{"id":"https://openalex.org/W2995993153","doi":"https://doi.org/10.4071/2380-4505-2019.1.000492","title":"Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study","display_name":"Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W2995993153","doi":"https://doi.org/10.4071/2380-4505-2019.1.000492","mag":"2995993153"},"language":"en","primary_location":{"id":"doi:10.4071/2380-4505-2019.1.000492","doi":"https://doi.org/10.4071/2380-4505-2019.1.000492","is_oa":false,"landing_page_url":"https://doi.org/10.4071/2380-4505-2019.1.000492","pdf_url":null,"source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Symposium on Microelectronics","raw_type":"journal-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5061702491","display_name":"T. Bernhard","orcid":"https://orcid.org/0009-0001-0130-5012","observed_orcids":["https://orcid.org/0009-0001-0130-5012"]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"T. Bernhard","raw_affiliation_strings":["Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086203356","display_name":"Laurence John Gregoriades","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"L. Gregoriades","raw_affiliation_strings":["Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061407936","display_name":"Sean P. Branagan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"S. Branagan","raw_affiliation_strings":["Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022409818","display_name":"Lutz Stamp","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"L. Stamp","raw_affiliation_strings":["Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077303682","display_name":"Edith Steinh\u00e4user","orcid":"https://orcid.org/0000-0003-0996-9611","observed_orcids":["https://orcid.org/0000-0003-0996-9611"]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"E. Steinh\u00e4user","raw_affiliation_strings":["Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"middle","author":{"id":null,"display_name":"R. Schulz","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"R. Schulz","raw_affiliation_strings":["Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5019277988","display_name":"F. Br\u00fcning","orcid":"https://orcid.org/0000-0001-9587-5771","observed_orcids":["https://orcid.org/0000-0001-9587-5771"]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"F. Br\u00fcning","raw_affiliation_strings":["Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Erasmusstrasse 20, Berlin, 10553, Germany","institution_ids":["https://openalex.org/I4210098619"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210098619"],"apc_list":null,"apc_paid":null,"fwci":2.7723,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.91776799,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":"2019","issue":"1","first_page":"000492","last_page":"000502"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9564999938011169,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9564999938011169,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.038600001484155655,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.002899999963119626,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermomechanical-stability","display_name":"thermomechanical stability","score":0.8519999980926514},{"id":"https://openalex.org/keywords/heat-treatment","display_name":"heat treatment","score":0.49399998784065247}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8037185668945312},{"id":"https://openalex.org/C2779772531","wikidata":"https://www.wikidata.org/wiki/Q19689164","display_name":"Void (composites)","level":2,"score":0.7875971794128418},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7862656712532043},{"id":"https://openalex.org/C195702682","wikidata":"https://www.wikidata.org/wiki/Q623318","display_name":"Recrystallization (geology)","level":2,"score":0.6835325360298157},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.48761335015296936},{"id":"https://openalex.org/C59061564","wikidata":"https://www.wikidata.org/wiki/Q7783071","display_name":"Thermal stability","level":2,"score":0.47957438230514526},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4043670892715454},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.32151535153388977},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.17029985785484314},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.16722345352172852},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.11266434192657471},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/2380-4505-2019.1.000492","doi":"https://doi.org/10.4071/2380-4505-2019.1.000492","is_oa":false,"landing_page_url":"https://doi.org/10.4071/2380-4505-2019.1.000492","pdf_url":null,"source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Symposium on Microelectronics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W78320935","https://openalex.org/W1964163793","https://openalex.org/W2015157479","https://openalex.org/W2073620420","https://openalex.org/W2556683044","https://openalex.org/W2576703746","https://openalex.org/W2801868810","https://openalex.org/W2886965626","https://openalex.org/W2887323150","https://openalex.org/W2971190423"],"related_works":["https://openalex.org/W2971190423","https://openalex.org/W7125782302","https://openalex.org/W2794092610","https://openalex.org/W2157468327","https://openalex.org/W4411688784","https://openalex.org/W4297200765","https://openalex.org/W3191364586","https://openalex.org/W4416880128","https://openalex.org/W4377697952","https://openalex.org/W2162719223"],"abstract_inverted_index":{"Abstract":[0],"A":[1],"key":[2],"factor":[3,46],"for":[4,148],"a":[5,44,49,74,90],"high":[6,52],"electrical":[7],"reliability":[8],"of":[9,23,34,40,51,59,73,94,106,117,125,162],"multilayer":[10],"High":[11],"Density":[12],"Interconnection":[13],"Printed":[14],"Circuit":[15],"Boards":[16],"(HDI":[17],"PCBs)":[18],"is":[19,48,166],"the":[20,37,66,69,78,82,101,112,123,132,138,141,155,159,163],"thermomechanical":[21,160],"stability":[22,161],"stacked":[24,95],"microvia":[25],"interconnections.":[26],"With":[27],"decreasing":[28],"via":[29,164],"sizes":[30],"and":[31,47,61,96,137,154],"higher":[32],"numbers":[33],"interconnected":[35],"layers,":[36],"structural":[38],"integrity":[39],"these":[41],"interconnections":[42],"becomes":[43],"critical":[45],"topic":[50],"interest":[53],"in":[54,100],"current":[55],"research.":[56],"The":[57,115,144],"formation":[58],"nanovoids":[60,118],"inhibited":[62],"Cu":[63,142],"recrystallization":[64],"across":[65],"interfaces":[67,134],"are":[68,109,152],"two":[70],"main":[71,145],"indications":[72],"weak":[75],"link":[76],"from":[77],"target":[79],"pad":[80],"to":[81,122],"filled":[83],"via.":[84],"Based":[85],"on":[86,89,140,158],"TEM/EDX":[87],"measurements":[88],"statistically":[91],"relevant":[92],"number":[93],"blind":[97],"microvias":[98],"produced":[99],"industrial":[102],"field,":[103],"different":[104],"types":[105,116],"nanovoid":[107],"phenomena":[108],"revealed":[110],"at":[111],"Cu/Cu/Cu":[113],"junction.":[114],"were":[119],"categorized":[120],"relating":[121],"time":[124],"appearance":[126],"(before":[127],"or":[128,135],"after":[129],"thermal":[130],"treatment),":[131],"affected":[133],"layers":[136],"impact":[139,157],"recrystallization.":[143],"root":[146],"causes":[147],"each":[149],"void":[150],"type":[151],"identified":[153],"expected":[156],"junction":[165],"discussed.":[167]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":1}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2019-12-26T00:00:00"}