{"id":"https://openalex.org/W3131152227","doi":"https://doi.org/10.1016/j.matlet.2021.129533","title":"Optimal Cu paste thickness for large-area Cu-Cu joint","display_name":"Optimal Cu paste thickness for large-area Cu-Cu joint","publication_year":2021,"publication_date":"2021-02-18","ids":{"openalex":"https://openalex.org/W3131152227","doi":"https://doi.org/10.1016/j.matlet.2021.129533","mag":"3131152227"},"language":"en","primary_location":{"id":"doi:10.1016/j.matlet.2021.129533","doi":"https://doi.org/10.1016/j.matlet.2021.129533","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.matlet.2021.129533","pdf_url":null,"source":{"id":"https://openalex.org/S55626769","display_name":"Materials Letters","issn_l":"0167-577X","issn":["0167-577X","1873-4979"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Letters","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102709462","display_name":"Ling-Mei Wu","orcid":"https://orcid.org/0000-0002-9397-2524","observed_orcids":["https://orcid.org/0000-0002-9397-2524"]},"institutions":[{"id":"https://openalex.org/I158842170","display_name":"Chongqing University","ror":"https://ror.org/023rhb549","country_code":"CN","type":"education","lineage":["https://openalex.org/I158842170"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lingmei Wu","raw_affiliation_strings":["School of Electrical Engineering and State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, 400044 Chongqing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering and State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, 400044 Chongqing, China","institution_ids":["https://openalex.org/I158842170"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086241021","display_name":"Jing Qian","orcid":"https://orcid.org/0000-0002-4472-6044","observed_orcids":["https://orcid.org/0000-0002-4472-6044"]},"institutions":[{"id":"https://openalex.org/I158842170","display_name":"Chongqing University","ror":"https://ror.org/023rhb549","country_code":"CN","type":"education","lineage":["https://openalex.org/I158842170"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jing Qian","raw_affiliation_strings":["School of Electrical Engineering and State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, 400044 Chongqing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering and State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, 400044 Chongqing, China","institution_ids":["https://openalex.org/I158842170"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083638025","display_name":"Jiabing Yu","orcid":"https://orcid.org/0000-0001-7206-6592","observed_orcids":["https://orcid.org/0000-0001-7206-6592"]},"institutions":[{"id":"https://openalex.org/I158842170","display_name":"Chongqing University","ror":"https://ror.org/023rhb549","country_code":"CN","type":"education","lineage":["https://openalex.org/I158842170"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiabing Yu","raw_affiliation_strings":["College of Optoelectronic Engineering and Key Laboratory of Optoelectronic Technology & Systems Education Ministry of China, Chongqing University, 400044 Chongqing, China"],"raw_orcid":"https://orcid.org/0000-0001-7206-6592","affiliations":[{"raw_affiliation_string":"College of Optoelectronic Engineering and Key Laboratory of Optoelectronic Technology & Systems Education Ministry of China, Chongqing University, 400044 Chongqing, China","institution_ids":["https://openalex.org/I158842170"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003360042","display_name":"Haojie Guo","orcid":"https://orcid.org/0000-0002-5131-3192","observed_orcids":["https://orcid.org/0000-0002-5131-3192","https://orcid.org/0000-0002-4407-0081"]},"institutions":[{"id":"https://openalex.org/I158842170","display_name":"Chongqing University","ror":"https://ror.org/023rhb549","country_code":"CN","type":"education","lineage":["https://openalex.org/I158842170"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haojie Guo","raw_affiliation_strings":["College of Optoelectronic Engineering and Key Laboratory of Optoelectronic Technology & Systems Education Ministry of China, Chongqing University, 400044 Chongqing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Optoelectronic Engineering and Key Laboratory of Optoelectronic Technology & Systems Education Ministry of China, Chongqing University, 400044 Chongqing, China","institution_ids":["https://openalex.org/I158842170"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5018406371","display_name":"Xianping Chen","orcid":"https://orcid.org/0000-0002-6332-0955","observed_orcids":["https://orcid.org/0000-0002-6332-0955","https://orcid.org/0000-0001-7582-3827"]},"institutions":[{"id":"https://openalex.org/I158842170","display_name":"Chongqing University","ror":"https://ror.org/023rhb549","country_code":"CN","type":"education","lineage":["https://openalex.org/I158842170"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xianping Chen","raw_affiliation_strings":["College of Optoelectronic Engineering and Key Laboratory of Optoelectronic Technology & Systems Education Ministry of China, Chongqing