{"id":"https://openalex.org/W3000443608","doi":"https://doi.org/10.23919/empc44848.2019.8951816","title":"Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment","display_name":"Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment","publication_year":2019,"publication_date":"2019-09-01","ids":{"openalex":"https://openalex.org/W3000443608","doi":"https://doi.org/10.23919/empc44848.2019.8951816","mag":"3000443608"},"language":"en","primary_location":{"id":"doi:10.23919/empc44848.2019.8951816","doi":"https://doi.org/10.23919/empc44848.2019.8951816","is_oa":false,"landing_page_url":"https://doi.org/10.23919/empc44848.2019.8951816","pdf_url":null,"source":{"id":"https://openalex.org/S4306418362","display_name":"European Microelectronics and Packaging Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034152889","display_name":"Karsten Schischke","orcid":"https://orcid.org/0000-0003-3111-8995","observed_orcids":["https://orcid.org/0000-0003-3111-8995"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Karsten Schischke","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070280159","display_name":"Dionysios Manessis","orcid":"https://orcid.org/0000-0001-9778-2536","observed_orcids":["https://orcid.org/0000-0001-9778-2536"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Dionysios Manessis","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056474443","display_name":"Jakub Pawlikowski","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Jakub Pawlikowski","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5097574434","display_name":"Tobias Kupka","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Tobias Kupka","raw_affiliation_strings":["AT&S AG"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AT&S AG","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036487496","display_name":"Thomas Krivec","orcid":"https://orcid.org/0009-0006-8698-3416","observed_orcids":["https://orcid.org/0009-0006-8698-3416"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Thomas Krivec","raw_affiliation_strings":["AT&S AG"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AT&S AG","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082092713","display_name":"Rainer Pamminger","orcid":"https://orcid.org/0000-0002-4669-6969","observed_orcids":["https://orcid.org/0000-0002-4669-6969"]},"institutions":[{"id":"https://openalex.org/I145847075","display_name":"TU Wien","ror":"https://ror.org/04d836q62","country_code":"AT","type":"education","lineage":["https://openalex.org/I145847075"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Rainer Pamminger","raw_affiliation_strings":["TU Wien"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TU Wien","institution_ids":["https://openalex.org/I145847075"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058668723","display_name":"Sebastian Glaser","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I145847075","display_name":"TU Wien","ror":"https://ror.org/04d836q62","country_code":"AT","type":"education","lineage":["https://openalex.org/I145847075"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Sebastian Glaser","raw_affiliation_strings":["TU Wien"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TU Wien","institution_ids":["https://openalex.org/I145847075"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033615168","display_name":"Gerhard Podhradsky","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Gerhard Podhradsky","raw_affiliation_strings":["Speech Processing Solutions GmbH"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Speech Processing Solutions GmbH","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031210332","display_name":"Nils F. Nissen","orcid":"https://orcid.org/0000-0003-0278-9706","observed_orcids":["https://orcid.org/0000-0003-0278-9706"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Nils F. Nissen","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104100965","display_name":"Martin Schneider\u2010Ramelow","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Martin Schneider-Ramelow","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108620479","display_name":"Klaus\u2010Dieter Lang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Klaus-Dieter Lang","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration IZM,Gustav-Meyer-Allee 25,Berlin,Germany,13355","institution_ids":["https://openalex.org/I4210134425"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.1159,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.91303483,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10435","display_name":"Environmental Impact and Sustainability","score":0.38040000200271606,"subfield":{"id":"https://openalex.org/subfields/2305","display_name":"Environmental Engineering"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10435","display_name":"Environmental Impact and Sustainability","score":0.38040000200271606,"subfield":{"id":"https://openalex.org/subfields/2305","display_name":"Environmental Engineering"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10539","display_name":"Sustainable Supply Chain Management","score":0.3278999924659729,"subfield":{"id":"https://openalex.org/subfields/1408","display_name":"Strategy and Management"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T11729","display_name":"Product Development and Customization","score":0.061799999326467514,"subfield":{"id":"https://openalex.org/subfields/1405","display_name":"Management of Technology and Innovation"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/circular-economy","display_name":"circular economy","score":0.8899999856948853},{"id":"https://openalex.org/keywords/environmental-impact-assessment","display_name":"environmental impact