{"id":"https://openalex.org/W3023739733","doi":"https://doi.org/10.1016/b978-0-8155-1594-4.00005-x","title":"Silicon Wafers","display_name":"Silicon Wafers","publication_year":2010,"publication_date":"2010-01-01","ids":{"openalex":"https://openalex.org/W3023739733","doi":"https://doi.org/10.1016/b978-0-8155-1594-4.00005-x","mag":"3023739733"},"language":"en","primary_location":{"id":"doi:10.1016/b978-0-8155-1594-4.00005-x","doi":"https://doi.org/10.1016/b978-0-8155-1594-4.00005-x","is_oa":false,"landing_page_url":"https://doi.org/10.1016/b978-0-8155-1594-4.00005-x","pdf_url":null,"source":{"id":"https://openalex.org/S4306463230","display_name":"Elsevier eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Handbook of Silicon Based MEMS Materials and Technologies","raw_type":"book-chapter"},"volume":{"id":"https://openalex.org/W4292908425","display_name":"Handbook of Silicon Based MEMS Materials and Technologies"},"type":"book-chapter","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5076429268","display_name":"Markku Tilli","orcid":"https://orcid.org/0000-0001-6953-3153","observed_orcids":["https://orcid.org/0000-0001-6953-3153"]},"institutions":[{"id":"https://openalex.org/I4210123384","display_name":"Okmetic (Finland)","ror":"https://ror.org/03125jv12","country_code":"FI","type":"company","lineage":["https://openalex.org/I4210123384"]}],"countries":["FI"],"is_corresponding":true,"raw_author_name":"Markku Tilli","raw_affiliation_strings":["Okmetic Oyj, Vantaa, Finland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Okmetic Oyj, Vantaa, Finland","institution_ids":["https://openalex.org/I4210123384"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5076429268"],"corresponding_institution_ids":["https://openalex.org/I4210123384"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.48106904,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"71","last_page":"88"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9409000277519226,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9409000277519226,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.021700000390410423,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.017100000753998756,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/silicon-wafers","display_name":"silicon wafers","score":1.0},{"id":"https://openalex.org/keywords/mems-fabrication","display_name":"MEMS fabrication","score":0.878000020980835},{"id":"https://openalex.org/keywords/wafer-preparation","display_name":"wafer preparation","score":0.7350000143051147},{"id":"https://openalex.org/keywords/wire-sawing","display_name":"wire sawing","score":0.7519999742507935},{"id":"https://openalex.org/keywords/wafering","display_name":"wafering","score":0.6430000066757202},{"id":"https://openalex.org/keywords/lapping","display_name":"lapping","score":0.7540000081062317},{"id":"https://openalex.org/keywords/chemical-etching","display_name":"chemical etching","score":0.984000027179718},{"id":"https://openalex.org/keywords/wafer-cleaning","display_name":"wafer cleaning","score":0.7429999709129333},{"id":"https://openalex.org/keywords/wafer-polishing","display_name":"wafer polishing","score":0.7940000295639038},{"id":"https://openalex.org/keywords/wafer-resistivity","display_name":"wafer resistivity","score":0.734000027179718},{"id":"https://openalex.org/keywords/wafer-thickness-measurement","display_name":"wafer thickness measurement","score":0.765999972820282},{"id":"https://openalex.org/keywords/czochralski-growth","display_name":"Czochralski crystal growth","score":0.7609999775886536},{"id":"https://openalex.org/keywords/floating-zone-growth","display_name":"floating zone crystal growth","score":0.9020000100135803}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.9183865785598755},{"id":"https://openalex.org/C109880203","wikidata":"https://www.wikidata.org/wiki/Q1505601","display_name":"Lapping","level":2,"score":0.7955772876739502},{"id":"https://openalex.org/C2778547858","wikidata":"https://www.wikidata.org/wiki/Q83893","display_name":"Ingot","level":3,"score":0.7614208459854126},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7451487183570862},{"id":"https://openalex.org/C2777571299","wikidata":"https://www.wikidata.org/wiki/Q3680646","display_name":"Grinding","level":2,"score":0.6800107955932617},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.6490194201469421},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.6229681372642517},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5424642562866211},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5408717393875122},{"id":"https://openalex.org/C2780957350","wikidata":"https://www.wikidata.org/wiki/Q372301","display_name":"Abrasive","level":2,"score":0.4885307550430298},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.47137129306793213},{"id":"https://openalex.org/C8002213","wikidata":"https://www.wikidata.org/wiki/Q7959420","display_name":"Wafer backgrinding","level":4,"score":0.4531151056289673},{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.44947877526283264},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.422727108001709},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.41877907514572144},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.4008808434009552},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.24786171317100525},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.11643031239509583},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.10717079043388367},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/b978-0-8155-1594-4.00005-x","doi":"https://doi.org/10.1016/b978-0-8155-1594-4.00005-x","is_oa":false,"landing_page_url":"https://doi.org/10.1016/b978-0-8155-1594-4.00005-x","pdf_url":null,"source":{"id":"https://openalex.org/S4306463230","display_name":"Elsevier eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Handbook of Silicon Based MEMS Materials and Technologies","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W1560798185","https://openalex.org/W1631812961","https://openalex.org/W1991222579","https://openalex.org/W1992983923","https://openalex.org/W2006567490","https://openalex.org/W2012498583","https://openalex.org/W2014155165","https://openalex.org/W2035974690","https://openalex.org/W2046176699","https://openalex.org/W2051350433","https://openalex.org/W2054142539","https://openalex.org/W2066537547","https://openalex.org/W2088586131","https://openalex.org/W2094277280","https://openalex.org/W2121286028","https://openalex.org/W2153646570","https://openalex.org/W2156806959","https://openalex.org/W2161907742","https://openalex.org/W2486078451","https://openalex.org/W3000121414","https://openalex.org/W4239652282"],"related_works":["https://openalex.org/W3021557689","https://openalex.org/W1980578567","https://openalex.org/W4389047272","https://openalex.org/W4238323033","https://openalex.org/W2052279114","https://openalex.org/W7052066248","https://openalex.org/W4245046479","https://openalex.org/W2251414095","https://openalex.org/W2790579710","https://openalex.org/W3152097257"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":3},{"year":2021,"cited_by_count":1}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2020-05-13T00:00:00"}