{"id":"https://openalex.org/W2808020255","doi":"https://doi.org/10.23919/icep.2018.8374320","title":"TSV liner dielectric technology with spin-on low-k polymer","display_name":"TSV liner dielectric technology with spin-on low-k polymer","publication_year":2018,"publication_date":"2018-04-01","ids":{"openalex":"https://openalex.org/W2808020255","doi":"https://doi.org/10.23919/icep.2018.8374320","mag":"2808020255"},"language":"en","primary_location":{"id":"doi:10.23919/icep.2018.8374320","doi":"https://doi.org/10.23919/icep.2018.8374320","is_oa":false,"landing_page_url":"https://doi.org/10.23919/icep.2018.8374320","pdf_url":null,"source":{"id":"https://openalex.org/S7407087929","display_name":"International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5086812904","display_name":"Seunggyu Lee","orcid":"https://orcid.org/0000-0003-2302-7348","observed_orcids":["https://orcid.org/0000-0003-2302-7348"]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S. Lee","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113937582","display_name":"Yohei Sugawara","orcid":"https://orcid.org/0009-0003-7862-6302","observed_orcids":["https://orcid.org/0009-0003-7862-6302"]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Y. Sugawara","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000612641","display_name":"Momoyo Ito","orcid":"https://orcid.org/0000-0003-2704-9034","observed_orcids":["https://orcid.org/0000-0003-2704-9034","https://orcid.org/0000-0002-8269-264X"]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Ito","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036200957","display_name":"Hisashi Kino","orcid":"https://orcid.org/0000-0001-9348-120X","observed_orcids":["https://orcid.org/0000-0001-9348-120X"]},"institutions":[{"id":"https://openalex.org/I4405269153","display_name":"Frontier Research Institute for Interdisciplinary Sciences, Tohoku University","ror":"https://ror.org/0388qbr12","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4405269153"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"H. Kino","raw_affiliation_strings":["Frontier Research Institute for Interdisciplinary Sciences, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Frontier Research Institute for Interdisciplinary Sciences, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I4405269153"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178","observed_orcids":["https://orcid.org/0000-0003-2303-8178"]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Fukushima","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X","observed_orcids":["https://orcid.org/0000-0001-7414-315X"]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Tanaka","raw_affiliation_strings":["Department of Biomedical Engineering, Tohoku University, Sendai, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.3996,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.41559293,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9955999851226807,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9955999851226807,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.004000000189989805,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-vias","display_name":"through-silicon vias","score":0.9869999885559082},{"id":"https://openalex.org/keywords/benzocyclobutene","display_name":"benzocyclobutene","score":0.8939999938011169},{"id":"https://openalex.org/keywords/step-coverage","display_name":"step coverage","score":0.6679999828338623},{"id":"https://openalex.org/keywords/bubble-removal","display_name":"bubble removal","score":0.7440000176429749},{"id":"https://openalex.org/keywords/electroless-plating","display_name":"electroless plating","score":0.7580000162124634},{"id":"https://openalex.org/keywords/electroplating","display_name":"electroplating","score":0.7649999856948853},{"id":"https://openalex.org/keywords/low-temperature-processing","display_name":"low-temperature processing","score":0.8109999895095825}],"concepts":[{"id":"https://openalex.org/C2776366733","wikidata":"https://www.wikidata.org/wiki/Q420972","display_name":"Benzocyclobutene","level":3,"score":0.9579919576644897},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8213956952095032},{"id":"https://openalex.org/C115196108","wikidata":"https://www.wikidata.org/wiki/Q1305254","display_name":"Spin coating","level":3,"score":0.7757260799407959},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.6732195615768433},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6361403465270996},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.6289666295051575},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.576529860496521},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.5604840517044067},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.5538281202316284},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4908171594142914},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4509423077106476},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.219646155834198},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.23919/icep.2018.8374320","doi":"https://doi.org/10.23919/icep.2018.8374320","is_oa":false,"landing_page_url":"https://doi.org/10.23919/icep.2018.8374320","pdf_url":null,"source":{"id":"https://openalex.org/S7407087929","display_name":"International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.651199996471405}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1494602065","https://openalex.org/W1544891449","https://openalex.org/W1971966678","https://openalex.org/W1994239999","https://openalex.org/W2029038355","https://openalex.org/W2151613126","https://openalex.org/W2507714621","https://openalex.org/W2579983182"],"related_works":["https://openalex.org/W2005538990","https://openalex.org/W2902134573","https://openalex.org/W2075252271","https://openalex.org/W4394711438","https://openalex.org/W2507714621","https://openalex.org/W2278817800","https://openalex.org/W2287252267","https://openalex.org/W2518073507","https://openalex.org/W2763296071","https://openalex.org/W2115376772"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"a":[3,10,31],"BCB":[4,19,49,80,98],"(benzocyclobutene)":[5],"resin":[6],"is":[7,20,50],"employed":[8],"as":[9],"spin-on":[11,97],"low-k":[12],"polymer":[13],"for":[14],"TSV":[15,105],"liner":[16,81],"dielectrics.":[17],"The":[18,44],"perfectly":[21],"covered":[22],"on":[23],"the":[24,48,56,70,79,87],"sidewall":[25],"of":[26,33,38,47],"deep":[27,71],"Si":[28,72],"holes":[29,73],"with":[30,78],"diameter":[32],"8":[34],"\u03bcm":[35,40],"and":[36,52,62,91],"depth":[37],"40":[39],"(aspect":[41],"ratio:":[42],"5).":[43],"step":[45],"coverage":[46],"high":[51],"controllable":[53],"by":[54,86],"conditioning":[55],"spin":[57],"rotation":[58],"speed,":[59],"spin-coating":[60],"time,":[61],"deforming":[63],"pressure":[64],"to":[65,75,103,113],"eliminate":[66],"bubbles":[67],"formed":[68,85],"in":[69],"prior":[74],"spin-coating.":[76],"Cu-TSVs":[77],"dielectric":[82],"are":[83],"successfully":[84],"subsequent":[88],"electro-less":[89],"plated":[90],"electroplated":[92],"Cu":[93],"technologies.":[94],"This":[95],"cost-effective":[96],"technology":[99],"will":[100],"be":[101],"applied":[102],"via-last":[104],"fabrication":[106],"at":[107],"low":[108],"temperature":[109],"below":[110],"250":[111],"C":[112],"give":[114],"low-capacitance":[115],"TSVs.":[116]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2019,"cited_by_count":1}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2018-06-21T00:00:00"}