{"id":"https://openalex.org/W286144375","doi":"https://doi.org/10.1016/j.mee.2015.04.116","title":"Formation, processing and characterization of Co\u2013Sn intermetallic compounds for potential integration in 3D interconnects","display_name":"Formation, processing and characterization of Co\u2013Sn intermetallic compounds for potential integration in 3D interconnects","publication_year":2015,"publication_date":"2015-05-14","ids":{"openalex":"https://openalex.org/W286144375","doi":"https://doi.org/10.1016/j.mee.2015.04.116","mag":"286144375"},"language":"en","primary_location":{"id":"doi:10.1016/j.mee.2015.04.116","doi":"https://doi.org/10.1016/j.mee.2015.04.116","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mee.2015.04.116","pdf_url":null,"source":{"id":"https://openalex.org/S158028765","display_name":"Microelectronic Engineering","issn_l":"0167-9317","issn":["0167-9317","1873-5568"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronic Engineering","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5056226511","display_name":"George P. Vakanas","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]},{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE","US"],"is_corresponding":true,"raw_author_name":"George Vakanas","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven 3001, Belgium","Intel Corporation, 5000 W. Chandler Blvd, Chandler, AZ 85226, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"Intel Corporation, 5000 W. Chandler Blvd, Chandler, AZ 85226, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103187809","display_name":"O Minho","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I114531698","display_name":"Tokyo Institute of Technology","ror":"https://ror.org/0112mx960","country_code":"JP","type":"education","lineage":["https://openalex.org/I114531698","https://openalex.org/I4400009020"]},{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE","JP"],"is_corresponding":false,"raw_author_name":"O. Minho","raw_affiliation_strings":["K.U.Leuven, Kasteelpark Arenberg 44 bus 2450, Leuven 3001, Belgium","Tokyo Institute of Technology, Nagatsuta-cho 4259-J2-1410, Yokohama-shi, Kanagawa-ken 226-8502, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"K.U.Leuven, Kasteelpark Arenberg 44 bus 2450, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I99464096"]},{"raw_affiliation_string":"Tokyo Institute of Technology, Nagatsuta-cho 4259-J2-1410, Yokohama-shi, Kanagawa-ken 226-8502, Japan","institution_ids":["https://openalex.org/I114531698"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050851268","display_name":"Biljana Dim\u010di\u0107","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Biljana Dimcic","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven 3001, Belgium","K.U.Leuven, Kasteelpark Arenberg 44 bus 2450, Leuven 3001, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"K.U.Leuven, Kasteelpark Arenberg 44 bus 2450, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I99464096"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033660264","display_name":"Kris Vanstreels","orcid":"https://orcid.org/0000-0002-4420-0966","observed_orcids":["https://orcid.org/0000-0002-4420-0966"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Kris Vanstreels","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven 3001, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091060318","display_name":"Bj\u00f6rn Vandecasteele","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Bjorn Vandecasteele","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven 3001, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025995510","display_name":"Inge De Preter","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Inge De Preter","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven 3001, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001763918","display_name":"Jaber Derakhshandeh","orcid":"https://orcid.org/0000-0003-2448-9165","observed_orcids":["https://orcid.org/0000-0003-2448-9165"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Jaber Derakhshandeh","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven 3001, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063785314","display_name":"Kenneth June Rebibis","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Kenneth Rebibis","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven 3001, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103102842","display_name":"Masanori Kajihara","orcid":"https://orcid.org/0000-0002-4777-9475","observed_orcids":["https://orcid.org/0000-0002-4777-9475"]},"institutions":[{"id":"https://openalex.org/I114531698","display_name":"Tokyo Institute of