{"id":"https://openalex.org/W2968844241","doi":"https://doi.org/10.3740/mrsk.2019.29.7.443","title":"Effect of Thermal Grease on Thermal Conductivity for Mild Steel and Stainless Steel by ASTM D5470","display_name":"Effect of Thermal Grease on Thermal Conductivity for Mild Steel and Stainless Steel by ASTM D5470","publication_year":2019,"publication_date":"2019-07-01","ids":{"openalex":"https://openalex.org/W2968844241","doi":"https://doi.org/10.3740/mrsk.2019.29.7.443","mag":"2968844241"},"language":"en","primary_location":{"id":"doi:10.3740/mrsk.2019.29.7.443","doi":"https://doi.org/10.3740/mrsk.2019.29.7.443","is_oa":true,"landing_page_url":"https://doi.org/10.3740/mrsk.2019.29.7.443","pdf_url":null,"source":{"id":"https://openalex.org/S184664704","display_name":"Korean Journal of Materials Research","issn_l":"1225-0562","issn":["1225-0562","2287-7258"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["dongbi-c","kci-registered","poland-20","russia-white-list-4"],"host_organization":"https://openalex.org/P4323283927","host_organization_name":"Materials Research Society of Korea","host_organization_lineage":["https://openalex.org/P4323283927"],"host_organization_lineage_names":["Materials Research Society of Korea"],"type":"journal"},"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Korean Journal of Materials Research","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://doi.org/10.3740/mrsk.2019.29.7.443","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Young-Wook Cho","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Young-Wook Cho","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061464086","display_name":"Byung\u2010Dong Hahn","orcid":"https://orcid.org/0000-0002-5934-1913","observed_orcids":["https://orcid.org/0000-0002-5934-1913"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Byung-Dong Hahn","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064342381","display_name":"Ju Ho Lee","orcid":"https://orcid.org/0000-0002-1642-5922","observed_orcids":["https://orcid.org/0000-0002-1642-5922","https://orcid.org/0009-0001-8568-8136"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ju Ho Lee","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060920092","display_name":"Sung Hyuk Park","orcid":"https://orcid.org/0000-0001-5710-7878","observed_orcids":["https://orcid.org/0000-0001-5710-7878"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Sung Hyuk Park","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088915645","display_name":"Ju-Hwan Baeg","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ju-Hwan Baeg","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5102787876","display_name":"Young\u2010Rae Cho","orcid":"https://orcid.org/0000-0003-0591-1463","observed_orcids":["https://orcid.org/0000-0003-0591-1463"]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Young-Rae Cho","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":["https://openalex.org/A5102787876"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.07066959,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"29","issue":"7","first_page":"443","last_page":"450"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.003700000001117587,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0010000000474974513,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-grease","display_name":"thermal grease","score":0.9739999771118164},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.9950000047683716},{"id":"https://openalex.org/keywords/low-carbon-steel","display_name":"mild steel","score":0.8519999980926514},{"id":"https://openalex.org/keywords/stainless-steel","display_name":"stainless steel","score":1.0},{"id":"https://openalex.org/keywords/thermal-interface-materials","display_name":"thermal interface materials","score":0.753000020980835},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"thermal resistance","score":0.6489999890327454},{"id":"https://openalex.org/keywords/thermal-diffusivity","display_name":"thermal diffusivity","score":0.8069999814033508},{"id":"https://openalex.org/keywords/electronic-cooling","display_name":"electronics cooling","score":0.625}],"concepts":[{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.8838886022567749},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8294792175292969},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.7783149480819702},{"id":"https://openalex.org/C37668627","wikidata":"https://www.wikidata.org/wiki/Q3381809","display_name":"Thermal diffusivity","level":2,"score":0.6985399723052979},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6794252991676331},{"id":"https://openalex.org/C2777811205","wikidata":"https://www.wikidata.org/wiki/Q629823","display_name":"Grease","level":2,"score":0.6456305980682373},{"id":"https://openalex.org/C102232406","wikidata":"https://www.wikidata.org/wiki/Q7783035","display_name":"Thermal conductivity measurement","level":3,"score":0.616289496421814},{"id":"https://openalex.org/C200657195","wikidata":"https://www.wikidata.org/wiki/Q868947","display_name":"Thermal grease","level":3,"score":0.6017318367958069},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5983591675758362},{"id":"https://openalex.org/C115816120","wikidata":"https://www.wikidata.org/wiki/Q359156","display_name":"Thermal transmittance","level":4,"score":0.5902508497238159},{"id":"https://openalex.org/C45058047","wikidata":"https://www.wikidata.org/wiki/Q4119687","display_name":"Thermal contact conductance","level":4,"score":0.5812510848045349},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.4732266664505005},{"id":"https://openalex.org/C176177977","wikidata":"https://www.wikidata.org/wiki/Q960836","display_name":"Thermal shock","level":2,"score":0.4585639238357544},{"id":"https://openalex.org/C166841482","wikidata":"https://www.wikidata.org/wiki/Q6493068","display_name":"Laser flash