{"id":"https://openalex.org/W2895894115","doi":"https://doi.org/10.1016/j.intermet.2018.10.011","title":"Insight into micro-cracking in 3D-printed Fe-based BMGs by selective laser melting","display_name":"Insight into micro-cracking in 3D-printed Fe-based BMGs by selective laser melting","publication_year":2018,"publication_date":"2018-10-23","ids":{"openalex":"https://openalex.org/W2895894115","doi":"https://doi.org/10.1016/j.intermet.2018.10.011","mag":"2895894115"},"language":"en","primary_location":{"id":"doi:10.1016/j.intermet.2018.10.011","doi":"https://doi.org/10.1016/j.intermet.2018.10.011","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.intermet.2018.10.011","pdf_url":null,"source":{"id":"https://openalex.org/S38855548","display_name":"Intermetallics","issn_l":"0966-9795","issn":["0966-9795","1879-0216"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Intermetallics","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101547642","display_name":"Xing Wei","orcid":"https://orcid.org/0000-0001-6147-6967","observed_orcids":["https://orcid.org/0000-0001-6147-6967"]},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Xing","raw_affiliation_strings":["School of Materials Science and Engineering and State Key Lab for Materials Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering and State Key Lab for Materials Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024426578","display_name":"Di Ouyang","orcid":"https://orcid.org/0000-0002-2502-8478","observed_orcids":["https://orcid.org/0000-0002-2502-8478"]},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Di Ouyang","raw_affiliation_strings":["School of Materials Science and Engineering and State Key Lab for Materials Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering and State Key Lab for Materials Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100710685","display_name":"Ning Li","orcid":"https://orcid.org/0000-0003-4408-2944","observed_orcids":["https://orcid.org/0000-0003-4408-2944"]},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ning Li","raw_affiliation_strings":["School of Materials Science and Engineering and State Key Lab for Materials Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering and State Key Lab for Materials Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100383314","display_name":"Lin Liu","orcid":"https://orcid.org/0000-0002-7728-0317","observed_orcids":["https://orcid.org/0000-0002-7728-0317","https://orcid.org/0009-0001-4945-3612"]},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Lin Liu","raw_affiliation_strings":["School of Materials Science and Engineering and State Key Lab for Materials Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Materials Science and Engineering and State Key Lab for Materials Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, China","institution_ids":["https://openalex.org/I47720641"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5100383314"],"corresponding_institution_ids":["https://openalex.org/I47720641"],"apc_list":{"value":2730,"currency":"USD","value_usd":2730},"apc_paid":null,"fwci":1.9836,"has_fulltext":false,"cited_by_count":36,"citation_normalized_percentile":{"value":0.83870546,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":99},"biblio":{"volume":"103","issue":null,"first_page":"101","last_page":"106"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10633","display_name":"Metallic Glasses and Amorphous Alloys","score":0.7348999977111816,"subfield":{"id":"https://openalex.org/subfields/2506","display_name":"Metals and Alloys"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10633","display_name":"Metallic Glasses and Amorphous Alloys","score":0.7348999977111816,"subfield":{"id":"https://openalex.org/subfields/2506","display_name":"Metals and Alloys"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.24660000205039978,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.0031999999191612005,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microcracking","display_name":"microcracking","score":0.8399999737739563},{"id":"https://openalex.org/keywords/fe-based-bulk-metallic-glasses","display_name":"Fe-based bulk metallic glasses","score":0.9269999861717224},{"id":"https://openalex.org/keywords/laser-powder-bed-fusion","display_name":"laser powder bed fusion","score":0.9900000095367432},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.8899999856948853},{"id":"https://openalex.org/keywords/thermal-stress-concentration","display_name":"thermal stress concentration","score":0.7850000262260437},{"id":"https://openalex.org/keywords/micropores","display_name":"micropores","score":0.9549999833106995},{"id":"https://openalex.org/keywords/pore-size","display_name":"pore size","score":0.7940000295639038},{"id":"https://openalex.org/keywords/molten-pool","display_name":"molten pool","score":0.8240000009536743},{"id":"https://openalex.org/keywords/heat-affected-zone","display_name":"heat-affected zone","score":0.9350000023841858},{"id":"https://openalex.org/keywords/crack-initiation","display_name":"crack initiation","score":0.621999979019165},{"id":"https://openalex.org/keywords/finite-element-analysis","display_name":"finite element analysis","score":0.6299999952316284}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.9280089139938354},{"id":"https://openalex.org/C26796778","wikidata":"https://www.wikidata.org/wiki/Q2267983","display_name":"Selective laser melting","level":3,"score":0.8337911367416382},{"id":"https://openalex.org/C58396970","wikidata":"https://www.wikidata.org/wiki/Q212749","display_name":"Cracking","level":2,"score":0.7329152822494507},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.6759935617446899},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6264337301254272},{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.6016108989715576},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5575289130210876},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.5450078248977661},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5164054036140442},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.44757747650146484},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.35106271505355835},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.12325650453567505},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.08377248048782349},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.08226427435874939},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.06053838133811951},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C136229726","wikidata":"https://www.wikidata.org/wiki/Q327092","display_name":"Biomedical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.intermet.2018.10.011","doi":"https://doi.org/10.1016/j.intermet.2018.10.011","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.intermet.2018.10.011","pdf_url":null,"source":{"id":"https://openalex.org/S38855548","display_name":"Intermetallics","issn_l":"0966-9795","issn":["0966-9795","1879-0216"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Intermetallics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G5480499243","display_name":null,"funder_award_id":"51531003","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320321883","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":33,"referenced_works":["https://openalex.org/W587588427","https://openalex.org/W971039254","https://openalex.org/W1964254287","https://openalex.org/W1965065859","https://openalex.org/W1970595242","https://openalex.org/W1983642299","https://openalex.org/W1984715892","https://openalex.org/W1995458584","https://openalex.org/W2003723424","https://openalex.org/W2007975557","https://openalex.org/W2010589672","https://openalex.org/W2025080421","https://openalex.org/W2049993169","https://openalex.org/W2052162875","https://openalex.org/W2065581009","https://openalex.org/W2082938366","https://openalex.org/W2102981663","https://openalex.org/W2118142066","https://openalex.org/W2128924706","https://openalex.org/W2262267581","https://openalex.org/W2278477939","https://openalex.org/W2522499457","https://openalex.org/W2581447699","https://openalex.org/W2588300513","https://openalex.org/W2739448499","https://openalex.org/W2752813433","https://openalex.org/W2766640915","https://openalex.org/W2791853209","https://openalex.org/W2792520564","https://openalex.org/W2793997191","https://openalex.org/W2807289322","https://openalex.org/W2887658620","https://openalex.org/W2888625228"],"related_works":["https://openalex.org/W2791853209","https://openalex.org/W2945443491","https://openalex.org/W3017338247","https://openalex.org/W2739448499","https://openalex.org/W3145860805","https://openalex.org/W4310907888","https://openalex.org/W2021078117","https://openalex.org/W2909847833","https://openalex.org/W2998043385","https://openalex.org/W2887658620"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":8},{"year":2021,"cited_by_count":5},{"year":2020,"cited_by_count":6},{"year":2019,"cited_by_count":1}],"updated_date":"2026-11-10T11:39:43.021295","created_date":"2018-10-26T00:00:00"}