{"id":"https://openalex.org/W3016116202","doi":"https://doi.org/10.1109/mems46641.2020.9056407","title":"A Hermetically-Sealed 2.9MHz $\\mathrm{N}=3$ Disk BAW Gyroscope with Sub-Degree-Per-Hour Bias Instability","display_name":"A Hermetically-Sealed 2.9MHz $\\mathrm{N}=3$ Disk BAW Gyroscope with Sub-Degree-Per-Hour Bias Instability","publication_year":2020,"publication_date":"2020-01-01","ids":{"openalex":"https://openalex.org/W3016116202","doi":"https://doi.org/10.1109/mems46641.2020.9056407","mag":"3016116202"},"language":"en","primary_location":{"id":"doi:10.1109/mems46641.2020.9056407","doi":"https://doi.org/10.1109/mems46641.2020.9056407","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mems46641.2020.9056407","pdf_url":null,"source":{"id":"https://openalex.org/S4210233918","display_name":"IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","issn_l":"1084-6999","issn":["1084-6999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019388756","display_name":"Haoran Wen","orcid":"https://orcid.org/0000-0003-4691-701X","observed_orcids":["https://orcid.org/0000-0003-4691-701X"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Haoran Wen","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, Georgia, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, Georgia, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054457254","display_name":"Anosh Daruwalla","orcid":"https://orcid.org/0000-0002-9780-9310","observed_orcids":["https://orcid.org/0000-0002-9780-9310"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Anosh Daruwalla","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, Georgia, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, Georgia, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102759504","display_name":"Chang-Shun Liu","orcid":"https://orcid.org/0000-0001-8813-9100","observed_orcids":["https://orcid.org/0000-0001-8813-9100"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chang-Shun Liu","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, Georgia, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, Georgia, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5081523432","display_name":"Farrokh Ayazi","orcid":"https://orcid.org/0000-0002-4539-7393","observed_orcids":["https://orcid.org/0000-0002-4539-7393"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Farrokh Ayazi","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, Georgia, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, Georgia, USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":5.4449,"has_fulltext":false,"cited_by_count":16,"citation_normalized_percentile":{"value":0.96707234,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"741","last_page":"744"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.6499000191688538,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.6499000191688538,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.25679999589920044,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11325","display_name":"Inertial Sensor and Navigation","score":0.06560000032186508,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/disk-resonators","display_name":"disk resonators","score":0.7450000047683716},{"id":"https://openalex.org/keywords/bias-instability","display_name":"bias instability","score":0.7590000033378601},{"id":"https://openalex.org/keywords/angle-random-walk","display_name":"angle random walk","score":0.9290000200271606},{"id":"https://openalex.org/keywords/hermetic-sealing","display_name":"hermetic sealing","score":0.6259999871253967},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"wafer-level packaging","score":0.9190000295639038},{"id":"https://openalex.org/keywords/thermoelastic-damping","display_name":"thermoelastic damping","score":0.7379999756813049},{"id":"https://openalex.org/keywords/high-quality-factor","display_name":"high quality factor","score":0.5},{"id":"https://openalex.org/keywords/mode-matching-method","display_name":"mode matching","score":0.5849999785423279},{"id":"https://openalex.org/keywords/electrode-design","display_name":"electrode design","score":0.7929999828338623},{"id":"https://openalex.org/keywords/thermal-robustness","display_name":"temperature robustness","score":0.7020000219345093},{"id":"https://openalex.org/keywords/air-damping","display_name":"air damping","score":0.49000000953674316},{"id":"https://openalex.org/keywords/mems-gyroscope","display_name":"MEMS