{"id":"https://openalex.org/W2889530357","doi":"https://doi.org/10.4028/www.scientific.net/ssp.282.190","title":"Cleaning of High Aspect Ratio STI Structures for Advanced Logic Devices by Implementation of a Surface Modification Drying Technique","display_name":"Cleaning of High Aspect Ratio STI Structures for Advanced Logic Devices by Implementation of a Surface Modification Drying Technique","publication_year":2018,"publication_date":"2018-08-01","ids":{"openalex":"https://openalex.org/W2889530357","doi":"https://doi.org/10.4028/www.scientific.net/ssp.282.190","mag":"2889530357"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/ssp.282.190","doi":"https://doi.org/10.4028/www.scientific.net/ssp.282.190","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/ssp.282.190","pdf_url":null,"source":{"id":"https://openalex.org/S187696258","display_name":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","issn_l":"1012-0394","issn":["1012-0394","1662-9779","1662-9787"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4322614515","host_organization_name":"Scientific.net","host_organization_lineage":["https://openalex.org/P4322614515"],"host_organization_lineage_names":["Scientific.net"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Solid State Phenomena","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020622600","display_name":"Farid Sebaai","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Farid Sebaai","raw_affiliation_strings":["IMEC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034373550","display_name":"Guy Vereecke","orcid":"https://orcid.org/0000-0001-9058-9338","observed_orcids":["https://orcid.org/0000-0001-9058-9338"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Guy Vereecke","raw_affiliation_strings":["IMEC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024377671","display_name":"XiuMei Xu","orcid":"https://orcid.org/0000-0002-3356-8693","observed_orcids":["https://orcid.org/0000-0002-3356-8693"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Xiu Mei Xu","raw_affiliation_strings":["IMEC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074277744","display_name":"S. Baudot","orcid":"https://orcid.org/0009-0009-2671-0784","observed_orcids":["https://orcid.org/0009-0009-2671-0784"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Sylvain Baudot","raw_affiliation_strings":["IMEC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086169121","display_name":"Fumihiro Amemiya","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210137430","display_name":"Central Glass (Japan)","ror":"https://ror.org/03q1pf281","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210137430"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Fumihiro Amemiya","raw_affiliation_strings":["CENTRAL GLASS"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CENTRAL GLASS","institution_ids":["https://openalex.org/I4210137430"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081976222","display_name":"Kana Komori","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405273708","display_name":"SCREEN Semiconductor Solutions Co., Ltd. (Japan)","ror":"https://ror.org/00aywkt47","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405273708"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kana Komori","raw_affiliation_strings":["SCREEN Semiconductor Solutions Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SCREEN Semiconductor Solutions Co., Ltd","institution_ids":["https://openalex.org/I4405273708"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5033966941","display_name":"Frank Holsteyns","orcid":"https://orcid.org/0009-0002-2123-452X","observed_orcids":["https://orcid.org/0009-0002-2123-452X"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Frank Holsteyns","raw_affiliation_strings":["IMEC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.2872,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.51560767,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"282","issue":null,"first_page":"190","last_page":"193"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.8560000061988831,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.8560000061988831,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.10249999910593033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.026799999177455902,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/finfet","display_name":"FinFET","score":0.6000000238418579},{"id":"https://openalex.org/keywords/high-aspect-ratio-structures","display_name":"high aspect ratio structures","score":0.6330000162124634},{"id":"https://openalex.org/keywords/pattern-collapse","display_name":"pattern collapse","score":0.6480000019073486}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8638044595718384},{"id":"https://openalex.org/C91721477","wikidata":"https://www.wikidata.org/wiki/Q778612","display_name":"Fin","level":2,"score":0.833869457244873},{"id":"https://openalex.org/C115537861","wikidata":"https://www.wikidata.org/wiki/Q7645993","display_name":"Surface modification","level":2,"score":0.6515655517578125},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.5498287677764893},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5307274460792542},{"id":"https://openalex.org/C2776799497","wikidata":"https://www.wikidata.org/wiki/Q484298","display_name":"Surface (topology)","level":2,"score":0.48528048396110535},{"id":"https://openalex.org/C2776363543","wikidata":"https://www.wikidata.org/wiki/Q7645982","display_name":"Surface integrity","level":3,"score":0.48390135169029236},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.43101319670677185},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.418630987405777},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3447292447090149},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.24378043413162231},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.06397342681884766},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.058142781257629395},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4028/www.scientific.net/ssp.282.190","doi":"https://doi.org/10.4028/www.scientific.net/ssp.282.190","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/ssp.282.190","pdf_url":null,"source":{"id":"https://openalex.org/S187696258","display_name":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","issn_l":"1012-0394","issn":["1012-0394","1662-9779","1662-9787"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4322614515","host_organization_name":"Scientific.net","host_organization_lineage":["https://openalex.org/P4322614515"],"host_organization_lineage_names":["Scientific.net"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Solid State Phenomena","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1981938403","https://openalex.org/W2080821840","https://openalex.org/W2087056949","https://openalex.org/W2251915233","https://openalex.org/W2739782113"],"related_works":["https://openalex.org/W4399396031","https://openalex.org/W2045506502","https://openalex.org/W4234259487","https://openalex.org/W7163161299","https://openalex.org/W2518800176","https://openalex.org/W379492162","https://openalex.org/W2134929968","https://openalex.org/W4242829552","https://openalex.org/W4236157922","https://openalex.org/W2084751142"],"abstract_inverted_index":{"The":[0],"continuous":[1],"down":[2],"scaling":[3],"of":[4,28,58,78],"the":[5,8,16,26,29,56,65,71,76,79],"dimensions":[6],"for":[7],"logic":[9],"devices":[10],"has":[11,46],"imposed":[12],"to":[13,63,69],"carefully":[14],"track":[15],"pattern":[17],"collapse":[18],"issue":[19],"when":[20],"cleaning":[21,39],"after":[22],"FIN":[23,36,72,80],"etch.":[24],"Showing":[25],"limitations":[27],"hot":[30],"IPA":[31],"drying":[32,44],"technique":[33,45],"toward":[34],"scaled":[35],"dimensions,":[37],"a":[38,41],"using":[40],"surface":[42,73],"modification":[43],"been":[47],"proposed":[48],"and":[49],"successfully":[50],"implemented.":[51],"It":[52],"is":[53],"also":[54],"discussed":[55],"use":[57],"some":[59],"post":[60],"treatment":[61],"solutions":[62],"remove":[64],"grafted":[66],"layer":[67],"used":[68],"modify":[70],"while":[74],"preserving":[75],"integrity":[77],"structures.":[81]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2018-09-07T00:00:00"}