Technology","ror":"https://ror.org/0112mx960","country_code":"JP","type":"education","lineage":["https://openalex.org/I114531698","https://openalex.org/I4400009020"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masanori Kajihara","raw_affiliation_strings":["Tokyo Institute of Technology, Nagatsuta-cho 4259-J2-1410, Yokohama-shi, Kanagawa-ken 226-8502, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Institute of Technology, Nagatsuta-cho 4259-J2-1410, Yokohama-shi, Kanagawa-ken 226-8502, Japan","institution_ids":["https://openalex.org/I114531698"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073310038","display_name":"Ingrid De Wolf","orcid":"https://orcid.org/0000-0003-3822-5953","observed_orcids":["https://orcid.org/0000-0003-3822-5953"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Ingrid De Wolf","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven 3001, Belgium","K.U.Leuven, Kasteelpark Arenberg 44 bus 2450, Leuven 3001, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"K.U.Leuven, Kasteelpark Arenberg 44 bus 2450, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I99464096"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051712390","display_name":"Eric Beyne","orcid":"https://orcid.org/0000-0002-3096-050X","observed_orcids":["https://orcid.org/0000-0002-3096-050X"]},"institutions":[{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Eric Beyne","raw_affiliation_strings":["K.U.Leuven, Kasteelpark Arenberg 44 bus 2450, Leuven 3001, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"K.U.Leuven, Kasteelpark Arenberg 44 bus 2450, Leuven 3001, Belgium","institution_ids":["https://openalex.org/I99464096"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5056226511"],"corresponding_institution_ids":["https://openalex.org/I1343180700","https://openalex.org/I4210114974"],"apc_list":{"value":2860,"currency":"USD","value_usd":2860},"apc_paid":null,"fwci":1.2831,"has_fulltext":false,"cited_by_count":48,"citation_normalized_percentile":{"value":0.80371649,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"140","issue":null,"first_page":"72","last_page":"80"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.975600004196167,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.975600004196167,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.02319999970495701,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.6899999976158142},{"id":"https://openalex.org/keywords/3d-interconnects","display_name":"3D interconnects","score":0.8640000224113464},{"id":"https://openalex.org/keywords/solid-state-aging","display_name":"solid-state aging","score":0.7940000295639038},{"id":"https://openalex.org/keywords/parabolic-kinetics","display_name":"parabolic growth kinetics","score":0.8370000123977661},{"id":"https://openalex.org/keywords/cu-sn-intermetallic-compounds","display_name":"Cu-Sn intermetallic compounds","score":0.7369999885559082},{"id":"https://openalex.org/keywords/young-s-modulus","display_name":"Young's modulus","score":0.8370000123977661},{"id":"https://openalex.org/keywords/hardness","display_name":"hardness","score":0.9629999995231628},{"id":"https://openalex.org/keywords/interconnect-reliability","display_name":"interconnect reliability","score":0.746999979019165},{"id":"https://openalex.org/keywords/electromigration","display_name":"electromigration","score":0.5730000138282776}],"concepts":[{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.807640016078949},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7241078615188599},{"id":"https://openalex.org/C515602321","wikidata":"https://www.wikidata.org/wiki/Q740","display_name":"Cobalt","level":2,"score":0.6369694471359253},{"id":"https://openalex.org/C49326732","wikidata":"https://www.wikidata.org/wiki/Q1549892","display_name":"Nanoindentation","level":2,"score":0.5897170305252075},{"id":"https://openalex.org/C175708663","wikidata":"https://www.wikidata.org/wiki/Q899559","display_name":"X-ray photoelectron spectroscopy","level":2,"score":0.5761251449584961},{"id":"https://openalex.org/C2780547777","wikidata":"https://www.wikidata.org/wiki/Q368967","display_name":"Rutherford backscattering spectrometry","level":3,"score":0.5267723798751831},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.5059916377067566},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4677121043205261},{"id":"https://openalex.org/C88380143","wikidata":"https://www.wikidata.org/wiki/Q416674","display_name":"Dissolution","level":2,"score":0.4180299639701843},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.38001877069473267},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.36215680837631226},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.23734715580940247},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.23416370153427124},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.20136284828186035},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.18222376704216003},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.0}],"mesh":[],"locations_count":7,"locations":[{"id":"doi:10.1016/j.mee.2015.04.116","doi":"https://doi.org/10.1016/j.mee.2015.04.116","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mee.2015.04.116","pdf_url":null,"source":{"id":"https://openalex.org/S158028765","display_name":"Microelectronic