analysis","level":3,"score":0.4314002990722656},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.09288209676742554},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.3740/mrsk.2019.29.7.443","doi":"https://doi.org/10.3740/mrsk.2019.29.7.443","is_oa":true,"landing_page_url":"https://doi.org/10.3740/mrsk.2019.29.7.443","pdf_url":null,"source":{"id":"https://openalex.org/S184664704","display_name":"Korean Journal of Materials Research","issn_l":"1225-0562","issn":["1225-0562","2287-7258"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["dongbi-c","kci-registered","poland-20","russia-white-list-4"],"host_organization":"https://openalex.org/P4323283927","host_organization_name":"Materials Research Society of Korea","host_organization_lineage":["https://openalex.org/P4323283927"],"host_organization_lineage_names":["Materials Research Society of Korea"],"type":"journal"},"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Korean Journal of Materials Research","raw_type":"journal-article"},{"id":"mag:2973842632","doi":null,"is_oa":false,"landing_page_url":"https://db.koreascholar.com/Article?code=376205","pdf_url":null,"source":{"id":"https://openalex.org/S184664704","display_name":"Korean Journal of Materials Research","issn_l":"1225-0562","issn":["1225-0562","2287-7258"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["dongbi-c","kci-registered","poland-20","russia-white-list-4"],"host_organization":"https://openalex.org/P4323283927","host_organization_name":"Materials Research Society of Korea","host_organization_lineage":["https://openalex.org/P4323283927"],"host_organization_lineage_names":["Materials Research Society of Korea"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"Korean Journal of Materials Research","raw_type":null}],"best_oa_location":{"id":"doi:10.3740/mrsk.2019.29.7.443","doi":"https://doi.org/10.3740/mrsk.2019.29.7.443","is_oa":true,"landing_page_url":"https://doi.org/10.3740/mrsk.2019.29.7.443","pdf_url":null,"source":{"id":"https://openalex.org/S184664704","display_name":"Korean Journal of Materials Research","issn_l":"1225-0562","issn":["1225-0562","2287-7258"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["dongbi-c","kci-registered","poland-20","russia-white-list-4"],"host_organization":"https://openalex.org/P4323283927","host_organization_name":"Materials Research Society of Korea","host_organization_lineage":["https://openalex.org/P4323283927"],"host_organization_lineage_names":["Materials Research Society of Korea"],"type":"journal"},"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Korean Journal of Materials Research","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321284","display_name":"Pusan National University","ror":"https://ror.org/01an57a31"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1985781425","https://openalex.org/W2002998609","https://openalex.org/W2016921588","https://openalex.org/W2018189177","https://openalex.org/W2035055578","https://openalex.org/W2053572259","https://openalex.org/W2056780814","https://openalex.org/W2068950051","https://openalex.org/W2257254186","https://openalex.org/W2303622536","https://openalex.org/W2408856401","https://openalex.org/W2507336522","https://openalex.org/W2547293176","https://openalex.org/W2577606039","https://openalex.org/W2608674799","https://openalex.org/W2737967071","https://openalex.org/W2748964016","https://openalex.org/W2757714811","https://openalex.org/W2767942382","https://openalex.org/W3187556068"],"related_works":["https://openalex.org/W2973842632","https://openalex.org/W2732278325","https://openalex.org/W7110529865","https://openalex.org/W4415766805","https://openalex.org/W1870862589","https://openalex.org/W2046340138","https://openalex.org/W2118087851","https://openalex.org/W2048803660","https://openalex.org/W2195873830","https://openalex.org/W2808285598"],"abstract_inverted_index":{"Thermal":[0],"management":[1],"is":[2,144,168,194,223],"a":[3,49,81,99],"critical":[4],"issue":[5],"for":[6,41,216],"the":[7,59,72,105,120,128,135,159,176,184,187,197,210,220,226,231],"development":[8],"of":[9,19,39,51,87,101,108,122,138,162,186,189,199,213,228,233],"high-performance":[10],"electronic":[11],"devices.":[12],"In":[13],"this":[14],"paper,":[15],"thermal":[16,33,42,60,63,73,76,85,106,123,129,136,157,160,190,200,214,234],"conductivity":[17,64,77,86,107,137,161,215],"values":[18,97,117],"mild":[20],"steel":[21],"and":[22,31,62,75],"stainless":[23],"steel(STS)":[24],"are":[25,45,65,78,205],"measured":[26,66,79,92,110,140,148,164,172,218],"by":[27,67,93,111,141,149,165,173,196,225],"light":[28],"flash":[29],"analysis(LFA)":[30],"dynamic":[32],"interface":[34],"material(DynTIM)":[35],"Tester.":[36,83],"The":[37,84],"shapes":[38],"samples":[40,55,88,109,139,163,217],"property":[43],"measurement":[44],"disc":[46],"type":[47],"with":[48,56,89,219],"diameter":[50],"12.6":[52],"mm.":[53],"For":[54,69,175],"different":[57,90],"thickness,":[58],"diffusivity":[61],"LFA.":[68,150,174],"identical":[70],"samples,":[71],"resistance(Rth)":[74],"using":[80],"DynTIM":[82,112,142,166,177,221],"thicknesses,":[91],"LFA,":[94],"show":[95,114],"similar":[96],"in":[98,230],"range":[100],"5":[102],"%.":[103],"However,":[104],"Tester":[113,143,167,178,222],"widely":[115],"scattered":[116],"according":[118],"to":[119,131,207],"application":[121],"grease.":[124,201],"When":[125],"we":[126,153,180,204],"use":[127,156],"grease":[130],"remove":[132],"air":[133],"gaps,":[134],"larger":[145],"than":[146,170],"that":[147,171,183,209],"But,":[151],"when":[152],"did":[154],"not":[155],"grease,":[158],"smaller":[169],"results,":[179],"also":[181],"find":[182],"slope":[185,229],"graph":[188,232],"resistance":[191],"vs.":[192],"thickness":[193],"affected":[195],"usage":[198],"From":[202],"this,":[203],"able":[206],"conclude":[208],"wide":[211],"scattering":[212],"caused":[224],"change":[227],"resistance-thickness.":[235]},"counts_by_year":[],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2019-08-22T00:00:00"}