{"id":"https://openalex.org/W2886857585","doi":"https://doi.org/10.1109/edtm.2018.8421528","title":"A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration","display_name":"A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration","publication_year":2018,"publication_date":"2018-03-01","ids":{"openalex":"https://openalex.org/W2886857585","doi":"https://doi.org/10.1109/edtm.2018.8421528","mag":"2886857585"},"language":"en","primary_location":{"id":"doi:10.1109/edtm.2018.8421528","doi":"https://doi.org/10.1109/edtm.2018.8421528","is_oa":false,"landing_page_url":"https://doi.org/10.1109/edtm.2018.8421528","pdf_url":null,"source":{"id":"https://openalex.org/S4363608262","display_name":"IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)","raw_type":"proceedings-article"},"parent_works":[],"lineage":["https://openalex.org/W2886857585"],"child_works_count":0,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089198648","display_name":"SeungNam Son","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"SeungNam Son","raw_affiliation_strings":["Amkor Technology Korea, Incheon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Amkor Technology Korea, Incheon, Republic of Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034776364","display_name":"HoDol Yoo","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"HoDol Yoo","raw_affiliation_strings":["Amkor Technology Korea, Incheon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Amkor Technology Korea, Incheon, Republic of Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"Ji Hyun Kim","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ji Hyun Kim","raw_affiliation_strings":["Amkor Technology Korea, Incheon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Amkor Technology Korea, Incheon, Republic of Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052700598","display_name":"JooHyun Kim","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"JooHyun Kim","raw_affiliation_strings":["Amkor Technology Korea, Incheon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Amkor Technology Korea, Incheon, Republic of Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068356978","display_name":"Doowon Lee","orcid":"https://orcid.org/0000-0001-6635-5953","observed_orcids":["https://orcid.org/0000-0001-6635-5953","https://orcid.org/0000-0001-8251-0714"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"DooWon Lee","raw_affiliation_strings":["Amkor Technology Korea, Incheon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Amkor Technology Korea, Incheon, Republic of Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045894895","display_name":"WonChul Do","orcid":"https://orcid.org/0009-0002-0459-7396","observed_orcids":["https://orcid.org/0009-0002-0459-7396"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"WonChul Do","raw_affiliation_strings":["Amkor Technology Korea, Incheon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Amkor Technology Korea, Incheon, Republic of Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060123399","display_name":"Yun Ra","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210131320","display_name":"LG (South Korea)","ror":"https://ror.org/03ddh2c27","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210131320"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yun Ra","raw_affiliation_strings":["LG Electronics, Inc., Seoul, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"LG Electronics, Inc., Seoul, Republic of Korea","institution_ids":["https://openalex.org/I4210131320"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055259782","display_name":"Kwangsup So","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210131320","display_name":"LG (South Korea)","ror":"https://ror.org/03ddh2c27","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210131320"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"KwangSup So","raw_affiliation_strings":["LG Electronics, Inc., Seoul, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"LG Electronics, Inc., Seoul, Republic of Korea","institution_ids":["https://openalex.org/I4210131320"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081327579","display_name":"Woo-Hyun Paik","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210131320","display_name":"LG (South Korea)","ror":"https://ror.org/03ddh2c27","country_code":"KR","type":"company","lineage":["https://openalex.org/I4210131320"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"WooHyun Paik","raw_affiliation_strings":["LG Electronics, Inc., Seoul, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"LG Electronics, Inc., Seoul, Republic of Korea","institution_ids":["https://openalex.org/I4210131320"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101899300","display_name":"Kangwook Lee","orcid":"https://orcid.org/0000-0002-3360-9678","observed_orcids":["https://orcid.org/0000-0002-3360-9678"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"KangWook Lee","raw_affiliation_strings":["Amkor Technology Korea, Incheon, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Amkor Technology Korea, Incheon, Republic of Korea","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.7992,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.59929565,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"230","last_page":"232"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9940999746322632,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9940999746322632,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0035000001080334187,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/heterogeneous-integration","display_name":"heterogeneous integration","score":0.9950000047683716},{"id":"https://openalex.org/keywords/power-management-integrated-circuits","display_name":"power management integrated circuits","score":0.9810000061988831},{"id":"https://openalex.org/keywords/application-processor","display_name":"application processor","score":0.7400000095367432},{"id":"https://openalex.org/keywords/passive-components","display_name":"passive components","score":0.5569999814033508}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6609485745429993},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.646854817867279},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.6261719465255737},{"id":"https://openalex.org/C68812741","wikidata":"https://www.wikidata.org/wiki/Q636609","display_name":"Fan-out","level":3,"score":0.5901662111282349},{"id":"https://openalex.org/C193149544","wikidata":"https://www.wikidata.org/wiki/Q7122904","display_name":"Packaging engineering","level":2,"score":0.5728468894958496},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5401079058647156},{"id":"https://openalex.org/C2778638305","wikidata":"https://www.wikidata.org/wiki/Q7406100","display_name":"Wafer-scale integration","level":3,"score":0.5122372508049011},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5047367811203003},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.4723682999610901},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.46531084179878235},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.4606371819972992},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4477955996990204},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.44635331630706787},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.436175674200058},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4304021894931793},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.42723333835601807},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4228721261024475},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.39700841903686523},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.38081181049346924},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3696707785129547},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2701316773891449},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.15697917342185974},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/edtm.2018.8421528","doi":"https://doi.org/10.1109/edtm.2018.8421528","is_oa":false,"landing_page_url":"https://doi.org/10.1109/edtm.2018.8421528","pdf_url":null,"source":{"id":"https://openalex.org/S4363608262","display_name":"IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5378999710083008,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2742287143"],"related_works":["https://openalex.org/W2086858363","https://openalex.org/W2289001872","https://openalex.org/W4416883910","https://openalex.org/W1982189691","https://openalex.org/W4416885014","https://openalex.org/W4309811420","https://openalex.org/W2887899820","https://openalex.org/W2756152235","https://openalex.org/W6997986409","https://openalex.org/W2885808966"],"abstract_inverted_index":{"A":[0],"new":[1],"Wafer":[2],"Level":[3],"System-in-Package":[4],"(WLSiP)":[5],"has":[6],"been":[7],"designed":[8],"and":[9,23,67],"developed":[10],"where":[11],"Application":[12],"Processor":[13],"(AP),":[14],"Low":[15],"Power":[16,24],"Double":[17],"Data":[18],"Rate":[19],"4":[20],"(LPDDR4)":[21],"memory,":[22],"Management":[25],"Integrated":[26],"Circuit":[27],"(PMIC)":[28],"semiconductor":[29],"technologies":[30],"as":[31,33],"well":[32],"passive":[34],"components":[35],"are":[36],"integrated":[37],"using":[38],"High-Density":[39],"Fan-Out":[40],"(HDFO)":[41],"packaging":[42,50],"technology.":[43],"Compared":[44],"to":[45],"current":[46],"laminate":[47],"substrate":[48,58],"based":[49],"technology,":[51],"this":[52],"solution":[53],"shows":[54],"87%":[55],"reduction":[56],"in":[57],"thickness,":[59],"6.7\u00b0C":[60],"lower":[61],"temperature":[62],"on":[63],"the":[64,71],"AP":[65],"chip":[66],"10%":[68],"enhancement":[69],"of":[70],"electrical":[72],"performance.":[73]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-11-14T11:04:58.165337","created_date":"2018-08-22T00:00:00"}