{"id":"https://openalex.org/W3089258786","doi":"https://doi.org/10.1109/icept50128.2020.9202414","title":"Laser Soldering of Sn-based Solders with Different Melting Points","display_name":"Laser Soldering of Sn-based Solders with Different Melting Points","publication_year":2020,"publication_date":"2020-08-01","ids":{"openalex":"https://openalex.org/W3089258786","doi":"https://doi.org/10.1109/icept50128.2020.9202414","mag":"3089258786"},"language":"en","primary_location":{"id":"doi:10.1109/icept50128.2020.9202414","doi":"https://doi.org/10.1109/icept50128.2020.9202414","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icept50128.2020.9202414","pdf_url":null,"source":{"id":"https://openalex.org/S4363607763","display_name":"International Conference on Electronic Packaging Technology (ICEPT)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102757415","display_name":"Hua Chen","orcid":"https://orcid.org/0000-0003-1673-6103","observed_orcids":["https://orcid.org/0000-0003-1673-6103"]},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]},{"id":"https://openalex.org/I4391767836","display_name":"State Key Laboratory of Advanced Welding and Joining","ror":"https://ror.org/03zxdkx17","country_code":"CN","type":"facility","lineage":["https://openalex.org/I204983213","https://openalex.org/I4391767836"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hua Chen","raw_affiliation_strings":["School of Materials Science and Engineering, Harbin Institute of Technology (Weihai), Weihai, China","State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (Weihai), Weihai, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering, Harbin Institute of Technology (Weihai), Weihai, China","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (Weihai), Weihai, China","institution_ids":["https://openalex.org/I204983213","https://openalex.org/I4391767836"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040231614","display_name":"Jianlin Liang","orcid":"https://orcid.org/0000-0003-3027-2421","observed_orcids":["https://orcid.org/0000-0003-3027-2421"]},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]},{"id":"https://openalex.org/I4391767836","display_name":"State Key Laboratory of Advanced Welding and Joining","ror":"https://ror.org/03zxdkx17","country_code":"CN","type":"facility","lineage":["https://openalex.org/I204983213","https://openalex.org/I4391767836"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianlin Liang","raw_affiliation_strings":["School of Materials Science and Engineering, Harbin Institute of Technology (Weihai), Weihai, China","State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (Weihai), Weihai, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering, Harbin Institute of Technology (Weihai), Weihai, China","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (Weihai), Weihai, China","institution_ids":["https://openalex.org/I204983213","https://openalex.org/I4391767836"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102254358","display_name":"Renxi Gao","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Renxi Gao","raw_affiliation_strings":["Department of Optoelectronic Science, Harbin Institute of Technology (Weihai), Weihai, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Optoelectronic Science, Harbin Institute of Technology (Weihai), Weihai, China","institution_ids":["https://openalex.org/I204983213"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100340452","display_name":"Yujie Li","orcid":"https://orcid.org/0000-0002-7160-3090","observed_orcids":["https://orcid.org/0000-0002-7160-3090"]},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]},{"id":"https://openalex.org/I4391767836","display_name":"State Key Laboratory of Advanced Welding and Joining","ror":"https://ror.org/03zxdkx17","country_code":"CN","type":"facility","lineage":["https://openalex.org/I204983213","https://openalex.org/I4391767836"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yujie Li","raw_affiliation_strings":["School of Materials Science and Engineering, Harbin Institute of Technology (Weihai), Weihai, China","State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (Weihai), Weihai, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering, Harbin Institute of Technology (Weihai), Weihai, China","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (Weihai), Weihai, China","institution_ids":["https://openalex.org/I204983213","https://openalex.org/I4391767836"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.5057,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.94347113,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/laser-soldering","display_name":"laser soldering","score":1.0},{"id":"https://openalex.org/keywords/sn-based-solder","display_name":"Sn-based solder","score":0.9789999723434448},{"id":"https://openalex.org/keywords/solder-joint-microstructure","display_name":"solder joint microstructure","score":0.7630000114440918},{"id":"https://openalex.org/keywords/solder-joint-mechanical-properties","display_name":"solder joint mechanical properties","score":0.7009999752044678},{"id":"https://openalex.org/keywords/shear-strength","display_name":"shear strength","score":0.6370000243186951},{"id":"https://openalex.org/keywords/non-equilibrium-solidification","display_name":"non-equilibrium solidification","score":0.9319999814033508},{"id":"https://openalex.org/keywords/solder-bumps","display_name":"solder