{"id":"https://openalex.org/W2969828461","doi":"https://doi.org/10.1109/tcpmt.2019.2935477","title":"Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package","display_name":"Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package","publication_year":2019,"publication_date":"2019-08-22","ids":{"openalex":"https://openalex.org/W2969828461","doi":"https://doi.org/10.1109/tcpmt.2019.2935477","mag":"2969828461"},"language":"en","primary_location":{"id":"doi:10.1109/tcpmt.2019.2935477","doi":"https://doi.org/10.1109/tcpmt.2019.2935477","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcpmt.2019.2935477","pdf_url":null,"source":{"id":"https://openalex.org/S50222406","display_name":"IEEE Transactions on Components Packaging and Manufacturing Technology","issn_l":"2156-3950","issn":["2156-3950","2156-3985"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5031215280","display_name":"Meng-Kai Shih","orcid":"https://orcid.org/0000-0002-1975-924X","observed_orcids":["https://orcid.org/0000-0002-1975-924X","https://orcid.org/0009-0001-2862-8014"]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Mengkai Shih","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan"],"raw_orcid":"https://orcid.org/0000-0002-1975-924X","affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102170840","display_name":"Chih-Yi Huang","orcid":"https://orcid.org/0009-0007-0605-5108","observed_orcids":["https://orcid.org/0009-0007-0605-5108"]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chih-Yi Huang","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078346032","display_name":"Tsan-Hsien Chen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Tsan-Hsien Chen","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069952014","display_name":"Chen-Chao Wang","orcid":"https://orcid.org/0000-0002-7690-6656","observed_orcids":["https://orcid.org/0000-0002-7690-6656"]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chen-Chao Wang","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045424781","display_name":"David Tarng","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"David Tarng","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5025632983","display_name":"C.-P Hung","orcid":"https://orcid.org/0000-0001-9023-3999","observed_orcids":["https://orcid.org/0000-0001-9023-3999"]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C. P. Hung","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I2799432993"],"apc_list":{"value":2045,"currency":"USD","value_usd":2045},"apc_paid":null,"fwci":1.5351,"has_fulltext":false,"cited_by_count":36,"citation_normalized_percentile":{"value":0.82068703,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":99},"biblio":{"volume":"9","issue":"9","first_page":"1765","last_page":"1775"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.8949999809265137,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.8949999809265137,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.10289999842643738,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fan-out-packaging","display_name":"fan-out packaging","score":0.8240000009536743},{"id":"https://openalex.org/keywords/package-warpage","display_name":"package warpage","score":0.8880000114440918},{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.9369999766349792},{"id":"https://openalex.org/keywords/heat-dissipation","display_name":"heat dissipation","score":0.777999997138977},{"id":"https://openalex.org/keywords/electrical-crosstalk","display_name":"electrical crosstalk","score":0.8769999742507935},{"id":"https://openalex.org/keywords/thermomechanical-reliability","display_name":"thermo-mechanical reliability","score":0.9419999718666077},{"id":"https://openalex.org/keywords/thermal-cycling","display_name":"thermal cycling","score":0.6690000295639038},{"id":"https://openalex.org/keywords/under-bump-metallization","display_name":"under bump metallization","score":0.7979999780654907},{"id":"https://openalex.org/keywords/ansys-simulation","display_name":"ANSYS simulation","score":0.6940000057220459}],"concepts":[{"id":"https://openalex.org/C184788189","wikidata":"https://www.wikidata.org/wiki/Q130652","display_name":"Package on package","level":4,"score":0.8136703968048096},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.7651621103286743},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.7518692016601562},{"id":"https://openalex.org/C83469408","wikidata":"https://www.wikidata.org/wiki/Q2036525","display_name":"Taguchi methods","level":2,"score":0.6763322949409485},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.5981423258781433},{"id":"https://openalex.org/C68812741","wikidata":"https://www.wikidata.org/wiki/Q636609","display_name":"Fan-out","level":3,"score":0.5623340010643005},{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.5589947700500488},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.5320746898651123},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.5044411420822144},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5028078556060791},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.48370295763015747},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.45759162306785583},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.45219314098358154},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.44189009070396423},{"id":"https://openalex.org/C59014099","wikidata":"https://www.wikidata.org/wiki/Q1157702","display_name":"Daisy