{"id":"https://openalex.org/W3015697451","doi":"https://doi.org/10.23919/panpacific48324.2020.9059395","title":"The Basics of Metal Thermal Interface Materials (TIMs)","display_name":"The Basics of Metal Thermal Interface Materials (TIMs)","publication_year":2020,"publication_date":"2020-02-01","ids":{"openalex":"https://openalex.org/W3015697451","doi":"https://doi.org/10.23919/panpacific48324.2020.9059395","mag":"3015697451"},"language":"en","primary_location":{"id":"doi:10.23919/panpacific48324.2020.9059395","doi":"https://doi.org/10.23919/panpacific48324.2020.9059395","is_oa":false,"landing_page_url":"https://doi.org/10.23919/panpacific48324.2020.9059395","pdf_url":null,"source":{"id":"https://openalex.org/S5407054193","display_name":"Pan Pacific Symposium","issn_l":"3067-851X","issn":["3067-851X"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113856047","display_name":"Tim Jensen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Timothy Jensen","raw_affiliation_strings":["Indium Corporation, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, NY, USA","institution_ids":["https://openalex.org/I4210113846"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5050631284","display_name":"Ronald C. Lasky","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ronald Lasky","raw_affiliation_strings":["Indium Corporation, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, NY, USA","institution_ids":["https://openalex.org/I4210113846"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210113846"],"apc_list":null,"apc_paid":null,"fwci":1.7617,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.79087931,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.004999999888241291,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.0010999999940395355,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-interface-materials","display_name":"thermal interface materials","score":0.7509999871253967},{"id":"https://openalex.org/keywords/heat-dissipation","display_name":"heat dissipation","score":0.8949999809265137},{"id":"https://openalex.org/keywords/electronics-thermal-management","display_name":"electronics thermal management","score":0.6819999814033508},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"heat transfer","score":0.5590000152587891},{"id":"https://openalex.org/keywords/circuit-density","display_name":"circuit density","score":0.5690000057220459},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.4399999976158142}],"concepts":[{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.7080742120742798},{"id":"https://openalex.org/C2780728072","wikidata":"https://www.wikidata.org/wiki/Q5297","display_name":"Microprocessor","level":2,"score":0.6959724426269531},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6453069448471069},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5111191868782043},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.48325449228286743},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.4817469120025635},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4695943593978882},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.46371960639953613},{"id":"https://openalex.org/C131017901","wikidata":"https://www.wikidata.org/wiki/Q170451","display_name":"Logic gate","level":2,"score":0.44161492586135864},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.40978604555130005},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.31611377000808716},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3132632374763489},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.07183292508125305},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/panpacific48324.2020.9059395","doi":"https://doi.org/10.23919/panpacific48324.2020.9059395","is_oa":false,"landing_page_url":"https://doi.org/10.23919/panpacific48324.2020.9059395","pdf_url":null,"source":{"id":"https://openalex.org/S5407054193","display_name":"Pan Pacific Symposium","issn_l":"3067-851X","issn":["3067-851X"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2089282752","https://openalex.org/W2145999635","https://openalex.org/W2775759697"],"related_works":["https://openalex.org/W4416883899","https://openalex.org/W4416880307","https://openalex.org/W4416879624","https://openalex.org/W4410521349","https://openalex.org/W4297546687","https://openalex.org/W6981043196","https://openalex.org/W2558815003","https://openalex.org/W3140139821","https://openalex.org/W4417212048","https://openalex.org/W4409090174"],"abstract_inverted_index":{"Modern":[0],"electronics":[1],"require":[2],"an":[3],"extremely":[4],"large":[5],"number":[6],"of":[7,37,55],"circuits":[8,25,57],"to":[9],"perform":[10],"their":[11],"many":[12],"impressive":[13],"feats.":[14],"For":[15],"example,":[16],"a":[17,34],"modern":[18],"smartphone":[19],"can":[20],"have":[21],"several":[22],"billion":[23],"logic":[24],"in":[26],"the":[27,44,50,56],"main":[28],"microprocessor.":[29],"This":[30],"circuit":[31],"density":[32],"creates":[33],"significant":[35],"amount":[36],"heat":[38,45],"that":[39],"must":[40],"be":[41],"dissipated.":[42],"If":[43],"is":[46],"not":[47],"adequately":[48],"dissipated,":[49],"life":[51],"expectancy":[52],"and":[53],"performance":[54],"are":[58],"significantly":[59],"reduced.":[60]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1}],"updated_date":"2026-10-29T09:56:32.521200","created_date":"2020-04-17T00:00:00"}