bumps","score":0.5249999761581421}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.881684422492981},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8776755928993225},{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.5990763306617737},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5892921686172485},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.5717213153839111},{"id":"https://openalex.org/C13530604","wikidata":"https://www.wikidata.org/wiki/Q15318","display_name":"Melting point","level":2,"score":0.5713560581207275},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.542571485042572},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.5348794460296631},{"id":"https://openalex.org/C156893995","wikidata":"https://www.wikidata.org/wiki/Q5279680","display_name":"Dip soldering","level":4,"score":0.4572846293449402},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.42447537183761597},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4119143486022949},{"id":"https://openalex.org/C97850793","wikidata":"https://www.wikidata.org/wiki/Q1622830","display_name":"Wave soldering","level":3,"score":0.2142128348350525},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.12557801604270935},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.11304450035095215},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icept50128.2020.9202414","doi":"https://doi.org/10.1109/icept50128.2020.9202414","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icept50128.2020.9202414","pdf_url":null,"source":{"id":"https://openalex.org/S4363607763","display_name":"International Conference on Electronic Packaging Technology (ICEPT)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W44801427","https://openalex.org/W1997018702","https://openalex.org/W2008060414","https://openalex.org/W2025110587","https://openalex.org/W2216560575","https://openalex.org/W2226940930","https://openalex.org/W2374702082","https://openalex.org/W2754131961","https://openalex.org/W2760766759","https://openalex.org/W2765642345","https://openalex.org/W6601821287"],"related_works":["https://openalex.org/W4306768104","https://openalex.org/W1504857737","https://openalex.org/W4226475880","https://openalex.org/W4317614180","https://openalex.org/W4387410005","https://openalex.org/W2285778570","https://openalex.org/W4360867019","https://openalex.org/W2342534434","https://openalex.org/W4394712638","https://openalex.org/W4287854371"],"abstract_inverted_index":{"With":[0,203],"the":[1,18,44,57,63,66,71,78,87,106,110,116,122,126,137,141,146,154,186,192,196,199,227,238,243,248,257,262,266,272,284],"miniaturization":[2],"and":[3,20,53,73,86,140,174,195,233],"multi-functionalization":[4],"of":[5,11,41,65,125,171,179,190,198,247,274,287],"electronic":[6,12],"devices,":[7],"a":[8,39,48,113,169,175,280],"large":[9],"number":[10],"components":[13],"with":[14,43,101,112,153,168,214],"various":[15],"requirements":[16],"on":[17,26,105,145,219],"interconnections":[19,98],"packaging":[21],"need":[22],"to":[23,37,62,77,95,160,184,261,279],"be":[24],"integrated":[25],"one":[27,220],"substrate.":[28,108],"There":[29],"are":[30],"specific":[31],"cases":[32],"when":[33],"it":[34],"is":[35],"necessary":[36],"use":[38],"series":[40],"solders":[42,100,152,213],"melting":[45,103,155,217],"points":[46,104,218],"in":[47,56,83,115,237,242,256,265,271,283],"wide":[49],"range.":[50],"The":[51,80,188,252,269],"repetitive":[52],"lengthy":[54],"heating":[55],"sequential":[58],"reflow":[59,143],"soldering":[60,94,139,144,259],"leads":[61],"overgrowth":[64],"brittle":[67],"intermetallic":[68],"compound":[69],"at":[70],"interface":[72],"inevitable":[74],"thermal":[75],"damage":[76],"substrates.":[79],"high":[81,208],"density":[82],"energy":[84,123],"input":[85],"small":[88],"heat":[89],"affected":[90],"area":[91],"enable":[92],"laser":[93,111,138,167,249,258,288],"make":[96],"reliable":[97,210],"using":[99,150,212,230],"different":[102,216],"same":[107],"And":[109],"wavelength":[114,170],"visible":[117],"range":[118],"can":[119],"further":[120],"improve":[121],"absorption":[124],"solders.":[127],"In":[128],"this":[129],"paper,":[130],"experiments":[131],"were":[132,201],"carried":[133],"out":[134],"by":[135,207,226],"both":[136],"infrared":[142],"tinned":[147],"copper":[148],"pads":[149],"Sn-based":[151],"point":[156],"ranging":[157],"from":[158],"96":[159],"309":[161],"\u00b0C.":[162],"A":[163],"continuous":[164],"wave":[165],"solid-state":[166],"532":[172],"nm":[173],"relatively":[176],"low":[177],"power":[178],"1.8":[180],"W":[181],"was":[182],"applied":[183],"all":[185],"samples.":[187],"wettability":[189,205],"solders,":[191],"mechanical":[193,245],"properties":[194,246],"microstructures":[197],"joints":[200,211],"investigated.":[202],"better":[204],"induced":[206],"superheating,":[209],"significantly":[215],"substrate":[221],"have":[222],"been":[223],"successfully":[224],"achieved":[225],"laser.":[228],"When":[229],"Sn16-Pb32-Bi52,":[231],"Sn42-Bi58":[232],"Sn10-Pb88-Ag2,":[234],"refined":[235],"microstructure":[236],"solder":[239],"bumps":[240],"resulted":[241],"improved":[244],"soldered":[250,289],"joints.":[251,290],"fast":[253],"cooling":[254],"rate":[255],"lead":[260],"non-equilibrium":[263],"solidification":[264],"eutectic":[267],"Sn63-Pb37.":[268],"increase":[270],"precipitation":[273],"Pb-rich":[275],"phases":[276],"gave":[277],"rise":[278],"slight":[281],"decrease":[282],"shear":[285],"strength":[286]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":4},{"year":2021,"cited_by_count":2}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2020-10-01T00:00:00"}