chain","level":2,"score":0.43053382635116577},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.4179747700691223},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.4112161695957184},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.36686861515045166},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.277247816324234},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.27606821060180664},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.26458337903022766},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.2591628432273865},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19950240850448608},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.10411691665649414},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.08947935700416565},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcpmt.2019.2935477","doi":"https://doi.org/10.1109/tcpmt.2019.2935477","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcpmt.2019.2935477","pdf_url":null,"source":{"id":"https://openalex.org/S50222406","display_name":"IEEE Transactions on Components Packaging and Manufacturing Technology","issn_l":"2156-3950","issn":["2156-3950","2156-3985"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1589280129","https://openalex.org/W1981710768","https://openalex.org/W2005004237","https://openalex.org/W2024606262","https://openalex.org/W2060135116","https://openalex.org/W2091724913","https://openalex.org/W2103105518","https://openalex.org/W2111221847","https://openalex.org/W2120694815","https://openalex.org/W2165600293","https://openalex.org/W2209261788","https://openalex.org/W2411032937","https://openalex.org/W2507491094","https://openalex.org/W2514452563","https://openalex.org/W2547349203","https://openalex.org/W2625618695","https://openalex.org/W2743599321","https://openalex.org/W2749834976","https://openalex.org/W2789952880","https://openalex.org/W2792381799","https://openalex.org/W4210494896","https://openalex.org/W4256423915"],"related_works":["https://openalex.org/W2885903614","https://openalex.org/W7123349644","https://openalex.org/W2625020932","https://openalex.org/W7212296517","https://openalex.org/W3000709813","https://openalex.org/W2749834976","https://openalex.org/W2735326361","https://openalex.org/W3013789247","https://openalex.org/W2787794225","https://openalex.org/W2886441895"],"abstract_inverted_index":{"Fan-out":[0],"(FO)":[1],"packages":[2,111],"are":[3,42,69,118,137,203],"widely":[4],"used":[5,204],"in":[6,33],"handheld,":[7],"mobile":[8],"consumer,":[9],"and":[10,27,52,80,109,127,180],"Internet":[11],"of":[12,30,39,85,92,106,131,143,152,189,211],"Things":[13],"(IoT)":[14],"devices":[15],"due":[16],"to":[17,57,71,121,139,205],"the":[18,28,73,86,93,100,104,107,113,123,132,141,148,157,160,164,168,174,177,181,186,190,199,207,212],"facility":[19],"they":[20],"provide":[21],"for":[22,103],"a":[23,34,53,59,153],"greater":[24],"I/O":[25],"density":[26],"integration":[29],"multiple":[31],"components":[32],"single":[35],"package.":[36,214],"Various":[37],"types":[38],"FO":[40],"package":[41,62,88,192],"available,":[43],"including":[44],"embedded":[45],"wafer-level":[46],"BGA":[47],"(eWLB),":[48],"fully":[49],"molded":[50],"(FM),":[51],"flip-chip-based":[54],"structure":[55],"referred":[56],"as":[58],"fan-out":[60],"chip-last":[61],"(FOCLP).":[63],"In":[64],"this":[65],"paper,":[66],"ANSYS":[67],"simulations":[68,117],"performed":[70,120],"examine":[72,140],"warpage,":[74],"extreme":[75],"low-k":[76],"(ELK)":[77],"interconnect":[78],"stress":[79],"board-level":[81],"solder":[82],"joint":[83,161,166,175],"reliability":[84,188],"various":[87],"types.":[89],"The":[90],"validity":[91],"simulation":[94],"model":[95],"is":[96],"confirmed":[97],"by":[98],"comparing":[99],"numerical":[101],"results":[102,202],"warpage":[105],"eWLB":[108],"FM":[110,191,213],"with":[112],"experimental":[114],"observations.":[115],"Further":[116],"then":[119],"investigate":[122],"heat":[124],"dissipation":[125],"performance":[126],"electrical":[128],"crosstalk":[129],"properties":[130],"three":[133],"packages.":[134],"Taguchi":[135,200],"experiments":[136],"conducted":[138],"effects":[142],"eight":[144],"control":[145],"factors":[146],"[namely,":[147],"inclusion":[149],"(or":[150],"otherwise)":[151],"backside":[154],"laminate":[155],"film,":[156],"board":[158],"thickness,":[159,179],"standoff":[162],"distance,":[163],"ball":[165],"diameter,":[167,173],"under":[169,193],"bump":[170],"metallurgy":[171],"(UBM)":[172],"pitch,":[176],"die":[178],"Cu":[182],"pillar":[183],"height]":[184],"on":[185],"thermomechanical":[187],"accelerated":[194],"thermal":[195],"cycling":[196],"testing.":[197],"Finally,":[198],"analysis":[201],"determine":[206],"optimal":[208],"geometry":[209],"design":[210]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":9},{"year":2022,"cited_by_count":7},{"year":2021,"cited_by_count":5},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":1}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2019-08-29T00:00:00"}