{"id":"https://openalex.org/W2620728016","doi":"https://doi.org/10.1109/irps.2017.7936377","title":"Differences in reliability effects for thick copper and thick aluminium metallizations","display_name":"Differences in reliability effects for thick copper and thick aluminium metallizations","publication_year":2017,"publication_date":"2017-04-01","ids":{"openalex":"https://openalex.org/W2620728016","doi":"https://doi.org/10.1109/irps.2017.7936377","mag":"2620728016"},"language":"en","primary_location":{"id":"doi:10.1109/irps.2017.7936377","doi":"https://doi.org/10.1109/irps.2017.7936377","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2017.7936377","pdf_url":null,"source":{"id":"https://openalex.org/S4210238090","display_name":"IEEE International Reliability Physics Symposium proceedings","issn_l":"0735-0791","issn":["0735-0791","1541-7026","1938-1891"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Martin Pohl","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2799978770","display_name":"X-Fab (Germany)","ror":"https://ror.org/030bh9196","country_code":"DE","type":"company","lineage":["https://openalex.org/I2799978770"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Martin Pohl","raw_affiliation_strings":["Reliability Engineering, Process Characterization X-FAB Semiconductor Foundries AG Erfurt, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Reliability Engineering, Process Characterization X-FAB Semiconductor Foundries AG Erfurt, Germany","institution_ids":["https://openalex.org/I2799978770"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022521338","display_name":"Marco Erstling","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2799978770","display_name":"X-Fab (Germany)","ror":"https://ror.org/030bh9196","country_code":"DE","type":"company","lineage":["https://openalex.org/I2799978770"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Marco Erstling","raw_affiliation_strings":["Reliability Engineering, Process Characterization X-FAB Semiconductor Foundries AG Erfurt, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Reliability Engineering, Process Characterization X-FAB Semiconductor Foundries AG Erfurt, Germany","institution_ids":["https://openalex.org/I2799978770"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010305873","display_name":"Verena Hein","orcid":"https://orcid.org/0000-0003-4604-1484","observed_orcids":["https://orcid.org/0000-0003-4604-1484"]},"institutions":[{"id":"https://openalex.org/I2799978770","display_name":"X-Fab (Germany)","ror":"https://ror.org/030bh9196","country_code":"DE","type":"company","lineage":["https://openalex.org/I2799978770"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Verena Hein","raw_affiliation_strings":["Reliability Engineering, Process Characterization X-FAB Semiconductor Foundries AG Erfurt, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Reliability Engineering, Process Characterization X-FAB Semiconductor Foundries AG Erfurt, Germany","institution_ids":["https://openalex.org/I2799978770"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061108588","display_name":"Kirsten Weide-Zaage","orcid":"https://orcid.org/0000-0003-3438-210X","observed_orcids":["https://orcid.org/0000-0003-3438-210X"]},"institutions":[{"id":"https://openalex.org/I114112103","display_name":"Leibniz University Hannover","ror":"https://ror.org/0304hq317","country_code":"DE","type":"education","lineage":["https://openalex.org/I114112103"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"K. Weide-Zaage","raw_affiliation_strings":["RESRI Group, Gottfried Wilhelm Leibniz Universit\u00e4t Hannover, Hannover, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"RESRI Group, Gottfried Wilhelm Leibniz Universit\u00e4t Hannover, Hannover, Germany","institution_ids":["https://openalex.org/I114112103"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5054621539","display_name":"T. Chen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I114112103","display_name":"Leibniz University Hannover","ror":"https://ror.org/0304hq317","country_code":"DE","type":"education","lineage":["https://openalex.org/I114112103"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"T. Chen","raw_affiliation_strings":["RESRI Group, Gottfried Wilhelm Leibniz Universit\u00e4t Hannover, Hannover, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"RESRI Group, Gottfried Wilhelm Leibniz