{"id":"https://openalex.org/W2809290752","doi":"https://doi.org/10.1007/s10854-018-9410-8","title":"Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability","display_name":"Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability","publication_year":2018,"publication_date":"2018-06-19","ids":{"openalex":"https://openalex.org/W2809290752","doi":"https://doi.org/10.1007/s10854-018-9410-8","mag":"2809290752"},"language":"en","primary_location":{"id":"doi:10.1007/s10854-018-9410-8","doi":"https://doi.org/10.1007/s10854-018-9410-8","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10854-018-9410-8","pdf_url":null,"source":{"id":"https://openalex.org/S189509794","display_name":"Journal of Materials Science Materials in Electronics","issn_l":"0957-4522","issn":["0957-4522","1573-482X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Science: Materials in Electronics","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101802800","display_name":"Norliza Ismail","orcid":"https://orcid.org/0000-0001-5274-8967","observed_orcids":["https://orcid.org/0000-0001-5274-8967"]},"institutions":[{"id":"https://openalex.org/I885383172","display_name":"National University of Malaysia","ror":"https://ror.org/00bw8d226","country_code":"MY","type":"education","lineage":["https://openalex.org/I885383172"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Norliza Ismail","raw_affiliation_strings":["Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia","institution_ids":["https://openalex.org/I885383172"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103811070","display_name":"Roslina Ismail","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I33849332","display_name":"University of Malaya","ror":"https://ror.org/00rzspn62","country_code":"MY","type":"education","lineage":["https://openalex.org/I33849332"]},{"id":"https://openalex.org/I885383172","display_name":"National University of Malaysia","ror":"https://ror.org/00bw8d226","country_code":"MY","type":"education","lineage":["https://openalex.org/I885383172"]}],"countries":["MY"],"is_corresponding":true,"raw_author_name":"Roslina Ismail","raw_affiliation_strings":["Division of Fine Arts, Cultural Centre, University of Malaya, Wilayah Persekutuan, Kuala Lumpur, Malaysia","Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Division of Fine Arts, Cultural Centre, University of Malaya, Wilayah Persekutuan, Kuala Lumpur, Malaysia","institution_ids":["https://openalex.org/I33849332"]},{"raw_affiliation_string":"Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia","institution_ids":["https://openalex.org/I885383172"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101552440","display_name":"Azman Jalar","orcid":"https://orcid.org/0000-0002-8855-7537","observed_orcids":["https://orcid.org/0000-0002-8855-7537"]},"institutions":[{"id":"https://openalex.org/I885383172","display_name":"National University of Malaysia","ror":"https://ror.org/00bw8d226","country_code":"MY","type":"education","lineage":["https://openalex.org/I885383172"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Azman Jalar","raw_affiliation_strings":["Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia","institution_ids":["https://openalex.org/I885383172"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110922747","display_name":"Ghazali Omar","orcid":"https://orcid.org/0000-0002-6520-6259","observed_orcids":["https://orcid.org/0000-0002-6520-6259"]},"institutions":[{"id":"https://openalex.org/I32589535","display_name":"Universiti Teknikal Malaysia Melaka","ror":"https://ror.org/01xb6rs26","country_code":"MY","type":"education","lineage":["https://openalex.org/I32589535"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Ghazali Omar","raw_affiliation_strings":["Faculty of Mechanical Engineering, Universiti Teknikal Malaysia Melaka (UTEM), Melaka, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Faculty of Mechanical Engineering, Universiti Teknikal Malaysia Melaka (UTEM), Melaka, Malaysia","institution_ids":["https://openalex.org/I32589535"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037663845","display_name":"Emee Marina Salleh","orcid":"https://orcid.org/0000-0003-0639-8622","observed_orcids":["https://orcid.org/0000-0003-0639-8622"]},"institutions":[{"id":"https://openalex.org/I885383172","display_name":"National University of Malaysia","ror":"https://ror.org/00bw8d226","country_code":"MY","type":"education","lineage":["https://openalex.org/I885383172"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Emee Marina Salleh","raw_affiliation_strings":["Department of Materials Science, Faculty Science and Technology, Universiti Kebangsaan Malaysia (UKM), Bangi, Selangor, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science, Faculty Science and Technology, Universiti Kebangsaan Malaysia (UKM), Bangi, Selangor, Malaysia","institution_ids":["https://openalex.org/I885383172"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110564589","display_name":"Norinsan Kamil","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I885383172","display_name":"National University of Malaysia","ror":"https://ror.org/00bw8d226","country_code":"MY","type":"education","lineage":["https://openalex.org/I885383172"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Norinsan Kamil","raw_affiliation_strings":["Department of Materials Science, Faculty Science and Technology, Universiti Kebangsaan Malaysia (UKM), Bangi, Selangor, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science, Faculty Science and Technology, Universiti Kebangsaan Malaysia (UKM), Bangi, Selangor, Malaysia","institution_ids":["https://openalex.org/I885383172"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5079875941","display_name":"Irman Abdul Rahman","orcid":"https://orcid.org/0000-0002-2180-509X","observed_orcids":["https://orcid.org/0000-0002-2180-509X"]},"institutions":[{"id":"https://openalex.org/I885383172","display_name":"National University of Malaysia","ror":"https://ror.org/00bw8d226","country_code":"MY","type":"education","lineage":["https://openalex.org/I885383172"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Irman