{"id":"https://openalex.org/W2914836610","doi":"https://doi.org/10.1016/j.commatsci.2019.01.029","title":"Predicting grain structure in high pressure die casting of aluminum alloys: A coupled cellular automaton and process model","display_name":"Predicting grain structure in high pressure die casting of aluminum alloys: A coupled cellular automaton and process model","publication_year":2019,"publication_date":"2019-01-31","ids":{"openalex":"https://openalex.org/W2914836610","doi":"https://doi.org/10.1016/j.commatsci.2019.01.029","mag":"2914836610"},"language":"en","primary_location":{"id":"doi:10.1016/j.commatsci.2019.01.029","doi":"https://doi.org/10.1016/j.commatsci.2019.01.029","is_oa":true,"landing_page_url":"https://doi.org/10.1016/j.commatsci.2019.01.029","pdf_url":null,"source":{"id":"https://openalex.org/S26018076","display_name":"Computational Materials Science","issn_l":"0927-0256","issn":["0927-0256","1879-0801"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-2","norway-2","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":"Computational Materials Science","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://doi.org/10.1016/j.commatsci.2019.01.029","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026478012","display_name":"Cheng Fan Gu","orcid":"https://orcid.org/0000-0002-2244-6551","observed_orcids":["https://orcid.org/0000-0002-2244-6551"]},"institutions":[{"id":"https://openalex.org/I52357470","display_name":"The Ohio State University","ror":"https://ror.org/00rs6vg23","country_code":"US","type":"education","lineage":["https://openalex.org/I52357470"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Cheng Gu","raw_affiliation_strings":["Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA","institution_ids":["https://openalex.org/I52357470"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055248712","display_name":"Yan Hua Lu","orcid":"https://orcid.org/0000-0001-6608-003X","observed_orcids":["https://orcid.org/0000-0001-6608-003X"]},"institutions":[{"id":"https://openalex.org/I52357470","display_name":"The Ohio State University","ror":"https://ror.org/00rs6vg23","country_code":"US","type":"education","lineage":["https://openalex.org/I52357470"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yan Lu","raw_affiliation_strings":["Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA"],"raw_orcid":"https://orcid.org/0000-0001-6608-003X","affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA","institution_ids":["https://openalex.org/I52357470"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091392849","display_name":"Emre Cinkilic","orcid":"https://orcid.org/0000-0001-7632-4843","observed_orcids":["https://orcid.org/0000-0001-7632-4843"]},"institutions":[{"id":"https://openalex.org/I52357470","display_name":"The Ohio State University","ror":"https://ror.org/00rs6vg23","country_code":"US","type":"education","lineage":["https://openalex.org/I52357470"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Emre Cinkilic","raw_affiliation_strings":["Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA","institution_ids":["https://openalex.org/I52357470"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079820564","display_name":"Jiashi Miao","orcid":"https://orcid.org/0000-0002-9440-6671","observed_orcids":["https://orcid.org/0000-0002-9440-6671"]},"institutions":[{"id":"https://openalex.org/I52357470","display_name":"The Ohio State University","ror":"https://ror.org/00rs6vg23","country_code":"US","type":"education","lineage":["https://openalex.org/I52357470"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jiashi Miao","raw_affiliation_strings":["Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA","institution_ids":["https://openalex.org/I52357470"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032489202","display_name":"Andrew D. Klarner","orcid":"https://orcid.org/0000-0003-2824-478X","observed_orcids":["https://orcid.org/0000-0003-2824-478X"]},"institutions":[{"id":"https://openalex.org/I52357470","display_name":"The Ohio State University","ror":"https://ror.org/00rs6vg23","country_code":"US","type":"education","lineage":["https://openalex.org/I52357470"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Andrew Klarner","raw_affiliation_strings":["Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA"],"raw_orcid":"https://orcid.org/0000-0003-2824-478X","affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA","institution_ids":["https://openalex.org/I52357470"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078753151","display_name":"Xinyan Yan","orcid":"https://orcid.org/0000-0003-4082-084X","observed_orcids":["https://orcid.org/0000-0003-4082-084X"]},"institutions":[{"id":"https://openalex.org/I28304128","display_name":"Alcoa (United States)","ror":"https://ror.org/003yb7p17","country_code":"US","type":"company","lineage":["https://openalex.org/I28304128"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xinyan Yan","raw_affiliation_strings":["Alcoa Technical Center, New Kensington, PA 15068, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Alcoa Technical Center, New Kensington, PA 15068, USA","institution_ids":["https://openalex.org/I28304128"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5004871584","display_name":"Alan A. Luo","orcid":"https://orcid.org/0000-0002-4356-0468","observed_orcids":["https://orcid.org/0000-0002-4356-0468"]},"institutions":[{"id":"https://openalex.org/I52357470","display_name":"The Ohio State University","ror":"https://ror.org/00rs6vg23","country_code":"US","type":"education","lineage":["https://openalex.org/I52357470"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Alan A. Luo","raw_affiliation_strings":["Department of Integrated Systems Engineering, The Ohio State University, Columbus, OH 43210, USA","Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Integrated Systems Engineering, The Ohio State University, Columbus, OH 43210, USA","institution_ids":["https://openalex.org/I52357470"]},{"raw_affiliation_string":"Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210, USA","institution_ids":["https://openalex.org/I52357470"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5004871584"],"corresponding_institution_ids":["https://openalex.org/I52357470"],"apc_list":{"value":3000,"currency":"USD","value_usd":3000},"apc_paid":null,"fwci":1.9528,"has_fulltext":false,"cited_by_count":59,"citation_normalized_percentile":{"value":0.85925543,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":"161","issue":null,"first_page":"64","last_page":"75"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11087","display_name":"Solidification and crystal growth phenomena","score":0.9721999764442444,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11087","display_name":"Solidification and crystal growth phenomena","score":0.9721999764442444,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10670","display_name":"Aluminum Alloy Microstructure Properties","score":0.006599999964237213,"subfield":{"id":"https://openalex.org/subfields/2506","display_name":"Metals and Alloys"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11126","display_name":"Metallurgical Processes and Thermodynamics","score":0.005900000222027302,"subfield":{"id":"https://openalex.org/subfields/2506","display_name":"Metals and Alloys"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/high-pressure-die-casting","display_name":"high pressure die casting","score":0.9769999980926514},{"id":"https://openalex.org/keywords/aluminum-alloys","display_name":"aluminum alloys","score":1.0},{"id":"https://openalex.org/keywords/cellular-automata","display_name":"cellular automata","score":0.8100000023841858},{"id":"https://openalex.org/keywords/grain-nucleation-and-growth","display_name":"grain nucleation and growth","score":0.8669999837875366},{"id":"https://openalex.org/keywords/integrated-computational-materials-engineering","display_name":"integrated computational materials engineering","score":0.890999972820282},{"id":"https://openalex.org/keywords/casting-simulation","display_name":"casting simulation","score":0.843999981880188},{"id":"https://openalex.org/keywords/procast","display_name":"ProCAST","score":0.6970000267028809},{"id":"https://openalex.org/keywords/wall-thickness-effect","display_name":"wall thickness effect","score":0.6359999775886536},{"id":"https://openalex.org/keywords/cooling-rate","display_name":"cooling rate","score":0.9679999947547913},{"id":"https://openalex.org/keywords/grain-size","display_name":"grain size","score":0.6850000023841858},{"id":"https://openalex.org/keywords/grain-morphology","display_name":"grain morphology","score":0.7689999938011169},{"id":"https://openalex.org/keywords/thermal-history","display_name":"thermal history","score":0.5239999890327454}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7597759962081909},{"id":"https://openalex.org/C27805521","wikidata":"https://www.wikidata.org/wiki/Q1326017","display_name":"Electron backscatter diffraction","level":3,"score":0.7238044738769531},{"id":"https://openalex.org/C61048295","wikidata":"https://www.wikidata.org/wiki/Q909022","display_name":"Nucleation","level":2,"score":0.6579675674438477},{"id":"https://openalex.org/C192191005","wikidata":"https://www.wikidata.org/wiki/Q466491","display_name":"Grain