{"id":"https://openalex.org/W2767548484","doi":"https://doi.org/10.1007/s10854-017-8096-7","title":"Investigation of intermetallic compound and voids growth in fine-pitch Sn\u20133.5Ag/Ni/Cu microbumps","display_name":"Investigation of intermetallic compound and voids growth in fine-pitch Sn\u20133.5Ag/Ni/Cu microbumps","publication_year":2017,"publication_date":"2017-11-07","ids":{"openalex":"https://openalex.org/W2767548484","doi":"https://doi.org/10.1007/s10854-017-8096-7","mag":"2767548484"},"language":"en","primary_location":{"id":"doi:10.1007/s10854-017-8096-7","doi":"https://doi.org/10.1007/s10854-017-8096-7","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10854-017-8096-7","pdf_url":null,"source":{"id":"https://openalex.org/S189509794","display_name":"Journal of Materials Science Materials in Electronics","issn_l":"0957-4522","issn":["0957-4522","1573-482X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Science: Materials in Electronics","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5084035137","display_name":"Dongfan Wang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dongfan Wang","raw_affiliation_strings":["State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075057869","display_name":"Huiqin Ling","orcid":"https://orcid.org/0000-0003-2982-126X","observed_orcids":["https://orcid.org/0000-0003-2982-126X"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Huiqin Ling","raw_affiliation_strings":["State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103082550","display_name":"Menglong Sun","orcid":"https://orcid.org/0000-0002-7758-8354","observed_orcids":["https://orcid.org/0000-0002-7758-8354"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Menglong Sun","raw_affiliation_strings":["State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070168826","display_name":"Xiaoying Miao","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaoying Miao","raw_affiliation_strings":["State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069378091","display_name":"Anmin Hu","orcid":"https://orcid.org/0000-0002-9599-4639","observed_orcids":["https://orcid.org/0000-0002-9599-4639"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Anmin Hu","raw_affiliation_strings":["State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100351458","display_name":"Ming Li","orcid":"https://orcid.org/0000-0002-7279-2460","observed_orcids":["https://orcid.org/0000-0002-7279-2460"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Li","raw_affiliation_strings":["State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Rd., Minhang district, Shanghai, 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102113678","display_name":"Fengwei Dai","orcid":"https://orcid.org/0000-0002-5396-8563","observed_orcids":["https://orcid.org/0000-0002-5396-8563"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fengwei Dai","raw_affiliation_strings":["Institute of Microelectronic of Chinese Academy of Sciences, Beijing, 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronic of Chinese Academy of Sciences, Beijing, 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100457802","display_name":"Wenqi Zhang","orcid":"https://orcid.org/0000-0001-8142-7791","observed_orcids":["https://orcid.org/0000-0001-8142-7791"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenqi Zhang","raw_affiliation_strings":["Institute of Microelectronic of Chinese Academy of Sciences, Beijing, 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronic of Chinese Academy of Sciences, Beijing, 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5083314215","display_name":"Liqiang Cao","orcid":"https://orcid.org/0000-0002-0859-1437","observed_orcids":["https://orcid.org/0000-0002-0859-1437"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Liqiang Cao","raw_affiliation_strings":["Institute of Microelectronic of Chinese Academy of Sciences, Beijing, 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronic of Chinese Academy of Sciences, Beijing, 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5075057869","https://openalex.org/A5083314215"],"corresponding_institution_ids":["https://openalex.org/I183067930","https://openalex.org/I19820366","https://openalex.org/I4210119392","https://openalex.org/I4391767745"],"apc_list":{"value":3990,"currency":"USD","value_usd":3990},"apc_paid":null,"fwci":0.6709,"has_fulltext":false,"cited_by_count":14,"citation_normalized_percentile":{"value":0.67722722,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"29","issue":"3","first_page":"1861","last_page":"1867"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0013000000035390258,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/intermetallic-compound-growth","display_name":"intermetallic compound growth","score":0.9179999828338623},{"id":"https://openalex.org/keywords/void-formation","display_name":"void formation","score":0.7369999885559082},{"id":"https://openalex.org/keywords/cu-pillar-bumps","display_name":"Cu pillar bumps","score":0.5479999780654907},{"id":"https://openalex.org/keywords/cu-ni-6sn5","display_name":"(Cu,Ni)6Sn5","score":0.8539999723434448},{"id":"https://openalex.org/keywords/ni3sn4","display_name":"Ni3Sn4","score":0.9990000128746033},{"id":"https://openalex.org/keywords/interfacial-reliability","display_name":"interfacial reliability","score":0.6039999723434448},{"id":"https://openalex.org/keywords/3d-packaging","display_name":"3D packaging","score":0.6679999828338623},{"id":"https://openalex.org/keywords/reflow-soldering","display_name":"reflow soldering","score":0.5920000076293945}],"concepts":[{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.942963182926178},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8005472421646118},{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.7788724303245544},{"id":"https://openalex.org/C105289051","wikidata":"https://www.wikidata.org/wiki/Q1930094","display_name":"Pillar","level":2,"score":0.5402149558067322},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5313753485679626},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5295346975326538},{"id":"https://openalex.org/C2778312390","wikidata":"https://www.wikidata.org/wiki/Q4139973","display_name":"Growth rate","level":2,"score":0.46649667620658875},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4392852485179901},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.41010114550590515},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0810619592666626},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.07662686705589294},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s10854-017-8096-7","doi":"https://doi.org/10.1007/s10854-017-8096-7","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10854-017-8096-7","pdf_url":null,"source":{"id":"https://openalex.org/S189509794","display_name":"Journal of Materials Science Materials in Electronics","issn_l":"0957-4522","issn":["0957-4522","1573-482X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Science: Materials in Electronics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G177135022","display_name":null,"funder_award_id":"2015CB057200","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"},{"id":"https://openalex.org/G319455243","display_name":null,"funder_award_id":"61376107","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320322999","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04"},{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":31,"referenced_works":["https://openalex.org/W932501314","https://openalex.org/W1247971784","https://openalex.org/W1491223376","https://openalex.org/W1966143774","https://openalex.org/W1974635514","https://openalex.org/W1996747404","https://openalex.org/W1998369390","https://openalex.org/W1998838980","https://openalex.org/W2003839338","https://openalex.org/W2016767740","https://openalex.org/W2026544660","https://openalex.org/W2029184335","https://openalex.org/W2032830807","https://openalex.org/W2035351237","https://openalex.org/W2042220075","https://openalex.org/W2049067773","https://openalex.org/W2050031911","https://openalex.org/W2052286981","https://openalex.org/W2056790177","https://openalex.org/W2058875398","https://openalex.org/W2061981506","https://openalex.org/W2065910616","https://openalex.org/W2093299714","https://openalex.org/W2110641793","https://openalex.org/W2123381572","https://openalex.org/W2159790467","https://openalex.org/W2247483928","https://openalex.org/W2483196149","https://openalex.org/W6600020421","https://openalex.org/W6601390136","https://openalex.org/W6607479462"],"related_works":["https://openalex.org/W3088947808","https://openalex.org/W4206289451","https://openalex.org/W2989992351","https://openalex.org/W2155046583","https://openalex.org/W4286565507","https://openalex.org/W2954251516","https://openalex.org/W3088041527","https://openalex.org/W4206062567","https://openalex.org/W3023590974","https://openalex.org/W4401929409"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-10-27T15:51:10.671819","created_date":"2017-11-17T00:00:00"}