{"id":"https://openalex.org/W2731925804","doi":"https://doi.org/10.1016/j.microrel.2017.06.070","title":"TIM, EMMI and 3D TCAD analysis of discrete-technology SCRs","display_name":"TIM, EMMI and 3D TCAD analysis of discrete-technology SCRs","publication_year":2017,"publication_date":"2017-07-01","ids":{"openalex":"https://openalex.org/W2731925804","doi":"https://doi.org/10.1016/j.microrel.2017.06.070","mag":"2731925804"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2017.06.070","doi":"https://doi.org/10.1016/j.microrel.2017.06.070","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2017.06.070","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083063107","display_name":"Cl\u00e9ment Fleury","orcid":"https://orcid.org/0000-0002-3007-0566","observed_orcids":["https://orcid.org/0000-0002-3007-0566"]},"institutions":[{"id":"https://openalex.org/I145847075","display_name":"TU Wien","ror":"https://ror.org/04d836q62","country_code":"AT","type":"education","lineage":["https://openalex.org/I145847075"]}],"countries":["AT"],"is_corresponding":true,"raw_author_name":"C. Fleury","raw_affiliation_strings":["Institute of Solid State Electronics, TU Wien, Floragasse 7, 1040 Vienna, Austria"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Solid State Electronics, TU Wien, Floragasse 7, 1040 Vienna, Austria","institution_ids":["https://openalex.org/I145847075"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050467209","display_name":"Guido Notermans","orcid":"https://orcid.org/0000-0003-0861-3066","observed_orcids":["https://orcid.org/0000-0003-0861-3066"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"G. Notermans","raw_affiliation_strings":["Nexperia Germany GmbH, Stresemannallee 101, 22529 Hamburg, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nexperia Germany GmbH, Stresemannallee 101, 22529 Hamburg, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035083979","display_name":"Hans-Martin Ritter","orcid":"https://orcid.org/0000-0003-4459-8764","observed_orcids":["https://orcid.org/0000-0003-4459-8764"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"H.-M. Ritter","raw_affiliation_strings":["Nexperia Germany GmbH, Stresemannallee 101, 22529 Hamburg, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nexperia Germany GmbH, Stresemannallee 101, 22529 Hamburg, Germany","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5032018189","display_name":"Dionyz Pogany","orcid":"https://orcid.org/0000-0002-9936-9099","observed_orcids":["https://orcid.org/0000-0002-9936-9099"]},"institutions":[{"id":"https://openalex.org/I145847075","display_name":"TU Wien","ror":"https://ror.org/04d836q62","country_code":"AT","type":"education","lineage":["https://openalex.org/I145847075"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"D. Pogany","raw_affiliation_strings":["Institute of Solid State Electronics, TU Wien, Floragasse 7, 1040 Vienna, Austria"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Solid State Electronics, TU Wien, Floragasse 7, 1040 Vienna, Austria","institution_ids":["https://openalex.org/I145847075"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5083063107"],"corresponding_institution_ids":["https://openalex.org/I145847075"],"apc_list":{"value":2280,"currency":"USD","value_usd":2280},"apc_paid":null,"fwci":0.3346,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.59031028,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":96},"biblio":{"volume":"76-77","issue":null,"first_page":"698","last_page":"702"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.0020000000949949026,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.000699999975040555,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thyristors","display_name":"thyristors","score":0.921999990940094},{"id":"https://openalex.org/keywords/esd-protection","display_name":"electrostatic discharge protection","score":0.890999972820282},{"id":"https://openalex.org/keywords/avalanche-breakdown","display_name":"avalanche breakdown","score":0.8349999785423279},{"id":"https://openalex.org/keywords/holding-current","display_name":"holding current","score":0.9070000052452087},{"id":"https://openalex.org/keywords/3d-tcad-simulation","display_name":"3D TCAD simulation","score":0.8849999904632568}],"concepts":[{"id":"https://openalex.org/C205483674","wikidata":"https://www.wikidata.org/wiki/Q3574961","display_name":"Electrostatic discharge","level":3,"score":0.6514529585838318},{"id":"https://openalex.org/C2780799671","wikidata":"https://www.wikidata.org/wiki/Q17087362","display_name":"Transient (computer programming)","level":2,"score":0.5212557911872864},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.46939343214035034},{"id":"https://openalex.org/C34929307","wikidata":"https://www.wikidata.org/wiki/Q845636","display_name":"Technology CAD","level":3,"score":0.4598347544670105},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4448881149291992},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.41951650381088257},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3915534019470215},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.35496702790260315},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.23954805731773376},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.1842341423034668},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.06030088663101196},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2017.06.070","doi":"https://doi.org/10.1016/j.microrel.2017.06.070","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2017.06.070","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W849075951","https://openalex.org/W1979083136","https://openalex.org/W2001088480","https://openalex.org/W2031409622","https://openalex.org/W2051134927","https://openalex.org/W2089732196","https://openalex.org/W2119774213","https://openalex.org/W2133488241","https://openalex.org/W2153060850","https://openalex.org/W2174874757","https://openalex.org/W2293561955","https://openalex.org/W2307652771","https://openalex.org/W2543813019","https://openalex.org/W3144444646","https://openalex.org/W4292926174","https://openalex.org/W4302567542","https://openalex.org/W6663178787","https://openalex.org/W6682413823"],"related_works":["https://openalex.org/W2058387978","https://openalex.org/W2174874757","https://openalex.org/W2070457799","https://openalex.org/W7220799001","https://openalex.org/W2406705655","https://openalex.org/W2395176893","https://openalex.org/W2085807784","https://openalex.org/W1735114271","https://openalex.org/W6908553506","https://openalex.org/W4376606733"],"abstract_inverted_index":null,"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":2}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2017-07-14T00:00:00"}