size","level":2,"score":0.6020255088806152},{"id":"https://openalex.org/C98390173","wikidata":"https://www.wikidata.org/wiki/Q1492573","display_name":"Grain growth","level":3,"score":0.5624691843986511},{"id":"https://openalex.org/C16635281","wikidata":"https://www.wikidata.org/wiki/Q496098","display_name":"Casting","level":2,"score":0.5567278861999512},{"id":"https://openalex.org/C2776624666","wikidata":"https://www.wikidata.org/wiki/Q3325511","display_name":"Die casting","level":3,"score":0.55162513256073},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5311861038208008},{"id":"https://openalex.org/C513153333","wikidata":"https://www.wikidata.org/wiki/Q663","display_name":"Aluminium","level":2,"score":0.5268004536628723},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.48551201820373535},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.1985412836074829},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.14624705910682678},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.commatsci.2019.01.029","doi":"https://doi.org/10.1016/j.commatsci.2019.01.029","is_oa":true,"landing_page_url":"https://doi.org/10.1016/j.commatsci.2019.01.029","pdf_url":null,"source":{"id":"https://openalex.org/S26018076","display_name":"Computational Materials Science","issn_l":"0927-0256","issn":["0927-0256","1879-0801"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-2","norway-2","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":"Computational Materials Science","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1016/j.commatsci.2019.01.029","doi":"https://doi.org/10.1016/j.commatsci.2019.01.029","is_oa":true,"landing_page_url":"https://doi.org/10.1016/j.commatsci.2019.01.029","pdf_url":null,"source":{"id":"https://openalex.org/S26018076","display_name":"Computational Materials Science","issn_l":"0927-0256","issn":["0927-0256","1879-0801"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-2","norway-2","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":"Computational Materials Science","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G1354283492","display_name":"GOALI:  Development of Lightweight Structural Castings Using an Integrated Computational Materials Engineering Approach","funder_award_id":"1432688","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":48,"referenced_works":["https://openalex.org/W308366675","https://openalex.org/W1590967798","https://openalex.org/W1949463454","https://openalex.org/W1964595123","https://openalex.org/W1966549999","https://openalex.org/W1970579850","https://openalex.org/W1971106897","https://openalex.org/W1974433729","https://openalex.org/W1978214774","https://openalex.org/W1980034953","https://openalex.org/W1985877789","https://openalex.org/W2003435318","https://openalex.org/W2003604986","https://openalex.org/W2017451468","https://openalex.org/W2019045342","https://openalex.org/W2024032570","https://openalex.org/W2034650043","https://openalex.org/W2041284384","https://openalex.org/W2048130214","https://openalex.org/W2049071848","https://openalex.org/W2054112589","https://openalex.org/W2055876077","https://openalex.org/W2055908668","https://openalex.org/W2056792646","https://openalex.org/W2058115265","https://openalex.org/W2061205177","https://openalex.org/W2067004822","https://openalex.org/W2068817580","https://openalex.org/W2070133654","https://openalex.org/W2072763029","https://openalex.org/W2074908170","https://openalex.org/W2081906236","https://openalex.org/W2090602588","https://openalex.org/W2108595124","https://openalex.org/W2164844441","https://openalex.org/W2197796636","https://openalex.org/W2232864377","https://openalex.org/W2244081491","https://openalex.org/W2275427951","https://openalex.org/W2334104290","https://openalex.org/W2421358336","https://openalex.org/W2528441552","https://openalex.org/W2545842008","https://openalex.org/W2553241257","https://openalex.org/W2600784433","https://openalex.org/W2749520363","https://openalex.org/W2769824564","https://openalex.org/W6635460917"],"related_works":["https://openalex.org/W2157593867","https://openalex.org/W2038729358","https://openalex.org/W2380365192","https://openalex.org/W228804939","https://openalex.org/W3171217315","https://openalex.org/W1977289579","https://openalex.org/W2025660638","https://openalex.org/W2372211503","https://openalex.org/W1603798879","https://openalex.org/W1979257500"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":8},{"year":2025,"cited_by_count":14},{"year":2024,"cited_by_count":10},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":8},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":8},{"year":2019,"cited_by_count":3}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2019-02-21T00:00:00"}