{"id":"https://openalex.org/W3086788973","doi":"https://doi.org/10.1088/1361-6439/abb757","title":"Scaling effects and brittle fracture mechanisms in laser punching of PECVD SiO 2 films","display_name":"Scaling effects and brittle fracture mechanisms in laser punching of PECVD SiO 2 films","publication_year":2020,"publication_date":"2020-09-10","ids":{"openalex":"https://openalex.org/W3086788973","doi":"https://doi.org/10.1088/1361-6439/abb757","mag":"3086788973"},"language":"en","primary_location":{"id":"doi:10.1088/1361-6439/abb757","doi":"https://doi.org/10.1088/1361-6439/abb757","is_oa":false,"landing_page_url":"https://doi.org/10.1088/1361-6439/abb757","pdf_url":null,"source":{"id":"https://openalex.org/S170809390","display_name":"Journal of Micromechanics and Microengineering","issn_l":"0960-1317","issn":["0960-1317","1361-6439"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320083","host_organization_name":"IOP Publishing","host_organization_lineage":["https://openalex.org/P4310320083","https://openalex.org/P4310311669"],"host_organization_lineage_names":["IOP Publishing","Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Micromechanics and Microengineering","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064778334","display_name":"Igor Sakaev","orcid":"https://orcid.org/0000-0002-3238-0437","observed_orcids":["https://orcid.org/0000-0002-3238-0437"]},"institutions":[{"id":"https://openalex.org/I124227911","display_name":"Ben-Gurion University of the Negev","ror":"https://ror.org/05tkyf982","country_code":"IL","type":"education","lineage":["https://openalex.org/I124227911"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"I Sakaev","raw_affiliation_strings":["School of Electrical and Computer Engineering, Ben-Gurion University of the Negev, P.O.B 653, Beer-Sheva 8410501, Israel"],"raw_orcid":"https://orcid.org/0000-0002-3238-0437","affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Ben-Gurion University of the Negev, P.O.B 653, Beer-Sheva 8410501, Israel","institution_ids":["https://openalex.org/I124227911"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026955470","display_name":"Yuval Berg","orcid":"https://orcid.org/0000-0001-9262-386X","observed_orcids":["https://orcid.org/0000-0001-9262-386X"]},"institutions":[{"id":"https://openalex.org/I16391192","display_name":"Tel Aviv University","ror":"https://ror.org/04mhzgx49","country_code":"IL","type":"education","lineage":["https://openalex.org/I16391192"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"Y Berg","raw_affiliation_strings":["Additive Manufacturing Group, Orbotech Ltd., PO Box 215, Yavne 81101, Israel","Faculty of Engineering, Department of Physical Electronics, Tel Aviv University, Ramat Aviv, Tel Aviv 69978, Israel","Additive Manufacturing Group, Orbotech Ltd., PO Box 215, Yavne 81101, Israel; Faculty of Engineering, Department of Physical Electronics, Tel Aviv University, Ramat Aviv, Tel Aviv 69978, Israel"],"raw_orcid":"https://orcid.org/0000-0001-9262-386X","affiliations":[{"raw_affiliation_string":"Additive Manufacturing Group, Orbotech Ltd., PO Box 215, Yavne 81101, Israel","institution_ids":[]},{"raw_affiliation_string":"Faculty of Engineering, Department of Physical Electronics, Tel Aviv University, Ramat Aviv, Tel Aviv 69978, Israel","institution_ids":["https://openalex.org/I16391192"]},{"raw_affiliation_string":"Additive Manufacturing Group, Orbotech Ltd., PO Box 215, Yavne 81101, Israel; Faculty of Engineering, Department of Physical Electronics, Tel Aviv University, Ramat Aviv, Tel Aviv 69978, Israel","institution_ids":["https://openalex.org/I16391192"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003848762","display_name":"Zvi Kotler","orcid":"https://orcid.org/0000-0003-0422-7627","observed_orcids":["https://orcid.org/0000-0003-0422-7627"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Z