{"id":"https://openalex.org/W2602145408","doi":"https://doi.org/10.1117/12.2260146","title":"Driving down defect density in composite EUV patterning film stacks","display_name":"Driving down defect density in composite EUV patterning film stacks","publication_year":2017,"publication_date":"2017-03-28","ids":{"openalex":"https://openalex.org/W2602145408","doi":"https://doi.org/10.1117/12.2260146","mag":"2602145408"},"language":"en","primary_location":{"id":"doi:10.1117/12.2260146","doi":"https://doi.org/10.1117/12.2260146","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2260146","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5068518137","display_name":"Luciana Meli","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Luciana Meli","raw_affiliation_strings":["IBM Corp. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corp. (United States)","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033211193","display_name":"Karen E. Petrillo","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Karen Petrillo","raw_affiliation_strings":["IBM Corp. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corp. (United States)","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072590585","display_name":"Anuja De Silva","orcid":"https://orcid.org/0000-0003-2639-7870","observed_orcids":["https://orcid.org/0000-0003-2639-7870"]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Anuja De Silva","raw_affiliation_strings":["IBM Corp. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corp. (United States)","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108247980","display_name":"John Arnold","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John Arnold","raw_affiliation_strings":["IBM Corp. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corp. (United States)","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112329096","display_name":"Nelson M. Felix","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nelson Felix","raw_affiliation_strings":["IBM Corp. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corp. (United States)","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036581844","display_name":"Richard C. Johnson","orcid":"https://orcid.org/0000-0002-4663-7379","observed_orcids":["https://orcid.org/0000-0002-4663-7379"]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Richard Johnson","raw_affiliation_strings":["IBM Corp. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corp. (United States)","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042819972","display_name":"Cody J. Murray","orcid":"https://orcid.org/0000-0002-0990-8854","observed_orcids":["https://orcid.org/0000-0002-0990-8854"]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Cody Murray","raw_affiliation_strings":["IBM Corp. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corp. (United States)","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089619641","display_name":"Alex R. Hubbard","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alex Hubbard","raw_affiliation_strings":["IBM Corp. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corp. (United States)","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030633630","display_name":"Danielle Durrant","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Danielle Durrant","raw_affiliation_strings":["IBM Corp. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corp. (United States)","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031294436","display_name":"Koichi Hontake","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I114132059","display_name":"Tokyo Electron (Japan)","ror":"https://ror.org/05gd76j39","country_code":"JP","type":"company","lineage":["https://openalex.org/I114132059"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Koichi Hontake","raw_affiliation_strings":["Tokyo Electron Ltd. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Electron Ltd. (United States)","institution_ids":["https://openalex.org/I114132059"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063005173","display_name":"Lior Huli","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I114132059","display_name":"Tokyo Electron (Japan)","ror":"https://ror.org/05gd76j39","country_code":"JP","type":"company","lineage":["https://openalex.org/I114132059"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Lior Huli","raw_affiliation_strings":["Tokyo Electron Ltd. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Electron Ltd. (United States)","institution_ids":["https://openalex.org/I114132059"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060516805","display_name":"Corey Lemley","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I114132059","display_name":"Tokyo Electron (Japan)","ror":"https://ror.org/05gd76j39","country_code":"JP","type":"company","lineage":["https://openalex.org/I114132059"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Corey Lemley","raw_affiliation_strings":["Tokyo Electron Ltd. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Electron Ltd. (United States)","institution_ids":["https://openalex.org/I114132059"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007488602","display_name":"Dave Hetzer","orcid":"https://orcid.org/0009-0008-0233-9776","observed_orcids":["https://orcid.org/0009-0008-0233-9776"]},"institutions":[{"id":"https://openalex.org/I114132059","display_name":"Tokyo Electron (Japan)","ror":"https://ror.org/05gd76j39","country_code":"JP","type":"company","lineage":["https://openalex.org/I114132059"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Dave Hetzer","raw_affiliation_strings":["Tokyo Electron Ltd. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Electron Ltd. (United States)","institution_ids":["https://openalex.org/I114132059"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080778643","display_name":"Shinichiro Kawakami","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I114132059","display_name":"Tokyo Electron (Japan)","ror":"https://ror.org/05gd76j39","country_code":"JP","type":"company","lineage":["https://openalex.org/I114132059"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Shinichiro Kawakami","raw_affiliation_strings":["Tokyo Electron Ltd. