{"id":"https://openalex.org/W3000297650","doi":null,"title":"Passive Components Integrated in CMOS High Resistivity SOI Technology: from RF up to 200 GHz","display_name":"Passive Components Integrated in CMOS High Resistivity SOI Technology: from RF up to 200 GHz","publication_year":2006,"publication_date":"2006-01-01","ids":{"openalex":"https://openalex.org/W3000297650","mag":"3000297650"},"language":"en","primary_location":{"id":"pmh:oai:HAL:hal-00147882v1","doi":null,"is_oa":false,"landing_page_url":"https://hal.science/hal-00147882","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4405252976","host_organization_name":"Centre pour la Communication Scientifique Directe","host_organization_lineage":["https://openalex.org/I4405252976"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Second Workshop of the Thematic Network on Silicon on Insulator technology, devices and circuits, 2006, GRENOBLE, France. pp.XX","raw_type":"info:eu-repo/semantics/conferenceObject"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110624066","display_name":"F. Gianesello","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Gianesello, F.","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102821697","display_name":"Daniel Gloria","orcid":"https://orcid.org/0000-0003-2763-8453","observed_orcids":["https://orcid.org/0000-0003-2763-8453"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Gloria, D.","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007782225","display_name":"Christine Raynaud","orcid":"https://orcid.org/0000-0001-7913-6653","observed_orcids":["https://orcid.org/0000-0001-7913-6653"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Raynaud, C.","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056127409","display_name":"S. Montusclat","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Montusclat, S.","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084142313","display_name":"Samuel Boret","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Boret, S.","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052324835","display_name":"C. Cl\u00e9ment","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Cl\u00e9ment, C.","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075267519","display_name":"Carlo Tinella","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Tinella, C.","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027043887","display_name":"Philippe Benech","orcid":"https://orcid.org/0009-0003-0999-7206","observed_orcids":["https://orcid.org/0009-0003-0999-7206"]},"institutions":[{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Benech, Ph.","raw_affiliation_strings":["Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","institution_ids":["https://openalex.org/I4210139715"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5105688928","display_name":"Jean\u2010Michel Fournier","orcid":"https://orcid.org/0000-0003-1395-042X","observed_orcids":["https://orcid.org/0000-0003-1395-042X"]},"institutions":[{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Fournier, J.M.","raw_affiliation_strings":["Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","institution_ids":["https://openalex.org/I4210139715"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5035534379","display_name":"G. Dambrine","orcid":"https://orcid.org/0000-0003-2169-5967","observed_orcids":["https://orcid.org/0000-0003-2169-5967"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dambrine, Gilles","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.40644697,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"XX","last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9589999914169312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9589999914169312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.02500000037252903,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.002400000113993883,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/passive-components","display_name":"passive components","score":0.8579999804496765},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6570000052452087},{"id":"https://openalex.org/keywords/rf-integrated-circuits","display_name":"RF integrated circuits","score":0.7039999961853027},{"id":"https://openalex.org/keywords/millimeter-wave","display_name":"millimeter wave","score":0.6629999876022339},{"id":"https://openalex.org/keywords/terahertz-radiation","display_name":"terahertz radiation","score":0.5899999737739563},{"id":"https://openalex.org/keywords/monolithic-integration","display_name":"monolithic integration","score":0.45100000500679016}],"concepts":[{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.8128293752670288},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.739722728729248},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.5593568086624146},{"id":"https://openalex.org/C69990965","wikidata":"https://www.wikidata.org/wiki/Q65402698","display_name":"Electrical resistivity and conductivity","level":2,"score":0.5372331738471985},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5139738917350769},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4802306294441223},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4575450122356415},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.39091038703918457},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.28905901312828064},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.24718192219734192}],"mesh":[],"locations_count":1,"locations":[{"id":"pmh:oai:HAL:hal-00147882v1","doi":null,"is_oa":false,"landing_page_url":"https://hal.science/hal-00147882","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4405252976","host_organization_name":"Centre pour la Communication Scientifique Directe","host_organization_lineage":["https://openalex.org/I4405252976"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Second Workshop of the Thematic Network on Silicon on Insulator technology, devices and circuits, 2006, GRENOBLE, France. pp.XX","raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3082127183","https://openalex.org/W2522353780","https://openalex.org/W149255986","https://openalex.org/W1658879034","https://openalex.org/W7010262150","https://openalex.org/W2144516764","https://openalex.org/W4299327423","https://openalex.org/W2594503748","https://openalex.org/W2540544854","https://openalex.org/W7024374672"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-11-08T12:12:28.789561","created_date":"2020-01-23T00:00:00"}