{"id":"https://openalex.org/W2972085262","doi":"https://doi.org/10.3844/ajassp.2019.225.237","title":"Thermoelectric and Optical Properties of Advanced Thermoelectric Devices from Different Multilayer Thin Films","display_name":"Thermoelectric and Optical Properties of Advanced Thermoelectric Devices from Different Multilayer Thin Films","publication_year":2019,"publication_date":"2019-08-01","ids":{"openalex":"https://openalex.org/W2972085262","doi":"https://doi.org/10.3844/ajassp.2019.225.237","mag":"2972085262"},"language":"en","primary_location":{"id":"doi:10.3844/ajassp.2019.225.237","doi":"https://doi.org/10.3844/ajassp.2019.225.237","is_oa":true,"landing_page_url":"https://doi.org/10.3844/ajassp.2019.225.237","pdf_url":"https://thescipub.com/pdf/ajassp.2019.225.237.pdf","source":{"id":"https://openalex.org/S33447932","display_name":"American Journal of Applied Sciences","issn_l":"1546-9239","issn":["1546-9239","1554-3641"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","jufo-1"],"host_organization":"https://openalex.org/P4322697006","host_organization_name":"Science Publications","host_organization_lineage":["https://openalex.org/P4322697006"],"host_organization_lineage_names":["Science Publications"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"American Journal of Applied Sciences","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://thescipub.com/pdf/ajassp.2019.225.237.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083507614","display_name":"Mebougna L. Drabo","orcid":"https://orcid.org/0000-0002-7855-0139","observed_orcids":["https://orcid.org/0000-0002-7855-0139"]},"institutions":[{"id":"https://openalex.org/I176692203","display_name":"Alabama Agricultural and Mechanical University","ror":"https://ror.org/05hz8m414","country_code":"US","type":"education","lineage":["https://openalex.org/I176692203"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mebougna Drabo","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Alabama A&M University, Normal, AL USA","Department of Mechanical and Civil Engineering, Alabama A&M University, Normal, AL USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Alabama A&M University, Normal, AL USA","institution_ids":["https://openalex.org/I176692203"]},{"raw_affiliation_string":"Department of Mechanical and Civil Engineering, Alabama A&M University, Normal, AL USA","institution_ids":["https://openalex.org/I176692203"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5091237657","display_name":"Satilmis Budak","orcid":"https://orcid.org/0000-0003-0829-2469","observed_orcids":["https://orcid.org/0000-0003-0829-2469"]},"institutions":[{"id":"https://openalex.org/I176692203","display_name":"Alabama Agricultural and Mechanical University","ror":"https://ror.org/05hz8m414","country_code":"US","type":"education","lineage":["https://openalex.org/I176692203"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Satilmis Budak","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Alabama A andM University, Normal, AL USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Alabama A andM University, Normal, AL USA","institution_ids":["https://openalex.org/I176692203"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5091237657"],"corresponding_institution_ids":["https://openalex.org/I176692203"],"apc_list":null,"apc_paid":null,"fwci":0.1698,"has_fulltext":true,"cited_by_count":2,"citation_normalized_percentile":{"value":0.38523624,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":93},"biblio":{"volume":"16","issue":"8","first_page":"225","last_page":"237"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoelectric-devices","display_name":"thermoelectric devices","score":0.9789999723434448},{"id":"https://openalex.org/keywords/multilayer-films","display_name":"multilayer films","score":0.984000027179718},{"id":"https://openalex.org/keywords/ion-implantation","display_name":"ion implantation","score":0.7549999952316284},{"id":"https://openalex.org/keywords/fluence-dependence","display_name":"fluence dependence","score":0.7820000052452087},{"id":"https://openalex.org/keywords/power-factor","display_name":"power factor","score":0.972000002861023},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.9959999918937683},{"id":"https://openalex.org/keywords/figure-of-merit","display_name":"figure of merit","score":0.9980000257492065},{"id":"https://openalex.org/keywords/quantum-structures","display_name":"quantum structures","score":0.765999972820282},{"id":"https://openalex.org/keywords/magnetron-sputtering","display_name":"magnetron