Kotler","raw_affiliation_strings":["Additive Manufacturing Group, Orbotech Ltd., PO Box 215, Yavne 81101, Israel"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Additive Manufacturing Group, Orbotech Ltd., PO Box 215, Yavne 81101, Israel","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5086314535","display_name":"Amiel A. Ishaaya","orcid":"https://orcid.org/0000-0003-3878-1992","observed_orcids":["https://orcid.org/0000-0003-3878-1992"]},"institutions":[{"id":"https://openalex.org/I124227911","display_name":"Ben-Gurion University of the Negev","ror":"https://ror.org/05tkyf982","country_code":"IL","type":"education","lineage":["https://openalex.org/I124227911"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"A A Ishaaya","raw_affiliation_strings":["School of Electrical and Computer Engineering, Ben-Gurion University of the Negev, P.O.B 653, Beer-Sheva 8410501, Israel"],"raw_orcid":"https://orcid.org/0000-0003-3878-1992","affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Ben-Gurion University of the Negev, P.O.B 653, Beer-Sheva 8410501, Israel","institution_ids":["https://openalex.org/I124227911"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":3325,"currency":"USD","value_usd":3325},"apc_paid":null,"fwci":0.2557,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.57872514,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":93},"biblio":{"volume":"30","issue":"11","first_page":"115016","last_page":"115016"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10566","display_name":"Laser-Matter Interactions and Applications","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12106","display_name":"Surface Treatment and Residual Stress","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/silicon-dioxide-thin-films","display_name":"SiO2 thin films","score":0.7390000224113464},{"id":"https://openalex.org/keywords/pecvd-thin-films","display_name":"PECVD thin films","score":0.746999979019165},{"id":"https://openalex.org/keywords/brittle-fracture","display_name":"brittle fracture","score":0.8289999961853027},{"id":"https://openalex.org/keywords/dynamic-fracture","display_name":"dynamic fracture","score":0.6169999837875366},{"id":"https://openalex.org/keywords/femtosecond-pulses","display_name":"femtosecond pulses","score":0.7960000038146973},{"id":"https://openalex.org/keywords/laser-matter-interaction","display_name":"laser-matter interaction","score":0.656000018119812}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7505995035171509},{"id":"https://openalex.org/C2778527123","wikidata":"https://www.wikidata.org/wiki/Q11750728","display_name":"Punching","level":2,"score":0.7316285967826843},{"id":"https://openalex.org/C38347018","wikidata":"https://www.wikidata.org/wiki/Q905958","display_name":"Plasma-enhanced chemical vapor deposition","level":3,"score":0.6652489304542542},{"id":"https://openalex.org/C43369102","wikidata":"https://www.wikidata.org/wiki/Q2307625","display_name":"Fracture (geology)","level":2,"score":0.5938321948051453},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5692763328552246},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5481817722320557},{"id":"https://openalex.org/C22078206","wikidata":"https://www.wikidata.org/wiki/Q1418023","display_name":"Fluence","level":3,"score":0.545689582824707},{"id":"https://openalex.org/C136478896","wikidata":"https://www.wikidata.org/wiki/Q898288","display_name":"Brittleness","level":2,"score":0.5300179719924927},{"id":"https://openalex.org/C178635117","wikidata":"https://www.wikidata.org/wiki/Q747499","display_name":"RADIUS","level":2,"score":0.5298742055892944},{"id":"https://openalex.org/C82558694","wikidata":"https://www.wikidata.org/wiki/Q1545619","display_name":"Aspect ratio (aeronautics)","level":2,"score":0.4981825351715088},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.4781518876552582},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4516231417655945},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.3873800039291382},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.1783682405948639},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1088/1361-6439/abb757","doi":"https://doi.org/10.1088/1361-6439/abb757","is_oa":false,"landing_page_url":"https://doi.org/10.1088/1361-6439/abb757","pdf_url":null,"source":{"id":"https://openalex.org/S170809390","display_name":"Journal of Micromechanics and Microengineering","issn_l":"0960-1317","issn":["0960-1317","1361-6439"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320083","host_organization_name":"IOP Publishing","host_organization_lineage":["https://openalex.org/P4310320083","https://openalex.org/P4310311669"],"host_organization_lineage_names":["IOP Publishing","Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Micromechanics and Microengineering","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W593212797","https://openalex.org/W1963675485","https://openalex.org/W1966394106","https://openalex.org/W1973214884","https://openalex.org/W2001235870","https://openalex.org/W2011493114","https://openalex.org/W2015236025","https://openalex.org/W2028457106","https://openalex.org/W2034617701","https://openalex.org/W2037743669","https://openalex.org/W2038833182","https://openalex.org/W2040477327","https://openalex.org/W2062841501","https://openalex.org/W2065329633","https://openalex.org/W2065376884","https://openalex.org/W2067248449","https://openalex.org/W2084777287","https://openalex.org/W2090491615","https://openalex.org/W2098211162","https://openalex.org/W2105913300","https://openalex.org/W2157838692","https://openalex.org/W2323236181","https://openalex.org/W2344642399","https://openalex.org/W2440287598","https://openalex.org/W2550059748","https://openalex.org/W2553103283","https://openalex.org/W2598454791","https://openalex.org/W2740623489"],"related_works":["https://openalex.org/W4211091940","https://openalex.org/W3203787694","https://openalex.org/W2003099833","https://openalex.org/W2001585963","https://openalex.org/W2023601788","https://openalex.org/W2902315863","https://openalex.org/W1490637938","https://openalex.org/W2336653190","https://openalex.org/W3215905840","https://openalex.org/W2042720288"],"abstract_inverted_index":{"Abstract":[0],"We":[1,125],"experimentally":[2],"investigate":[3],"the":[4,28,47,62,65,69,84,92,114,117,135],"removal":[5],"of":[6,43,89,113,119,128],"several":[7],"microns":[8],"thick":[9],"plasma-enhanced":[10],"chemical":[11],"vapour":[12],"deposition":[13],"SiO":[14],"2":[15],"films":[16],"by":[17,109],"a":[18,110,120],"localized":[19],"dynamic":[20],"fracture":[21,112,130],"due":[22],"to":[23,53,77,96,134],"confined":[24],"laser\u2013matter":[25],"interaction":[26],"with":[27],"silicon":[29],"substrate":[30],"(punching)":[31],"using":[32],"10":[33],"ps":[34],"laser":[35],"pulses":[36],"at":[37],"355":[38],"nm.":[39],"A":[40,102],"near":[41],"order":[42,76],"magnitude":[44],"increase":[45],"in":[46,75,83],"punching":[48],"threshold":[49],"fluence":[50],"(from":[51],"\u223c0.1":[52],"\u223c1":[54],"J":[55],"cm":[56],"\u22122":[57],")":[58],"is":[59,72,107],"observed":[60,136],"as":[61],"ratio":[63,81,105],"between":[64],"spot":[66],"size":[67],"and":[68,116],"film":[70,93,115,122],"thickness":[71,94],"scaled":[73],"down,":[74],"produce":[78],"high":[79,103],"aspect":[80,104],"openings":[82],"film.":[85],"An":[86],"opening":[87,106],"radius":[88],"about":[90],"twice":[91],"appears":[95],"be":[97],"an":[98],"approximate":[99],"practical":[100],"limit.":[101],"created":[108],"cone":[111],"ejection":[118],"conoid":[121],"segment":[123],"(flyer).":[124],"discuss":[126],"mechanisms":[127],"brittle":[129],"that":[131],"may":[132],"lead":[133],"patterns.":[137]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2020-09-21T00:00:00"}