{"id":"https://openalex.org/W3019204841","doi":"https://doi.org/10.1109/epeps47316.2019.193239","title":"Fast and Accurate Radiation Calculations for Printed Circuit Boards and Packages","display_name":"Fast and Accurate Radiation Calculations for Printed Circuit Boards and Packages","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3019204841","doi":"https://doi.org/10.1109/epeps47316.2019.193239","mag":"3019204841"},"language":"en","primary_location":{"id":"doi:10.1109/epeps47316.2019.193239","doi":"https://doi.org/10.1109/epeps47316.2019.193239","is_oa":false,"landing_page_url":"https://doi.org/10.1109/epeps47316.2019.193239","pdf_url":null,"source":{"id":"https://openalex.org/S7407088465","display_name":"IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5037537702","display_name":"G. Kevin Zhu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. Kevin Zhu","raw_affiliation_strings":["Electronics Business Unit, ANSYS INC., USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics Business Unit, ANSYS INC., USA","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101403512","display_name":"Xin Xu","orcid":"https://orcid.org/0000-0003-2426-9816","observed_orcids":["https://orcid.org/0000-0003-2426-9816"]},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xin Xu","raw_affiliation_strings":["Electronics Business Unit, ANSYS INC., USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics Business Unit, ANSYS INC., USA","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046830274","display_name":"Werner Thiel","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Werner Thiel","raw_affiliation_strings":["Electronics Business Unit, ANSYS INC., USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics Business Unit, ANSYS INC., USA","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068561500","display_name":"Ryan D. Schimizzi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ryan Schimizzi","raw_affiliation_strings":["Electronics Business Unit, ANSYS INC., USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics Business Unit, ANSYS INC., USA","institution_ids":["https://openalex.org/I21160419"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I21160419"],"apc_list":null,"apc_paid":null,"fwci":0.3951,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.41034968,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"42","issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.5048999786376953,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.5048999786376953,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10739","display_name":"Electromagnetic Scattering and Analysis","score":0.17440000176429749,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11851","display_name":"Electromagnetic Compatibility and Measurements","score":0.16529999673366547,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromagnetic-radiation","display_name":"electromagnetic radiation","score":0.7400000095367432},{"id":"https://openalex.org/keywords/printed-circuit-boards","display_name":"printed circuit boards","score":0.9760000109672546},{"id":"https://openalex.org/keywords/electronic-packages","display_name":"electronic packages","score":0.9449999928474426},{"id":"https://openalex.org/keywords/near-field-calculation","display_name":"near-field calculation","score":0.7039999961853027},{"id":"https://openalex.org/keywords/fast-algorithms","display_name":"fast algorithms","score":0.7889999747276306},{"id":"https://openalex.org/keywords/dielectric-substrate-effects","display_name":"dielectric substrate effects","score":0.906000018119812},{"id":"https://openalex.org/keywords/electromagnetic-interference","display_name":"electromagnetic interference","score":0.8730000257492065},{"id":"https://openalex.org/keywords/electromagnetic-compatibility","display_name":"electromagnetic compatibility","score":1.0}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.7738965749740601},{"id":"https://openalex.org/C125470083","wikidata":"https://www.wikidata.org/wiki/Q747288","display_name":"Electromagnetic compatibility","level":2,"score":0.7588772177696228},{"id":"https://openalex.org/C25227671","wikidata":"https://www.wikidata.org/wiki/Q13405516","display_name":"Near and far field","level":2,"score":0.6154770255088806},{"id":"https://openalex.org/C184892835","wikidata":"https://www.wikidata.org/wiki/Q1474513","display_name":"Electromagnetic interference","level":2,"score":0.613096296787262},{"id":"https://openalex.org/C2778770139","wikidata":"https://www.wikidata.org/wiki/Q1966904","display_name":"Solver","level":2,"score":0.5623745918273926},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5558760166168213},{"id":"https://openalex.org/C28843909","wikidata":"https://www.wikidata.org/wiki/Q177625","display_name":"Electromagnetic field","level":2,"score":0.5501124858856201},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.534271776676178},{"id":"https://openalex.org/C153385146","wikidata":"https://www.wikidata.org/wiki/Q18335","display_name":"Radiation","level":2,"score":0.5212903022766113},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.4983055591583252},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.43559694290161133},{"id":"https://openalex.org/C32022120","wikidata":"https://www.wikidata.org/wiki/Q797225","display_name":"Interference (communication)","level":3,"score":0.42408984899520874},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.39387238025665283},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2302374243736267},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.21317696571350098},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.18092235922813416},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1325291395187378},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/epeps47316.2019.193239","doi":"https://doi.org/10.1109/epeps47316.2019.193239","is_oa":false,"landing_page_url":"https://doi.org/10.1109/epeps47316.2019.193239","pdf_url":null,"source":{"id":"https://openalex.org/S7407088465","display_name":"IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1483525686","https://openalex.org/W1588167619","https://openalex.org/W2068343965","https://openalex.org/W2083989560","https://openalex.org/W2097093173","https://openalex.org/W2105112474","https://openalex.org/W2766964641"],"related_works":["https://openalex.org/W2580874379","https://openalex.org/W2160657969","https://openalex.org/W180469108","https://openalex.org/W2154453460","https://openalex.org/W3213158416","https://openalex.org/W2147023219","https://openalex.org/W2147579204","https://openalex.org/W4405103477","https://openalex.org/W4410295235","https://openalex.org/W1996525737"],"abstract_inverted_index":{"Hybrid":[0],"2.5-D":[1],"field":[2],"solvers":[3],"have":[4],"been":[5],"successfully":[6],"applied":[7],"to":[8,31,52,59,63,74],"the":[9,28,33,37,43,53,65,71,76,81,84,89],"analysis":[10],"of":[11,42,83,93],"high-speed":[12],"printed":[13],"circuit":[14],"boards":[15],"(PCB)":[16],"and":[17,24,39,46,67,70,91],"electronic":[18],"packages.":[19],"To":[20],"enable":[21],"electromagnetic":[22,25,34],"interference":[23],"compatibility":[26],"analysis,":[27],"solver":[29],"needs":[30],"calculate":[32],"radiation":[35,54],"in":[36],"near-field":[38,66],"far-field":[40,68],"regions":[41],"structure":[44],"efficiently":[45],"accurately.":[47],"We":[48,87],"present":[49],"two":[50],"enhancements":[51,95],"calculations.":[55],"The":[56],"first":[57],"is":[58,73],"use":[60],"fast":[61],"algorithms":[62],"accelerate":[64],"calculations":[69],"second":[72],"correct":[75],"trace":[77],"radiations":[78],"by":[79],"including":[80],"effect":[82],"dielectric":[85],"substrate.":[86],"demonstrate":[88],"accuracy":[90],"efficiency":[92],"these":[94],"with":[96],"three":[97],"simulation":[98],"examples.":[99]},"counts_by_year":[{"year":2020,"cited_by_count":1}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2020-05-01T00:00:00"}