sputtering","score":0.8050000071525574},{"id":"https://openalex.org/keywords/optical-properties","display_name":"optical properties","score":0.7480000257492065}],"concepts":[{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.8208615779876709},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8078254461288452},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.7541735172271729},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5910634398460388},{"id":"https://openalex.org/C112625512","wikidata":"https://www.wikidata.org/wiki/Q1091448","display_name":"Seebeck coefficient","level":3,"score":0.5509610772132874},{"id":"https://openalex.org/C22078206","wikidata":"https://www.wikidata.org/wiki/Q1418023","display_name":"Fluence","level":3,"score":0.5308659672737122},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.5279392600059509},{"id":"https://openalex.org/C61427134","wikidata":"https://www.wikidata.org/wiki/Q847609","display_name":"Sputter deposition","level":4,"score":0.4398460388183594},{"id":"https://openalex.org/C207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","level":3,"score":0.4363609552383423},{"id":"https://openalex.org/C130277099","wikidata":"https://www.wikidata.org/wiki/Q3676605","display_name":"Figure of merit","level":2,"score":0.42821916937828064},{"id":"https://openalex.org/C22423302","wikidata":"https://www.wikidata.org/wiki/Q898444","display_name":"Sputtering","level":3,"score":0.42631202936172485},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.36710721254348755},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.3153211772441864},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1978456974029541},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.17060178518295288},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.10277977585792542},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.3844/ajassp.2019.225.237","doi":"https://doi.org/10.3844/ajassp.2019.225.237","is_oa":true,"landing_page_url":"https://doi.org/10.3844/ajassp.2019.225.237","pdf_url":"https://thescipub.com/pdf/ajassp.2019.225.237.pdf","source":{"id":"https://openalex.org/S33447932","display_name":"American Journal of Applied Sciences","issn_l":"1546-9239","issn":["1546-9239","1554-3641"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","jufo-1"],"host_organization":"https://openalex.org/P4322697006","host_organization_name":"Science Publications","host_organization_lineage":["https://openalex.org/P4322697006"],"host_organization_lineage_names":["Science Publications"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"American Journal of Applied Sciences","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.3844/ajassp.2019.225.237","doi":"https://doi.org/10.3844/ajassp.2019.225.237","is_oa":true,"landing_page_url":"https://doi.org/10.3844/ajassp.2019.225.237","pdf_url":"https://thescipub.com/pdf/ajassp.2019.225.237.pdf","source":{"id":"https://openalex.org/S33447932","display_name":"American Journal of Applied Sciences","issn_l":"1546-9239","issn":["1546-9239","1554-3641"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","jufo-1"],"host_organization":"https://openalex.org/P4322697006","host_organization_name":"Science Publications","host_organization_lineage":["https://openalex.org/P4322697006"],"host_organization_lineage_names":["Science Publications"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"American Journal of Applied Sciences","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G2468424450","display_name":"APPLIED RESEARCH AND WORKFORCE DEVELOPMENT FOR HIGH POWER DENSITY ELECTRONIC DEVICE TECHNOLOGY","funder_award_id":"DENA0001896","funder_id":"https://openalex.org/F4320306084","funder_display_name":"U.S. Department of Energy"},{"id":"https://openalex.org/G3125488492","display_name":"CONSORTIUM FOR PIPELINE DEVELOPMENT OF SKILLED WORKFORCE THROUGH ADVANCED MANUFACTURING","funder_award_id":"DENA0002687","funder_id":"https://openalex.org/F4320306084","funder_display_name":"U.S. Department of Energy"},{"id":"https://openalex.org/G3866042139","display_name":"DEVELOPMENT OF THERMOELECTRIC POWER GENERATION AND PELTIER COOLING   PROPERTIES OF MATERIALS FOR THERMOELECTRIC CRYOCOOLING DEVICES","funder_award_id":"W911NF1210063","funder_id":"https://openalex.org/F4320306078","funder_display_name":"U.S. Department of Defense"},{"id":"https://openalex.org/G5571191145","display_name":"HBCU RISE: Design of Nanostructures for Energy efficient