Engineering","issn_l":"0167-9317","issn":["0167-9317","1873-5568"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronic Engineering","raw_type":"journal-article"},{"id":"pmh:oai:archive.ugent.be:6914188","doi":null,"is_oa":false,"landing_page_url":"http://hdl.handle.net/1854/LU-6914188","pdf_url":null,"source":{"id":"https://openalex.org/S4306400478","display_name":"Ghent University Academic Bibliography (Ghent University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I32597200","host_organization_name":"Ghent University","host_organization_lineage":["https://openalex.org/I32597200"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"ISSN: 0167-9317","raw_type":"info:eu-repo/semantics/article"},{"id":"pmh:oai:irdb.nii.ac.jp:00897:0004075149","doi":null,"is_oa":false,"landing_page_url":"http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100699417","pdf_url":null,"source":{"id":"https://openalex.org/S7407056385","display_name":"Institutional Repositories DataBase (IRDB)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I184597095","host_organization_name":"National Institute of Informatics","host_organization_lineage":["https://openalex.org/I184597095"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"},{"id":"pmh:oai:irdb.nii.ac.jp:00897:0004088320","doi":null,"is_oa":false,"landing_page_url":"http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100699368","pdf_url":null,"source":{"id":"https://openalex.org/S7407056385","display_name":"Institutional Repositories DataBase (IRDB)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I184597095","host_organization_name":"National Institute of Informatics","host_organization_lineage":["https://openalex.org/I184597095"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Microelectronic Engineering","raw_type":"journal article"},{"id":"pmh:oai:lirias2repo.kuleuven.be:123456789/516455","doi":null,"is_oa":false,"landing_page_url":"https://lirias.kuleuven.be/handle/123456789/516455","pdf_url":null,"source":{"id":"https://openalex.org/S7407055369","display_name":"Lirias","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Microelectronic Engineering, vol. 140, (72-80)","raw_type":"info:eu-repo/semantics/article"},{"id":"pmh:oai:t2r2.star.titech.ac.jp:50296592","doi":null,"is_oa":false,"landing_page_url":"http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100699368","pdf_url":null,"source":{"id":"https://openalex.org/S4377196385","display_name":"Tokyo Tech Research Repository (Tokyo Institute of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I114531698","host_organization_name":"Tokyo Institute of Technology","host_organization_lineage":["https://openalex.org/I114531698"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Journal Article"},{"id":"pmh:oai:t2r2.star.titech.ac.jp:50296689","doi":null,"is_oa":false,"landing_page_url":"http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100699417","pdf_url":null,"source":{"id":"https://openalex.org/S4377196385","display_name":"Tokyo Tech Research Repository (Tokyo Institute of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I114531698","host_organization_name":"Tokyo Institute of Technology","host_organization_lineage":["https://openalex.org/I114531698"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference Paper"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1965383034","https://openalex.org/W1979489960","https://openalex.org/W1979900487","https://openalex.org/W2007082661","https://openalex.org/W2012589746","https://openalex.org/W2036137359","https://openalex.org/W2046837632","https://openalex.org/W2063944065","https://openalex.org/W2127134962","https://openalex.org/W2331213425","https://openalex.org/W2535141760"],"related_works":["https://openalex.org/W3136357369","https://openalex.org/W2784057355","https://openalex.org/W840218351","https://openalex.org/W2964019489","https://openalex.org/W2735205595","https://openalex.org/W1539215832","https://openalex.org/W7208441022","https://openalex.org/W2073185212","https://openalex.org/W1976430641","https://openalex.org/W4286676163"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":9},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":11},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":1}],"updated_date":"2026-11-03T10:50:19.383937","created_date":"2016-06-24T00:00:00"}