assessment","score":0.5120000243186951},{"id":"https://openalex.org/keywords/carbon-footprint","display_name":"carbon footprint","score":0.9190000295639038},{"id":"https://openalex.org/keywords/miniaturization","display_name":"miniaturization","score":0.7239999771118164},{"id":"https://openalex.org/keywords/component-obsolescence","display_name":"component obsolescence","score":0.9200000166893005},{"id":"https://openalex.org/keywords/fairphone","display_name":"Fairphone","score":0.7289999723434448},{"id":"https://openalex.org/keywords/functional-modules","display_name":"functional modules","score":0.3179999887943268}],"concepts":[{"id":"https://openalex.org/C88482812","wikidata":"https://www.wikidata.org/wiki/Q6453666","display_name":"Modular programming","level":2,"score":0.802169144153595},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.7123512029647827},{"id":"https://openalex.org/C41608201","wikidata":"https://www.wikidata.org/wiki/Q980509","display_name":"Embedding","level":2,"score":0.6456166505813599},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5072126388549805},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.34499797224998474},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3393712043762207},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.14508649706840515},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.06795215606689453},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.23919/empc44848.2019.8951816","doi":"https://doi.org/10.23919/empc44848.2019.8951816","is_oa":false,"landing_page_url":"https://doi.org/10.23919/empc44848.2019.8951816","pdf_url":null,"source":{"id":"https://openalex.org/S4306418362","display_name":"European Microelectronics and Packaging Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)","raw_type":"proceedings-article"},{"id":"pmh:oai:fraunhofer.de:N-629288","doi":null,"is_oa":false,"landing_page_url":"http://publica.fraunhofer.de/documents/N-629288.html","pdf_url":null,"source":{"id":"https://openalex.org/S4306400801","display_name":"Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Fraunhofer IZM","raw_type":"Conference Paper"},{"id":"pmh:oai:publica.fraunhofer.de:publica/410543","doi":null,"is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/410543","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"score":1.0,"id":"https://metadata.un.org/sdg/12","display_name":"Responsible consumption and production"},{"score":0.8970999717712402,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2512894262","https://openalex.org/W2582444138","https://openalex.org/W2740559467","https://openalex.org/W2798552553","https://openalex.org/W2922295057","https://openalex.org/W2998903061","https://openalex.org/W3091811521"],"related_works":["https://openalex.org/W3209763917","https://openalex.org/W2992112988","https://openalex.org/W2807114456","https://openalex.org/W4362608455","https://openalex.org/W2998903061","https://openalex.org/W2582444138","https://openalex.org/W6990871287","https://openalex.org/W3107756620","https://openalex.org/W4407770950","https://openalex.org/W7008640504"],"abstract_inverted_index":{"Embedding":[0,155],"technologies":[1],"for":[2,14,31,71,202],"heterogeneous":[3],"integration":[4],"of":[5,43,57,64,79,86,103,123,137,181,198],"active":[6],"and":[7,24,41,106],"passive":[8],"components":[9],"are":[10,28],"a":[11,36,83,139,142,159,182],"promising":[12],"approach":[13],"functional":[15],"modules":[16],"on":[17,96],"the":[18,65,87,101,119,148,173],"printed":[19,49,125],"circuit":[20,50,126],"board":[21,51,127],"level.":[22],"Modularity":[23],"embedding":[25,111],"related":[26],"miniaturization":[27,115],"key":[29],"enablers":[30],"some":[32],"upcoming":[33],"trends":[34],"in":[35,100,108,141,176],"Circular":[37,130],"Economy:":[38],"Better":[39],"serviceability":[40],"reparability":[42],"devices,":[44],"reduced":[45],"material":[46],"consumption,":[47],"lower":[48],"production":[52],"impacts":[53,122],"due":[54],"to":[55,60,195],"\u201coutsourcing\u201d":[56],"complex":[58],"functionality":[59],"smaller":[61],"modules,":[62],"resilience":[63],"product":[66,73],"platform":[67],"against":[68],"component":[69],"obsolescence":[70],"longer":[72],"life":[74],"cycles,":[75],"potentially":[76],"increased":[77],"reliability":[78],"embedded":[80],"components.":[81],"For":[82],"broader":[84],"framing":[85],"modularity":[88],"discussion,":[89],"this":[90,186],"paper":[91],"also":[92],"gives":[93],"an":[94,196],"outlook":[95],"other":[97],"modular":[98],"approaches":[99],"field":[102],"mobile":[104],"devices":[105],"smartphones":[107],"particular.":[109],"The":[110,133],"technology":[112],"with":[113],"its":[114],"potential":[116],"might":[117],"reduce":[118],"total":[120],"environmental":[121,135],"manufacturing":[124],"assemblies,":[128],"supporting":[129],"Economy":[131],"strategies.":[132],"additional":[134,187],"footprint":[136,175,189],"modularising":[138],"smartphone":[140],"way":[143],"done":[144],"by":[145,153],"Fairphone":[146,203],"increases":[147,172],"manufacturing-related":[149],"greenhouse":[150],"gas":[151],"emissions":[152],"4,6%.":[154],"-":[156,169],"targeting":[157],"at":[158],"better":[160],"serviceability,":[161],"but":[162],"not":[163],"necessarily":[164],"simplifying":[165],"do-it-":[166],"yourself":[167],"repairs":[168],"only":[170],"slightly":[171],"carbon":[174,188],"absolute":[177],"terms.":[178],"In":[179],"case":[180],"digital":[183],"voice":[184],"recorder":[185],"is":[190],"0,66":[191],"kg":[192,200],"CO2-eq.":[193,201],"compared":[194],"add-on":[197],"1,64":[199],"'s":[204],"modularization":[205],"approach.":[206]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2}],"updated_date":"2026-10-26T11:51:55.731654","created_date":"2020-01-23T00:00:00"}