Abdul Rahman","raw_affiliation_strings":["Department of Nuclear Science, Universiti Kebangsaan Malaysia (UKM), Bangi, Selangor, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Nuclear Science, Universiti Kebangsaan Malaysia (UKM), Bangi, Selangor, Malaysia","institution_ids":["https://openalex.org/I885383172"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5103811070"],"corresponding_institution_ids":["https://openalex.org/I33849332","https://openalex.org/I885383172"],"apc_list":{"value":3990,"currency":"USD","value_usd":3990},"apc_paid":null,"fwci":0.7609,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.68113006,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":97},"biblio":{"volume":"29","issue":"15","first_page":"12910","last_page":"12916"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/solder-wettability","display_name":"solder wettability","score":0.9890000224113464},{"id":"https://openalex.org/keywords/sn-ag-cu-solder","display_name":"Sn-Ag-Cu solder","score":0.871999979019165},{"id":"https://openalex.org/keywords/sac305","display_name":"SAC305","score":0.9750000238418579},{"id":"https://openalex.org/keywords/no-clean-flux","display_name":"no-clean flux","score":0.8799999952316284},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.7749999761581421},{"id":"https://openalex.org/keywords/aromatic-functional-groups","display_name":"aromatic functional groups","score":0.9449999928474426},{"id":"https://openalex.org/keywords/contact-angle","display_name":"contact angle","score":0.828000009059906},{"id":"https://openalex.org/keywords/printed-circuit-board-assembly","display_name":"printed circuit board assembly","score":0.6420000195503235},{"id":"https://openalex.org/keywords/stencil-printing","display_name":"stencil printing","score":0.7480000257492065},{"id":"https://openalex.org/keywords/reflow-soldering","display_name":"reflow soldering","score":0.9309999942779541}],"concepts":[{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.9490523338317871},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.9201254844665527},{"id":"https://openalex.org/C6556556","wikidata":"https://www.wikidata.org/wiki/Q899239","display_name":"Contact angle","level":2,"score":0.8466635942459106},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7607676982879639},{"id":"https://openalex.org/C191281628","wikidata":"https://www.wikidata.org/wiki/Q977971","display_name":"Solder paste","level":3,"score":0.6770410537719727},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.6526276469230652},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.55678391456604},{"id":"https://openalex.org/C68709404","wikidata":"https://www.wikidata.org/wiki/Q1134475","display_name":"Flux (metallurgy)","level":2,"score":0.5404781103134155},{"id":"https://openalex.org/C175708663","wikidata":"https://www.wikidata.org/wiki/Q899559","display_name":"X-ray photoelectron spectroscopy","level":2,"score":0.4175773859024048},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3338289260864258},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.2439582347869873},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.06405100226402283},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s10854-018-9410-8","doi":"https://doi.org/10.1007/s10854-018-9410-8","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10854-018-9410-8","pdf_url":null,"source":{"id":"https://openalex.org/S189509794","display_name":"Journal of Materials Science Materials in Electronics","issn_l":"0957-4522","issn":["0957-4522","1573-482X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Science: Materials in Electronics","raw_type":"journal-article"},{"id":"pmh:oai:eprints.um.edu.my:21782","doi":null,"is_oa":false,"landing_page_url":"http://eprints.um.edu.my/21782/","pdf_url":null,"source":{"id":"https://openalex.org/S4306400330","display_name":"The University of Malaya Research Repository (University of Malaya)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I33849332","host_organization_name":"University of Malaya","host_organization_lineage":["https://openalex.org/I33849332"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G2980488364","display_name":null,"funder_award_id":"DPP-2015-042","funder_id":"https://openalex.org/F4320322699","funder_display_name":"Universiti Kebangsaan Malaysia"},{"id":"https://openalex.org/G6781328178","display_name":null,"funder_award_id":"GGPM-2017-048","funder_id":"https://openalex.org/F4320322699","funder_display_name":"Universiti Kebangsaan Malaysia"}],"funders":[{"id":"https://openalex.org/F4320322699","display_name":"Universiti Kebangsaan Malaysia","ror":"https://ror.org/00bw8d226"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":26,"referenced_works":["https://openalex.org/W64222769","https://openalex.org/W105839754","https://openalex.org/W1410526736","https://openalex.org/W1659821620","https://openalex.org/W1965595471","https://openalex.org/W1976710860","https://openalex.org/W1992235272","https://openalex.org/W2001439586","https://openalex.org/W2008492835","https://openalex.org/W2010236096","https://openalex.org/W2017278882","https://openalex.org/W2028433700","https://openalex.org/W2031753082","https://openalex.org/W2032944440","https://openalex.org/W2037336309","https://openalex.org/W2064415184","https://openalex.org/W2066057005","https://openalex.org/W2086380577","https://openalex.org/W2110564338","https://openalex.org/W2144279396","https://openalex.org/W2295818416","https://openalex.org/W2325063030","https://openalex.org/W2346842750","https://openalex.org/W2470835006","https://openalex.org/W2588905132","https://openalex.org/W4255886946"],"related_works":["https://openalex.org/W2091808551","https://openalex.org/W3006347948","https://openalex.org/W2037336309","https://openalex.org/W3209152106","https://openalex.org/W2165684522","https://openalex.org/W2351803687","https://openalex.org/W2567931383","https://openalex.org/W2034353505","https://openalex.org/W2032944440","https://openalex.org/W2093454725"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":4}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2018-06-29T00:00:00"}