Elektryk\u00f3w Polskich","host_organization_lineage":["https://openalex.org/P4310317252"],"host_organization_lineage_names":["Stowarzyszenie Elektryk\u00f3w Polskich"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"PRZEGL\u0104D ELEKTROTECHNICZNY","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5049470881","display_name":"Fedor V. Vasilyev","orcid":"https://orcid.org/0000-0001-7687-2006","observed_orcids":["https://orcid.org/0000-0001-7687-2006"]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Fedor VASILYEV","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":["https://openalex.org/A5049470881"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.6157,"has_fulltext":false,"cited_by_count":28,"citation_normalized_percentile":{"value":0.82612091,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":99},"biblio":{"volume":"1","issue":"3","first_page":"93","last_page":"98"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.41429999470710754,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.41429999470710754,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.23180000483989716,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.06729999929666519,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-boards","display_name":"printed circuit boards","score":0.9729999899864197},{"id":"https://openalex.org/keywords/printed-circuit-board-design","display_name":"printed circuit board design","score":0.9670000076293945},{"id":"https://openalex.org/keywords/printed-circuit-board-manufacturing","display_name":"printed circuit board manufacturing","score":0.7009999752044678},{"id":"https://openalex.org/keywords/defect-free-production","display_name":"defect-free production","score":0.8759999871253967},{"id":"https://openalex.org/keywords/manufacturing-defects","display_name":"manufacturing defects","score":0.656000018119812},{"id":"https://openalex.org/keywords/quality-control","display_name":"quality control","score":0.31299999356269836}],"concepts":[{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.6867609620094299},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.614852786064148},{"id":"https://openalex.org/C2778348673","wikidata":"https://www.wikidata.org/wiki/Q739302","display_name":"Production (economics)","level":2,"score":0.5631417036056519},{"id":"https://openalex.org/C2987875673","wikidata":"https://www.wikidata.org/wiki/Q187939","display_name":"Manufacturing process","level":2,"score":0.505408763885498},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.45763495564460754},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.4109051823616028},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4025256037712097},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37063395977020264},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.32822781801223755},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.24306699633598328},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.08093148469924927},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.03924223780632019},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.15199/48.2021.03.18","doi":"https://doi.org/10.15199/48.2021.03.18","is_oa":false,"landing_page_url":"https://doi.org/10.15199/48.2021.03.18","pdf_url":null,"source":{"id":"https://openalex.org/S197975706","display_name":"PRZEGL\u0104D ELEKTROTECHNICZNY","issn_l":"0033-2097","issn":["0033-2097","2449-9544"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","erih-plus","norway-1","poland-70","russia-white-list-4"],"host_organization":"https://openalex.org/P4310317252","host_organization_name":"Stowarzyszenie Elektryk\u00f3w Polskich","host_organization_lineage":["https://openalex.org/P4310317252"],"host_organization_lineage_names":["Stowarzyszenie Elektryk\u00f3w Polskich"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"PRZEGL\u0104D ELEKTROTECHNICZNY","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4943999946117401,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W7010501789","https://openalex.org/W7220382333","https://openalex.org/W2131343417","https://openalex.org/W2960851432","https://openalex.org/W7043768821","https://openalex.org/W4232807011","https://openalex.org/W2354808631","https://openalex.org/W2388027606","https://openalex.org/W1990128967","https://openalex.org/W2375450675"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":9},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":6}],"updated_date":"2026-11-08T12:12:28.789561","created_date":"2021-03-15T00:00:00"}