Universit\u00e4t Hannover, Hannover, Germany","institution_ids":["https://openalex.org/I114112103"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.09900038,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"MR","last_page":"2.1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.00039999998989515007,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnect-reliability","display_name":"interconnect reliability","score":0.8080000281333923},{"id":"https://openalex.org/keywords/electromigration","display_name":"electromigration","score":0.9120000004768372},{"id":"https://openalex.org/keywords/stress-migration","display_name":"stress migration","score":0.9399999976158142},{"id":"https://openalex.org/keywords/thermal-expansion","display_name":"thermal expansion","score":0.8830000162124634},{"id":"https://openalex.org/keywords/mechanical-stress","display_name":"mechanical stress","score":0.8939999938011169},{"id":"https://openalex.org/keywords/reliability-analysis","display_name":"reliability analysis","score":0.5630000233650208},{"id":"https://openalex.org/keywords/thin-metal-films","display_name":"thin metal films","score":0.5199999809265137}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.8402860164642334},{"id":"https://openalex.org/C513153333","wikidata":"https://www.wikidata.org/wiki/Q663","display_name":"Aluminium","level":2,"score":0.838329553604126},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.792931079864502},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.7851356267929077},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.6710340976715088},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6409798264503479},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5976218581199646},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5735230445861816},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.433966726064682},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4184648394584656},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3665095865726471},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.12024012207984924},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.2017.7936377","doi":"https://doi.org/10.1109/irps.2017.7936377","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2017.7936377","pdf_url":null,"source":{"id":"https://openalex.org/S4210238090","display_name":"IEEE International Reliability Physics Symposium proceedings","issn_l":"0735-0791","issn":["0735-0791","1541-7026","1938-1891"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2021867109"],"related_works":["https://openalex.org/W2123446492","https://openalex.org/W1989695743","https://openalex.org/W2095894848","https://openalex.org/W1484008372","https://openalex.org/W2806132265","https://openalex.org/W2101091918","https://openalex.org/W2122904090","https://openalex.org/W2790753765","https://openalex.org/W2016795801","https://openalex.org/W1994416434"],"abstract_inverted_index":{"The":[0,38,99],"use":[1],"of":[2,9,14,43],"a":[3,15,24,84,92,130],"thick":[4,17,44,58,75,118,122],"Copper":[5,45,123,138],"layer":[6,19,120],"on":[7],"top":[8],"an":[10],"AlCu-metallization":[11],"stack":[12],"instead":[13],"common":[16],"Aluminium":[18,47],"triggers":[20],"the":[21,27,30,52,67,78,87,102,127],"need":[22],"for":[23,51,57,104,115,129,136],"change":[25,85],"in":[26,70,86,91],"reliability":[28,35,105,112,131],"characterization,":[29],"test":[31,36,106,109,132],"structure":[32,107],"layouts":[33],"and":[34,40,46,59,64,96,111,117,121,124,133],"methods.":[37],"failure":[39],"degradation":[41,94],"mechanisms":[42],"are":[48,66],"partly":[49],"different":[50,93],"material":[53],"as":[54,56],"well":[55],"thin":[60,71,116],"metal":[61,72,76],"layers.":[62,73],"Electromigration":[63],"stressmigration":[65],"main":[68],"effects":[69],"For":[74],"layers":[77],"high":[79],"thermal":[80],"expansion":[81],"leads":[82],"to":[83],"mechanical":[88],"stress":[89],"resulting":[90],"behaviour":[95],"defect":[97],"mechanisms.":[98],"paper":[100],"describes":[101],"differences":[103],"layouts,":[108],"methods":[110],"assessment":[113,134],"strategies":[114],"interconnect":[119],"Aluminium.":[125],"Especially":[126],"requirements":[128],"strategy":[135],"non-passivated":[137],"will":[139],"be":[140],"explained.":[141]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2}],"updated_date":"2026-10-06T10:28:23.643775","created_date":"2017-06-09T00:00:00"}