University, 400044 Chongqing, China","School of Electrical Engineering and State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, 400044 Chongqing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Optoelectronic Engineering and Key Laboratory of Optoelectronic Technology & Systems Education Ministry of China, Chongqing University, 400044 Chongqing, China","institution_ids":["https://openalex.org/I158842170"]},{"raw_affiliation_string":"School of Electrical Engineering and State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, 400044 Chongqing, China","institution_ids":["https://openalex.org/I158842170"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5018406371"],"corresponding_institution_ids":["https://openalex.org/I158842170"],"apc_list":{"value":3100,"currency":"USD","value_usd":3100},"apc_paid":null,"fwci":0.4406,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.52182063,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":96},"biblio":{"volume":"291","issue":null,"first_page":"129533","last_page":"129533"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0015999999595806003,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/die-attach","display_name":"die attach","score":0.8130000233650208},{"id":"https://openalex.org/keywords/cu-cu-joints","display_name":"Cu-Cu joints","score":0.9259999990463257},{"id":"https://openalex.org/keywords/layer-thickness","display_name":"layer thickness","score":0.777999997138977},{"id":"https://openalex.org/keywords/shear-strength","display_name":"shear strength","score":0.843999981880188},{"id":"https://openalex.org/keywords/sintering","display_name":"sintering","score":0.6930000185966492},{"id":"https://openalex.org/keywords/power-electronics-packaging","display_name":"power electronics packaging","score":0.7160000205039978},{"id":"https://openalex.org/keywords/bonding-quality","display_name":"bonding quality","score":0.5550000071525574},{"id":"https://openalex.org/keywords/pore-formation","display_name":"pore formation","score":0.34599998593330383},{"id":"https://openalex.org/keywords/joint-microstructure","display_name":"joint microstructure","score":0.6159999966621399}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.919430136680603},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.8335545063018799},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.7364081740379333},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.7230448722839355},{"id":"https://openalex.org/C127893833","wikidata":"https://www.wikidata.org/wiki/Q7492185","display_name":"Shear strength (soil)","level":3,"score":0.7116166353225708},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.6946755647659302},{"id":"https://openalex.org/C2984173401","wikidata":"https://www.wikidata.org/wiki/Q2914535","display_name":"Bonding strength","level":2,"score":0.5111594796180725},{"id":"https://openalex.org/C96035792","wikidata":"https://www.wikidata.org/wiki/Q43606218","display_name":"Shear (geology)","level":2,"score":0.4404389560222626},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.09409958124160767},{"id":"https://openalex.org/C159390177","wikidata":"https://www.wikidata.org/wiki/Q9161265","display_name":"Soil science","level":1,"score":0.0},{"id":"https://openalex.org/C39432304","wikidata":"https://www.wikidata.org/wiki/Q188847","display_name":"Environmental science","level":0,"score":0.0},{"id":"https://openalex.org/C159750122","wikidata":"https://www.wikidata.org/wiki/Q96621023","display_name":"Soil water","level":2,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.matlet.2021.129533","doi":"https://doi.org/10.1016/j.matlet.2021.129533","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.matlet.2021.129533","pdf_url":null,"source":{"id":"https://openalex.org/S55626769","display_name":"Materials Letters","issn_l":"0167-577X","issn":["0167-577X","1873-4979"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Letters","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G1124865753","display_name":"\u57fa\u4e8e\u9ad8\u901a\u91cf\u7684Janus\u578b\u4e8c\u7ef4\u6c14\u654f\u6750\u6599\u8bbe\u8ba1\u4e0e\u6027\u80fd\u8c03\u63a7\u7814\u7a76","funder_award_id":"62071073","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W2038787247","https://openalex.org/W2045582032","https://openalex.org/W2067695023","https://openalex.org/W2075066821","https://openalex.org/W2119866564","https://openalex.org/W2169346090","https://openalex.org/W2551017861","https://openalex.org/W2766430463","https://openalex.org/W2791614270","https://openalex.org/W2964474034","https://openalex.org/W2980079151","https://openalex.org/W3010850289"],"related_works":["https://openalex.org/W4297808537","https://openalex.org/W4224444658","https://openalex.org/W7131291505","https://openalex.org/W4317242535","https://openalex.org/W4285047919","https://openalex.org/W4393119350","https://openalex.org/W3022668609","https://openalex.org/W4411981694","https://openalex.org/W3047816548","https://openalex.org/W4416249208"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-09-27T08:07:27.782135","created_date":"2021-03-01T00:00:00"}