{"id":"https://openalex.org/W2913787180","doi":null,"title":"Coupled Electrostatic-Structures-Fluidic Analysis of a Micromirror","display_name":"Coupled Electrostatic-Structures-Fluidic Analysis of a Micromirror","publication_year":2001,"publication_date":"2001-03-19","ids":{"openalex":"https://openalex.org/W2913787180","mag":"2913787180"},"language":"en","primary_location":{"id":"mag:2913787180","doi":null,"is_oa":false,"landing_page_url":"https://briefs.techconnect.org/wp-content/volumes/MSM2001/pdf/W22.2.pdf","pdf_url":null,"source":{"id":"https://openalex.org/S4306531643","display_name":"TechConnect Briefs","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"TechConnect Briefs","raw_type":null},"volume":null,"type":"article","indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5077329116","display_name":"Edward Chan","orcid":"https://orcid.org/0000-0001-8013-3097","observed_orcids":["https://orcid.org/0000-0001-8013-3097"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Edward Chan","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0001-8013-3097","affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000933773","display_name":"Paul J. Dionne","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Paul Dionne","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5015638853","display_name":"Marek A. Turowski","orcid":"https://orcid.org/0000-0002-6632-0811","observed_orcids":["https://orcid.org/0000-0002-6632-0811"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Marek Turowski","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0002-6632-0811","affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.47974223,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"1","issue":"2001","first_page":"274","last_page":"277"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9932000041007996,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9932000041007996,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":0.0019000000320374966,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.0010999999940395355,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/micromirrors","display_name":"micromirrors","score":0.9620000123977661},{"id":"https://openalex.org/keywords/electrostatic-actuation","display_name":"electrostatic actuation","score":0.921999990940094},{"id":"https://openalex.org/keywords/mems","display_name":"MEMS","score":0.5899999737739563},{"id":"https://openalex.org/keywords/fluid-structure-interaction","display_name":"fluid-structure interaction","score":0.7229999899864197},{"id":"https://openalex.org/keywords/electrohydrodynamics","display_name":"electrohydrodynamics","score":0.6610000133514404}],"concepts":[{"id":"https://openalex.org/C132651336","wikidata":"https://www.wikidata.org/wiki/Q185571","display_name":"Fluidics","level":2,"score":0.69217848777771},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3715587258338928},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.36695873737335205},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.32677245140075684},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2773609757423401},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.16168105602264404}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:2913787180","doi":null,"is_oa":false,"landing_page_url":"https://briefs.techconnect.org/wp-content/volumes/MSM2001/pdf/W22.2.pdf","pdf_url":null,"source":{"id":"https://openalex.org/S4306531643","display_name":"TechConnect Briefs","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"TechConnect Briefs","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2689726016","https://openalex.org/W2678400235","https://openalex.org/W4234109975","https://openalex.org/W7204172190","https://openalex.org/W2651105935","https://openalex.org/W6941077813","https://openalex.org/W3106816148","https://openalex.org/W2300410392","https://openalex.org/W1971736112","https://openalex.org/W7047692587"],"abstract_inverted_index":null,"counts_by_year":[{"year":2013,"cited_by_count":1}],"updated_date":"2026-09-22T06:50:58.402377","created_date":"2019-02-21T00:00:00"}