{"id":"https://openalex.org/W2904510282","doi":"https://doi.org/10.4071/2380-4505-2018.1.000037","title":"Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost","display_name":"Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost","publication_year":2018,"publication_date":"2018-10-01","ids":{"openalex":"https://openalex.org/W2904510282","doi":"https://doi.org/10.4071/2380-4505-2018.1.000037","mag":"2904510282"},"language":"en","primary_location":{"id":"doi:10.4071/2380-4505-2018.1.000037","doi":"https://doi.org/10.4071/2380-4505-2018.1.000037","is_oa":false,"landing_page_url":"https://doi.org/10.4071/2380-4505-2018.1.000037","pdf_url":null,"source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Symposium on Microelectronics","raw_type":"journal-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110257291","display_name":"Henning Hubner","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Henning H\u00fcbner","raw_affiliation_strings":["Atotech Deutschland GmbH, Erasmusstrasse 20, 10553 Berlin, Germany, Ph: +49 30 349 85 0; Fax: +49 30 349 85 777, Email: henning.huebner@atotech.com, christian.ohde@atotech.com","Fax: +49 30 349 85 777, Email: ,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Erasmusstrasse 20, 10553 Berlin, Germany, Ph: +49 30 349 85 0; Fax: +49 30 349 85 777, Email: henning.huebner@atotech.com, christian.ohde@atotech.com","institution_ids":["https://openalex.org/I4210098619"]},{"raw_affiliation_string":"Fax: +49 30 349 85 777, Email: ,","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079301575","display_name":"Christian Ohde","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Christian Ohde","raw_affiliation_strings":["Atotech Deutschland GmbH, Erasmusstrasse 20, 10553 Berlin, Germany, Ph: +49 30 349 85 0; Fax: +49 30 349 85 777, Email: henning.huebner@atotech.com, christian.ohde@atotech.com","Fax: +49 30 349 85 777, Email: ,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Erasmusstrasse 20, 10553 Berlin, Germany, Ph: +49 30 349 85 0; Fax: +49 30 349 85 777, Email: henning.huebner@atotech.com, christian.ohde@atotech.com","institution_ids":["https://openalex.org/I4210098619"]},{"raw_affiliation_string":"Fax: +49 30 349 85 777, Email: ,","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5001876443","display_name":"Dirk Ruess","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Dirk Ruess","raw_affiliation_strings":["Atotech Deutschland GmbH, Industriestrasse 69, 90537 Feucht, Germany, Ph: +49 9128 725 606; Fax: +49 9128 725 385, Email: dirk.ruess@atotech.com","Fax: +49 9128 725 385, Email:"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Industriestrasse 69, 90537 Feucht, Germany, Ph: +49 9128 725 606; Fax: +49 9128 725 385, Email: dirk.ruess@atotech.com","institution_ids":["https://openalex.org/I4210098619"]},{"raw_affiliation_string":"Fax: +49 9128 725 385, Email:","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5001876443","https://openalex.org/A5079301575","https://openalex.org/A5110257291"],"corresponding_institution_ids":["https://openalex.org/I4210098619"],"apc_list":null,"apc_paid":null,"fwci":1.4819,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.82331976,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":93},"biblio":{"volume":"2018","issue":"1","first_page":"000037","last_page":"000042"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9907000064849854,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9907000064849854,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.004999999888241291,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.0010999999940395355,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/copper-plating","display_name":"copper plating","score":0.8169999718666077},{"id":"https://openalex.org/keywords/fan-out-wafer-level-packaging","display_name":"fan-out wafer-level packaging","score":0.824999988079071},{"id":"https://openalex.org/keywords/anode-design","display_name":"anode design","score":0.9929999709129333},{"id":"https://openalex.org/keywords/thickness-uniformity","display_name":"thickness uniformity","score":0.6790000200271606},{"id":"https://openalex.org/keywords/glass-substrates","display_name":"glass substrates","score":0.765999972820282},{"id":"https://openalex.org/keywords/organic-substrates","display_name":"organic substrates","score":0.9190000295639038},{"id":"https://openalex.org/keywords/production-cost-reduction","display_name":"production cost reduction","score":0.6019999980926514}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.8304660320281982},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6553763151168823},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.49502843618392944},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.48022088408470154},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.47089794278144836},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.4588842988014221},{"id":"https://openalex.org/C2776985018","wikidata":"https://www.wikidata.org/wiki/Q7202314","display_name":"Plating (geology)","level":2,"score":0.45536890625953674},{"id":"https://openalex.org/C193149544","wikidata":"https://www.wikidata.org/wiki/Q7122904","display_name":"Packaging