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Electron Ltd. (United States)","institution_ids":["https://openalex.org/I114132059"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109204149","display_name":"Koichi Matsunaga","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I114132059","display_name":"Tokyo Electron (Japan)","ror":"https://ror.org/05gd76j39","country_code":"JP","type":"company","lineage":["https://openalex.org/I114132059"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Koichi Matsunaga","raw_affiliation_strings":["Tokyo Electron Ltd. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tokyo Electron Ltd. (United States)","institution_ids":["https://openalex.org/I114132059"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.8808,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.94595002,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":87,"max":98},"biblio":{"volume":"10143","issue":null,"first_page":"101430Y","last_page":"101430Y"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11183","display_name":"Advanced X-ray Imaging Techniques","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3108","display_name":"Radiation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/euv-lithography","display_name":"EUV lithography","score":0.953000009059906},{"id":"https://openalex.org/keywords/defect-density","display_name":"defect density","score":0.777999997138977},{"id":"https://openalex.org/keywords/critical-dimension-uniformity","display_name":"critical dimension uniformity","score":0.8149999976158142},{"id":"https://openalex.org/keywords/line-width-roughness","display_name":"line width roughness","score":0.8970000147819519},{"id":"https://openalex.org/keywords/line-edge-roughness","display_name":"line edge roughness","score":0.953000009059906},{"id":"https://openalex.org/keywords/pattern-collapse","display_name":"pattern collapse","score":0.8669999837875366},{"id":"https://openalex.org/keywords/baking","display_name":"baking","score":0.8050000071525574},{"id":"https://openalex.org/keywords/defect-detection","display_name":"defect detection","score":0.9549999833106995},{"id":"https://openalex.org/keywords/defect-characterization","display_name":"defect characterization","score":0.6980000138282776},{"id":"https://openalex.org/keywords/7-nm-technology-node","display_name":"7nm technology node","score":0.7960000038146973}],"concepts":[{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.9669479131698608},{"id":"https://openalex.org/C2779261148","wikidata":"https://www.wikidata.org/wiki/Q5852","display_name":"Blanket","level":2,"score":0.7310512065887451},{"id":"https://openalex.org/C146024833","wikidata":"https://www.wikidata.org/wiki/Q1385457","display_name":"Extreme ultraviolet","level":3,"score":0.6577147245407104},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6420360803604126},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6034985780715942},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5698914527893066},{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.5328453183174133},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.5307880640029907},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.4861847758293152},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.4118916988372803},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3545127511024475},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3275315761566162},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.18526965379714966},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09578034281730652},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.2260146","doi":"https://doi.org/10.1117/12.2260146","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2260146","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5378999710083008}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1965919245","https://openalex.org/W2060628547","https://openalex.org/W2085702154","https://openalex.org/W2323157727","https://openalex.org/W2548664743"],"related_works":["https://openalex.org/W2895893477","https://openalex.org/W2923121449","https://openalex.org/W2766279789","https://openalex.org/W2006500427","https://openalex.org/W2323157727","https://openalex.org/W2045803311","https://openalex.org/W3202474809","https://openalex.org/W2321868307","https://openalex.org/W2790844187","https://openalex.org/W3129223100"],"abstract_inverted_index":{"Extreme":[0],"ultraviolet":[1],"lithography":[2],"(EUVL)":[3],"technology":[4,24],"is":[5,28],"one":[6],"of":[7,33,122,136,154],"the":[8,13,23,31,60,120],"leading":[9],"candidates":[10],"for":[11,17,86,131],"enabling":[12],"next":[14],"generation":[15],"devices,":[16],"7nm":[18,99],"node":[19,100],"and":[20,41,53,66,73,101,127,134,152],"beyond.":[21],"As":[22,43],"matures,":[25],"further":[26,145],"improvement":[27],"required":[29,96],"in":[30,109,139],"area":[32],"blanket":[34,137],"film":[35,68],"defectivity,":[36,38,62],"pattern":[37,64,150],"CD":[39],"uniformity,":[40],"LWR/LER.":[42],"EUV":[44,140],"pitch":[45],"scaling":[46],"approaches":[47],"sub":[48],"20":[49],"nm,":[50],"new":[51],"techniques":[52],"methods":[54],"must":[55],"be":[56],"developed":[57],"to":[58,81,97,149],"reduce":[59],"overall":[61],"mitigate":[63],"collapse":[65,151],"eliminate":[67],"related":[69,148],"defect.":[70],"IBM":[71],"Corporation":[72],"Tokyo":[74],"Electron":[75],"Limited":[76],"(TELTM)":[77],"are":[78],"continuously":[79],"collaborating":[80],"develop":[82],"manufacturing":[83],"quality":[84],"processes":[85,115],"EUVL.":[87],"In":[88],"this":[89],"paper,":[90],"we":[91],"review":[92],"key":[93],"defectivity":[94,138],"learning":[95],"enable":[98],"beyond":[102],"technology.":[103],"We":[104,143],"will":[105,144],"describe":[106],"ongoing":[107],"progress":[108],"addressing":[110],"these":[111],"challenges":[112],"through":[113],"track-based":[114],"(coating,":[116],"developer,":[117],"baking),":[118],"highlighting":[119],"limitations":[121],"common":[123],"defect":[124],"detection":[125],"strategies":[126],"outlining":[128],"methodologies":[129],"necessary":[130],"accurate":[132],"characterization":[133],"mitigation":[135],"patterning":[141],"stacks.":[142],"discuss":[146],"defects":[147],"thinning":[153],"underlayer":[155],"films.":[156]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":4}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2017-04-07T00:00:00"}