Devices","funder_award_id":"1546965","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G7456033701","display_name":null,"funder_award_id":"DE-NA0001896","funder_id":"https://openalex.org/F4320332369","funder_display_name":"National Nuclear Security Administration"},{"id":"https://openalex.org/G7475984938","display_name":null,"funder_award_id":"EPS-1158862","funder_id":"https://openalex.org/F4320338283","funder_display_name":"Office of Experimental Program to Stimulate Competitive Research"},{"id":"https://openalex.org/G7869029712","display_name":null,"funder_award_id":"1158862","funder_id":"https://openalex.org/F4320338283","funder_display_name":"Office of Experimental Program to Stimulate Competitive Research"},{"id":"https://openalex.org/G792413820","display_name":"NANOTECHNOLOGY INFRASTRUCTURE DEVELOPMENT FOR EDUCATION AND RESEARCH","funder_award_id":"W911NF0810425","funder_id":"https://openalex.org/F4320306078","funder_display_name":"U.S. Department of Defense"},{"id":"https://openalex.org/G8264232114","display_name":"RII: Enhancing Alabama's Research Capacity in Nano/Bio Science and Sensors","funder_award_id":"1158862","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320306078","display_name":"U.S. Department of Defense","ror":"https://ror.org/0447fe631"},{"id":"https://openalex.org/F4320306084","display_name":"U.S. Department of Energy","ror":"https://ror.org/01bj3aw27"},{"id":"https://openalex.org/F4320312852","display_name":"University of Alabama","ror":"https://ror.org/03xrrjk67"},{"id":"https://openalex.org/F4320332369","display_name":"National Nuclear Security Administration","ror":"https://ror.org/03sk1we31"},{"id":"https://openalex.org/F4320338283","display_name":"Office of Experimental Program to Stimulate Competitive Research","ror":"https://ror.org/04k9mqs78"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2972085262.pdf","grobid_xml":"https://content.openalex.org/works/W2972085262.grobid-xml"},"referenced_works_count":10,"referenced_works":["https://openalex.org/W1056117049","https://openalex.org/W1587140794","https://openalex.org/W2014980053","https://openalex.org/W2050674108","https://openalex.org/W2343440069","https://openalex.org/W4211214920","https://openalex.org/W4236463097","https://openalex.org/W4302440637","https://openalex.org/W6730410353","https://openalex.org/W6831867362"],"related_works":["https://openalex.org/W2343440069","https://openalex.org/W1985616773","https://openalex.org/W568881487","https://openalex.org/W1056117049","https://openalex.org/W7034235661","https://openalex.org/W1983338755","https://openalex.org/W2053131022","https://openalex.org/W3100684039","https://openalex.org/W7065417161","https://openalex.org/W3026783599"],"abstract_inverted_index":{"Thermoelectric":[0],"devices":[1,43,124],"were":[2,32,125],"prepared":[3,41,154],"using":[4,34,58],"different":[5,55],"multilayered":[6,112],"thin":[7,30,77,113,156],"film":[8],"structures":[9,73],"in":[10,74],"the":[11,28,54,75,81,84,90,94,98,106,122,149,153,164,167],"order":[12],"of":[13,27,83,93,101,108,111,152,166],"Ge/Si+Ge,":[14],"Si+Ge,":[15],"Si,":[16],"Sb+Ge,":[17],"Ge":[18],"and":[19,67,105,138],"SiO2/SiO2+Ge":[20],"by":[21],"DC/RF":[22],"Magnetron":[23],"Sputtering.":[24],"The":[25,40,87],"thickness":[26,37,165],"deposited":[29],"films":[31,78,114,157],"measured":[33],"Filmetrics":[35],"UV":[36],"measurement":[38],"system.":[39],"thermoelectric":[42,85,123,169],"have":[44,118,145],"been":[45,119,146],"modified":[46],"with":[47],"5":[48],"MeV":[49],"Si":[50],"ions":[51],"bombardments":[52],"at":[53,64,115],"fluences":[56],"(doses)":[57],"Pelletron":[59],"high":[60],"energy":[61],"beam":[62],"accelerator":[63],"Alabama":[65],"A":[66],"M":[68],"University":[69],"to":[70,79,158],"form":[71],"quantum":[72],"multilayer":[76,155],"improve":[80],"efficiency":[82],"devices.":[86,170],"conductivity":[88,103],"measurements,":[89,97],"fluence":[91,99],"dependence":[92,100],"power":[95],"factor":[96],"thermal":[102],"measurements":[104,144],"figure":[107],"merit":[109],"calculations":[110],"room":[116],"temperature":[117],"performed.":[120],"After":[121],"prepared,":[126],"X-ray":[127],"Diffraction,":[128],"Scanning":[129,139],"Electron":[130,141],"Microscopy":[131,142],"(SEM)":[132],"+":[133],"Energy-Dispersive":[134],"X-beam":[135],"Spectroscopy":[136],"(EDS)":[137],"Transmission":[140],"(TEM)":[143],"done":[147],"from":[148],"cross":[150],"section":[151],"give":[159],"us":[160],"some":[161],"answer":[162],"for":[163],"fabricated":[168]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2019-09-12T00:00:00"}