engineering","level":2,"score":0.4485355019569397},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4466528594493866},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.4455917477607727},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.42872896790504456},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.415978342294693},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.3831841051578522},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.36640307307243347},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.35722804069519043},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3301265239715576},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23634597659111023},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/2380-4505-2018.1.000037","doi":"https://doi.org/10.4071/2380-4505-2018.1.000037","is_oa":false,"landing_page_url":"https://doi.org/10.4071/2380-4505-2018.1.000037","pdf_url":null,"source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Symposium on Microelectronics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2549629611","https://openalex.org/W2754405531"],"related_works":["https://openalex.org/W2970156433","https://openalex.org/W2742785701","https://openalex.org/W2568423857","https://openalex.org/W4416884244","https://openalex.org/W4245064620","https://openalex.org/W2952469902","https://openalex.org/W2970550624","https://openalex.org/W4234262694","https://openalex.org/W4416882881","https://openalex.org/W2911536833"],"abstract_inverted_index":{"Abstract":[0],"Electrolytic":[1],"metal":[2,214,243],"deposition":[3,215],"is":[4,72,216],"a":[5,84,143,151,160,206],"key":[6,207],"process":[7,185,264,287,330],"step":[8],"in":[9,18,47,108,125,209,257,292],"the":[10,32,76,112,117,167,174,183,210,217,262,325,334],"manufacturing":[11,123],"of":[12,91,111,169,182,212,219,224,261,271,285,300,324],"vertical":[13],"and":[14,21,27,42,50,54,96,106,119,133,139,189,196,201,246,255,277,303,316,322,346],"horizontal":[15],"interconnections":[16],"used":[17],"today's":[19],"PCBs":[20,53],"IC":[22,55],"substrates":[23,56,63,135,237],"on":[24,31,59,176,235,311],"one":[25],"hand":[26],"advanced":[28,69,134],"packaging":[29,70,132,340],"applications":[30],"other":[33],"hand.":[34],"Historically":[35],"both":[36,126,153,314,344],"application":[37,162],"areas":[38,110,127,154,260],"were":[39,57],"clearly":[40],"defined":[41],"separated":[43],"by":[44],"different":[45,295],"requirements":[46],"feature":[48,171,225,233,296],"sizes":[49,172,226,297],"substrate":[51,118,305],"formats.":[52],"based":[58,74,328,339],"organic":[60,315],"large":[61,66,177,236],"scale":[62,178],"with":[64,75,173,231,294],"rather":[65],"features":[67,81],"while":[68,158],"technology":[71,331],"wafer":[73,130],"capability":[77],"to":[78,83,141,146,228,239,336],"incorporate":[79],"fine":[80],"down":[82,227],"few":[85],"microns.":[86],"The":[87,250,319],"ever":[88],"increasing":[89],"demand":[90],"higher":[92],"performance,":[93],"lower":[94],"cost":[95],"thinner":[97],"end":[98],"user":[99],"devices":[100],"like":[101,128,187],"smartphones":[102],"require":[103],"intense":[104],"developments":[105],"innovation":[107],"all":[109],"electronic":[113],"component":[114],"design":[115],"including":[116],"chip":[120],"packaging.":[121],"Latest":[122],"technologies":[124,186],"fan-out":[129],"level":[131],"are":[136,155,309],"constantly":[137],"emerging":[138],"promise":[140],"be":[142,193,290],"critical":[144,258],"piece":[145],"meet":[147,343],"these":[148],"requirements.":[149,348],"As":[150],"consequence":[152],"currently":[156],"merging":[157],"creating":[159],"new":[161],"segment.":[163],"This":[164],"segment":[165],"combines":[166],"request":[168],"small":[170],"manufacturability":[175],"substrates.":[179,318],"Obviously":[180],"many":[181],"traditional":[184],"plating":[188,248,263,329],"available":[190],"equipment":[191],"cannot":[192],"easily":[194],"adopted":[195],"need":[197],"certain":[198],"developments,":[199],"adaptions":[200],"improvements.":[202],"In":[203],"this":[204],"respect,":[205],"challenge":[208],"area":[211],"electrolytic":[213],"combination":[218],"various":[220],"challenging":[221],"requirements:":[222],"creation":[223],"2\u03bcm":[229],"L/S":[230],"heterogeneous":[232],"density":[234],"up":[238],"600mm":[240],"at":[241],"excellent":[242],"thickness":[244],"uniformity":[245],"high":[247],"speed.":[249],"paper":[251],"presents":[252],"latest":[253,282,320],"studies":[254],"conclusions":[256],"performance":[259],"such":[265],"as":[266],"electrolyte":[267],"fluid":[268],"dynamics,":[269],"impact":[270],"anode":[272],"design,":[273],"pulse":[274],"reverse":[275],"rectification":[276],"newly":[278],"designed":[279],"electrolytes.":[280],"Finally":[281],"test":[283],"results":[284],"optimized":[286],"conditions":[288],"will":[289,332],"discussed":[291,326],"detail":[293],"providing":[298],"data":[299],"within":[301,304],"die":[302],"uniformity.":[306],"All":[307],"tests":[308],"done":[310],"panel":[312,327,338],"level,":[313],"glass":[317],"findings":[321],"achievements":[323],"support":[333],"industry":[335],"develop":[337],"processes":[341],"that":[342],"technical":[345],"commercial":[347]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-09-22T06:50:58.402377","created_date":"2018-12-22T00:00:00"}