{"id":"https://openalex.org/W2885200725","doi":"https://doi.org/10.1109/ectc.2018.00094","title":"Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers","display_name":"Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers","publication_year":2018,"publication_date":"2018-05-01","ids":{"openalex":"https://openalex.org/W2885200725","doi":"https://doi.org/10.1109/ectc.2018.00094","mag":"2885200725"},"language":"en","primary_location":{"id":"doi:10.1109/ectc.2018.00094","doi":"https://doi.org/10.1109/ectc.2018.00094","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc.2018.00094","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5000222202","display_name":"John Hon-Shing Lau","orcid":"https://orcid.org/0000-0003-1284-8829","observed_orcids":["https://orcid.org/0000-0003-1284-8829"]},"institutions":[{"id":"https://openalex.org/I4210129155","display_name":"ASM Pacific Technology (China)","ror":"https://ror.org/03nvser95","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210129155"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"John Lau","raw_affiliation_strings":["ASM Pacific Technology Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASM Pacific Technology Ltd","institution_ids":["https://openalex.org/I4210129155"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Wu Kai","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129155","display_name":"ASM Pacific Technology (China)","ror":"https://ror.org/03nvser95","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210129155"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wu Kai","raw_affiliation_strings":["ASM Pacific Technology Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASM Pacific Technology Ltd","institution_ids":["https://openalex.org/I4210129155"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101039741","display_name":"Nelson Fan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129155","display_name":"ASM Pacific Technology (China)","ror":"https://ror.org/03nvser95","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210129155"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Nelson Fan","raw_affiliation_strings":["ASM Pacific Technology Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASM Pacific Technology Ltd","institution_ids":["https://openalex.org/I4210129155"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049713089","display_name":"Eric Kuah","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129155","display_name":"ASM Pacific Technology (China)","ror":"https://ror.org/03nvser95","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210129155"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Eric Kuah","raw_affiliation_strings":["ASM Pacific Technology Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASM Pacific Technology Ltd","institution_ids":["https://openalex.org/I4210129155"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100418956","display_name":"Zhang Li","orcid":"https://orcid.org/0000-0002-0440-7014","observed_orcids":["https://orcid.org/0000-0002-0440-7014"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Zhang Li","raw_affiliation_strings":["Jiangyin Changdian Advanced Packaging Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangyin Changdian Advanced Packaging Co., Ltd","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"Kim Hwee Tan","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kim Hwee Tan","raw_affiliation_strings":["Jiangyin Changdian Advanced Packaging Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangyin Changdian Advanced Packaging Co., Ltd","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074139357","display_name":"Winsons Bao","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Winsons Bao","raw_affiliation_strings":["DISCO Hi-Tec China Co., LTD"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DISCO Hi-Tec China Co., LTD","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050829175","display_name":"Sze Pei Lim","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Sze Pei Lim","raw_affiliation_strings":["Indlum Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indlum Corporation","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019367836","display_name":"Rozalia Beica","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Rozalia Beica","raw_affiliation_strings":["Unimicron Technology Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Unimicron Technology Corporation","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111856105","display_name":"C. T. Ko","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210133143","display_name":"Dow Chemical (United States)","ror":"https://ror.org/032hx4q18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210133143"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C.T. Ko","raw_affiliation_strings":["Dow Chemical Company"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dow Chemical Company","institution_ids":["https://openalex.org/I4210133143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101683992","display_name":"Xi Cao","orcid":"https://orcid.org/0000-0001-5303-2442","observed_orcids":["https://orcid.org/0000-0001-5303-2442"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Cao Xi","raw_affiliation_strings":["Huawei Technologies Co. Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Huawei Technologies Co. Ltd","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"Ming Li","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129155","display_name":"ASM Pacific Technology (China)","ror":"https://ror.org/03nvser95","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210129155"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Li","raw_affiliation_strings":["ASM Pacific Technology Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASM Pacific Technology Ltd","institution_ids":["https://openalex.org/I4210129155"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048369492","display_name":"Lei Yang","orcid":"https://orcid.org/0000-0002-3481-2379","observed_orcids":["https://orcid.org/0000-0002-3481-2379"]},"institutions":[{"id":"https://openalex.org/I4210129155","display_name":"ASM Pacific Technology (China)","ror":"https://ror.org/03nvser95","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210129155"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Lei","raw_affiliation_strings":["ASM Pacific Technology Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASM Pacific Technology Ltd","institution_ids":["https://openalex.org/I4210129155"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084843301","display_name":"Margie Li","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129155","display_name":"ASM Pacific Technology (China)","ror":"https://ror.org/03nvser95","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210129155"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Margie Li","raw_affiliation_strings":["ASM Pacific Technology Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASM Pacific Technology Ltd","institution_ids":["https://openalex.org/I4210129155"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043526217","display_name":"Iris Xu","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Iris