gyroscope","score":0.5049999952316284}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7586559057235718},{"id":"https://openalex.org/C158488048","wikidata":"https://www.wikidata.org/wiki/Q483400","display_name":"Gyroscope","level":2,"score":0.6755788326263428},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.614913284778595},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.6128372550010681},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5287734270095825},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5218778252601624},{"id":"https://openalex.org/C20254490","wikidata":"https://www.wikidata.org/wiki/Q719550","display_name":"Biasing","level":3,"score":0.5119286775588989},{"id":"https://openalex.org/C198394728","wikidata":"https://www.wikidata.org/wiki/Q3695508","display_name":"Vibration","level":2,"score":0.5107376575469971},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.4536901116371155},{"id":"https://openalex.org/C92458943","wikidata":"https://www.wikidata.org/wiki/Q7783171","display_name":"Thermoelastic damping","level":3,"score":0.4321134686470032},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.3881504535675049},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.3508778214454651},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2816125750541687},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.16597428917884827},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.09231600165367126},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mems46641.2020.9056407","doi":"https://doi.org/10.1109/mems46641.2020.9056407","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mems46641.2020.9056407","pdf_url":null,"source":{"id":"https://openalex.org/S4210233918","display_name":"IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","issn_l":"1084-6999","issn":["1084-6999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"sustainable_development_goals_aurora":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2157763436","https://openalex.org/W2943336588"],"related_works":["https://openalex.org/W2593811457","https://openalex.org/W2343925558","https://openalex.org/W3196704900","https://openalex.org/W2071654851","https://openalex.org/W4282590894","https://openalex.org/W2150502990","https://openalex.org/W1702468422","https://openalex.org/W4392026712","https://openalex.org/W3162900711","https://openalex.org/W7064203922"],"abstract_inverted_index":{"This":[0],"paper":[1],"reports":[2],"on":[3],"a":[4,12,17,37,74,121],"wafer-level-packaged":[5],"(WLP)":[6],"capacitive":[7],"bulk-acoustic-wave":[8],"(BAW)":[9],"gyroscope":[10,68],"using":[11,96],"near-solid":[13],"disk":[14],"resonator":[15,39],"with":[16,49,101],"bias":[18,114],"instability":[19],"(BI)":[20],"of":[21,28,66,81,109,115,141,155],"0.85\u00b0/h":[22],"and":[23,50,60,111,120,139,152],"angle":[24],"random":[25],"walk":[26],"(ARW)":[27],"0.06\u00b0/\u221ah,":[29],"demonstrating":[30],"the":[31,47,67,134,142,149,156],"highest":[32],"performance":[33],"reported":[34],"to-date":[35],"for":[36,54,73],"megahertz-frequency":[38],"gyroscope.":[40],"The":[41],"design":[42],"is":[43,94],"acoustically":[44],"decoupled":[45],"from":[46],"substrate":[48,61,127],"high":[51,55,79],"translational":[52],"stiffness":[53],"robustness":[56,151],"against":[57],"linear":[58],"vibrations":[59],"stress":[62,153],"variations.":[63],"High":[64],"frequency":[65],"reduces":[69],"air":[70],"damping,":[71],"allowing":[72],"thermoelastic":[75],"damping":[76],"(TED)":[77],"limited":[78],"Q":[80],"165,000":[82],"in":[83],"1-10Torr":[84],"package":[85],"created":[86,125],"by":[87,126],"getter-free":[88],"wafer":[89],"bonding.":[90],"Stable":[91],"mode-matched":[92],"operation":[93],"achieved":[95],"DC":[97],"voltages":[98],"below":[99],"15V":[100],"optimized":[102],"electrode":[103],"designs,":[104],"offering":[105],"an":[106],"open-loop":[107],"bandwidth":[108],"~10Hz":[110],"low":[112],"uncompensated":[113],"~1.4\u00b0/s.":[116],"A":[117],"regular":[118],"925\u03bcm-thick":[119],"thinned-down":[122],"450\u03bcm-thick":[123],"die":[124],"grinding":[128],"are":[129],"characterized":[130],"across":[131],"temperature,":[132],"showing":[133],"same":[135],"behaviors":[136],"where":[137],"frequencies":[138],"Qs":[140],"n=3":[143],"modes":[144],"remain":[145],"closely":[146],"matched,":[147],"verifying":[148],"temperature":[150],"immunity":[154],"design.":[157]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":3}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2020-04-17T00:00:00"}