{"id":"https://openalex.org/W2744504374","doi":null,"title":"\u91d1\u5c0e\u4f53\u306e\u5f62\u614b\u306b\u53ca\u307c\u3059\u91d1\u5c0e\u4f53\u306e\u5f71\u97ff\u3092\u7814\u7a76\u3057\u305f\u3002\u3010JST\u30fb\u4eac\u5927\u6a5f\u68b0\u7ffb\u8a33\u3011","display_name":"\u91d1\u5c0e\u4f53\u306e\u5f62\u614b\u306b\u53ca\u307c\u3059\u91d1\u5c0e\u4f53\u306e\u5f71\u97ff\u3092\u7814\u7a76\u3057\u305f\u3002\u3010JST\u30fb\u4eac\u5927\u6a5f\u68b0\u7ffb\u8a33\u3011","publication_year":2016,"publication_date":"2016-01-01","ids":{"openalex":"https://openalex.org/W2744504374","mag":"2744504374"},"language":"ja","primary_location":{"id":"mag:2744504374","doi":null,"is_oa":false,"landing_page_url":"https://jglobal.jst.go.jp/public/201702243473553310","pdf_url":null,"source":{"id":"https://openalex.org/S2764887705","display_name":"Electronic Components and Materials","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4323972253","host_organization_name":"Chinese Institute of Electronics Components Branch","host_organization_lineage":["https://openalex.org/P4323972253"],"host_organization_lineage_names":["Chinese Institute of Electronics Components Branch"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"Dianzi Yuanjian yu Cailiao","raw_type":null},"volume":null,"type":"article","indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5024238951","display_name":"Chengfeng Li","orcid":"https://orcid.org/0000-0002-7061-2796","observed_orcids":["https://orcid.org/0000-0002-7061-2796"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Chengfeng Li","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0002-7061-2796","affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101496775","display_name":"Haizhen Wang","orcid":"https://orcid.org/0000-0003-3477-8673","observed_orcids":["https://orcid.org/0000-0003-3477-8673"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Haizhen Wang","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0003-3477-8673","affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048458718","display_name":"Guo Mingy","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Guo Mingy","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110514446","display_name":"Zhang Xiu","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Zhang Xiu","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":null,"display_name":"Du Yulong","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Du Yulong","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.28134197,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"35","issue":"10","first_page":"66","last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":0.10899999737739563,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":0.10899999737739563,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.07169999927282333,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13531","display_name":"Surface and Thin Film Phenomena","score":0.06629999727010727,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/gold-conductors","display_name":"gold conductors","score":0.7829999923706055}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33089378476142883}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:2744504374","doi":null,"is_oa":false,"landing_page_url":"https://jglobal.jst.go.jp/public/201702243473553310","pdf_url":null,"source":{"id":"https://openalex.org/S2764887705","display_name":"Electronic Components and Materials","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4323972253","host_organization_name":"Chinese Institute of Electronics Components Branch","host_organization_lineage":["https://openalex.org/P4323972253"],"host_organization_lineage_names":["Chinese Institute of Electronics Components Branch"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"Dianzi Yuanjian yu Cailiao","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2747618328","https://openalex.org/W3191875807","https://openalex.org/W2755807137","https://openalex.org/W3014848586","https://openalex.org/W2750059048","https://openalex.org/W2743705538","https://openalex.org/W3144235034","https://openalex.org/W2742808816","https://openalex.org/W615355036","https://openalex.org/W2745929927"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-10-31T12:09:11.096373","created_date":"2017-08-17T00:00:00"}