Xu","raw_affiliation_strings":["Jiangyin Changdian Advanced Packaging Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangyin Changdian Advanced Packaging Co., Ltd","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101994456","display_name":"Tony Chen","orcid":"https://orcid.org/0000-0002-3160-622X","observed_orcids":["https://orcid.org/0000-0002-3160-622X"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Tony Chen","raw_affiliation_strings":["Jiangyin Changdian Advanced Packaging Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangyin Changdian Advanced Packaging Co., Ltd","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065725055","display_name":"Sandy Chen","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Sandy Chen","raw_affiliation_strings":["DISCO Hi-Tec China Co., LTD"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DISCO Hi-Tec China Co., LTD","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052446438","display_name":"Qing Xiang Yong","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Qing Xiang Yong","raw_affiliation_strings":["Huawei Technologies Co. Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Huawei Technologies Co. Ltd","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108259202","display_name":"Kumar Janardhanan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210129155","display_name":"ASM Pacific Technology (China)","ror":"https://ror.org/03nvser95","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210129155"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kumar Janardhanan","raw_affiliation_strings":["ASM Pacific Technology Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASM Pacific Technology Ltd","institution_ids":["https://openalex.org/I4210129155"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.6013,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.80583904,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"594","last_page":"600"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.774399995803833,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.774399995803833,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.2215999960899353,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/warpage","display_name":"warpage","score":0.8339999914169312},{"id":"https://openalex.org/keywords/fan-out-wafer-level-packaging","display_name":"fan-out wafer-level packaging","score":0.9959999918937683},{"id":"https://openalex.org/keywords/epoxy-molding-compound","display_name":"epoxy molding compound","score":0.9769999980926514},{"id":"https://openalex.org/keywords/reflow-temperature","display_name":"reflow temperature","score":0.8050000071525574},{"id":"https://openalex.org/keywords/3d-finite-element-simulation","display_name":"3D finite element simulation","score":0.949999988079071},{"id":"https://openalex.org/keywords/warpage-control","display_name":"warpage control","score":0.7260000109672546}],"concepts":[{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.8793977499008179},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.7346056699752808},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6441339254379272},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.6429468989372253},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.6246748566627502},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6170755624771118},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.5994242429733276},{"id":"https://openalex.org/C68812741","wikidata":"https://www.wikidata.org/wiki/Q636609","display_name":"Fan-out","level":3,"score":0.5455474853515625},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.5250603556632996},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5194334983825684},{"id":"https://openalex.org/C166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","level":2,"score":0.47756391763687134},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.43539249897003174},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.435139536857605},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.41926664113998413},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.38730350136756897},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.36832737922668457},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3026657700538635},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2666093409061432},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20099487900733948},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.16121432185173035},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.13529041409492493},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ectc.2018.00094","doi":"https://doi.org/10.1109/ectc.2018.00094","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc.2018.00094","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1545641439","https://openalex.org/W1966332204","https://openalex.org/W2001039607","https://openalex.org/W2001945326","https://openalex.org/W2026723811","https://openalex.org/W2055068681","https://openalex.org/W2103105518","https://openalex.org/W2144114410","https://openalex.org/W2511558441","https://openalex.org/W2515277349","https://openalex.org/W2735326361","https://openalex.org/W2743599321","https://openalex.org/W2745054773","https://openalex.org/W2778646525","https://openalex.org/W2802403743","https://openalex.org/W4256423915","https://openalex.org/W6650770651"],"related_works":["https://openalex.org/W2743599321","https://openalex.org/W2907776258","https://openalex.org/W2919390978","https://openalex.org/W2898030615","https://openalex.org/W4399108426","https://openalex.org/W3192341508","https://openalex.org/W2971727857","https://openalex.org/W2886441895","https://openalex.org/W3010701288","https://openalex.org/W4295038287"],"abstract_inverted_index":{"In":[0],"this":[1],"study,":[2],"the":[3,35,43,46,64,71,76,81,100,107],"warpages":[4,44,108],"of":[5,42,63],"a":[6,16],"chip-first":[7],"and":[8,22,29,37,74,85],"die":[9],"face-up":[10],"FOWLP":[11,47],"(fan-out":[12],"wafer-level":[13],"packaging)":[14],"with":[15],"very":[17],"large":[18],"silicon":[19],"chip":[20],"(10mm\u00d710mm\u00d70.15mm)":[21],"three":[23],"RDLs":[24],"(redistributed":[25],"layers)":[26],"are":[27,97,109],"measured":[28],"characterized.":[30],"Emphasis":[31],"is":[32],"placed":[33],"on":[34,105],"measurement":[36,101],"3D":[38],"finite":[39],"element":[40],"simulation":[41,95],"during":[45],"fabrication":[48],"processes,":[49],"especially":[50],"for:":[51],"(a)":[52],"right":[53,60],"after":[54,61,80],"PMC":[55],"(post":[56],"mold":[57],"cure),":[58],"(b)":[59],"backgrinding":[62],"EMC":[65],"(epoxy":[66],"molding":[67],"compound)":[68],"to":[69,99],"expose":[70],"Cu-contact":[72],"pads,":[73],"(c)":[75],"individual":[77],"package":[78],"(right":[79],"solder":[82],"ball":[83],"mounting":[84],"dicing)":[86],"vs.":[87],"SMT":[88],"(surface":[89],"mount":[90],"technology)":[91],"reflow":[92],"temperatures.":[93],"The":[94],"results":[96],"compared":[98],"results.":[102],"Some":[103],"recommendations":[104],"controlling":[106],"provided.":[110]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1}],"updated_date":"2026-10-26T11:51:55.731654","created_date":"2018-08-22T00:00:00"}