{"id":"https://openalex.org/W2592906860","doi":"https://doi.org/10.1109/eptc.2016.7861529","title":"Characterization of anodic bondable LTCC for wafer-level packaging","display_name":"Characterization of anodic bondable LTCC for wafer-level packaging","publication_year":2016,"publication_date":"2016-11-01","ids":{"openalex":"https://openalex.org/W2592906860","doi":"https://doi.org/10.1109/eptc.2016.7861529","mag":"2592906860"},"language":"en","primary_location":{"id":"doi:10.1109/eptc.2016.7861529","doi":"https://doi.org/10.1109/eptc.2016.7861529","is_oa":false,"landing_page_url":"https://doi.org/10.1109/eptc.2016.7861529","pdf_url":null,"source":{"id":"https://openalex.org/S4363608031","display_name":"IEEE Electronics Packaging Technology Conference (EPTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Xiaodong Hu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4577782","display_name":"Technische Universit\u00e4t Berlin","ror":"https://ror.org/03v4gjf40","country_code":"DE","type":"education","lineage":["https://openalex.org/I4577782"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Xiaodong Hu","raw_affiliation_strings":["Technische Universit\u00e4t Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universit\u00e4t Berlin, Germany","institution_ids":["https://openalex.org/I4577782"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026520071","display_name":"Manuel B\u00e4uscher","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4577782","display_name":"Technische Universit\u00e4t Berlin","ror":"https://ror.org/03v4gjf40","country_code":"DE","type":"education","lineage":["https://openalex.org/I4577782"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Manuel Bauscher","raw_affiliation_strings":["Technische Universit\u00e4t Berlin, Germany","Fraunhofer Institute for Reliability and Microintegration, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universit\u00e4t Berlin, Germany","institution_ids":["https://openalex.org/I4577782"]},{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067326722","display_name":"Piotr Mackowiak","orcid":"https://orcid.org/0000-0002-4891-3074","observed_orcids":["https://orcid.org/0000-0002-4891-3074"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Piotr Mackowiak","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Yucheng Zhang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4577782","display_name":"Technische Universit\u00e4t Berlin","ror":"https://ror.org/03v4gjf40","country_code":"DE","type":"education","lineage":["https://openalex.org/I4577782"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Yucheng Zhang","raw_affiliation_strings":["Technische Universit\u00e4t Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universit\u00e4t Berlin, Germany","institution_ids":["https://openalex.org/I4577782"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090024761","display_name":"Ole Hoelck","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Ole Hoelck","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109196728","display_name":"Hans Walter","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Hans Walter","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration, Germany","Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration, Berlin, Berlin, DE"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration, Germany","institution_ids":["https://openalex.org/I4210134425"]},{"raw_affiliation_string":"Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration, Berlin, Berlin, DE","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054361362","display_name":"Martin Ihle","orcid":"https://orcid.org/0000-0002-3964-2954","observed_orcids":["https://orcid.org/0000-0002-3964-2954"]},"institutions":[{"id":"https://openalex.org/I4210145959","display_name":"Fraunhofer Institute for Ceramic Technologies and Systems","ror":"https://ror.org/0448sak71","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210145959","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4923324","display_name":"Fraunhofer-Gesellschaft","ror":"https://ror.org/05hkkdn48","country_code":"DE","type":"government","lineage":["https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Martin Ihle","raw_affiliation_strings":["Fraunhofer Institute for Ceramic Technologies and Systems, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Ceramic Technologies and Systems, Germany","institution_ids":["https://openalex.org/I4210145959","https://openalex.org/I4923324"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010766767","display_name":"Steffen Ziesche","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210145959","display_name":"Fraunhofer Institute for Ceramic Technologies and Systems","ror":"https://ror.org/0448sak71","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210145959","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4923324","display_name":"Fraunhofer-Gesellschaft","ror":"https://ror.org/05hkkdn48","country_code":"DE","type":"government","lineage":["https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Steffen Ziesche","raw_affiliation_strings":["Fraunhofer Institute for Ceramic Technologies and Systems, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Ceramic Technologies and Systems, Germany","institution_ids":["https://openalex.org/I4210145959","https://openalex.org/I4923324"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039190164","display_name":"Ulli Hansen","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ulli Hansen","raw_affiliation_strings":["MSG Lithoglas GmbH, Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MSG Lithoglas GmbH, Berlin, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004256761","display_name":"Simon Maus","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Simon Maus","raw_affiliation_strings":["MSG Lithoglas GmbH, Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MSG Lithoglas GmbH, Berlin, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002690552","display_name":"Oliver Gyenge","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Oliver Gyenge","raw_affiliation_strings":["MSG Lithoglas GmbH, Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MSG Lithoglas GmbH, Berlin, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110523027","display_name":"Biswajit Mukhopadhyay","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Biswajit Mukhopadhyay","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078074960","display_name":"O. Ehrmann","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4577782","display_name":"Technische Universit\u00e4t Berlin","ror":"https://ror.org/03v4gjf40","country_code":"DE","type":"education","lineage":["https://openalex.org/I4577782"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Oswin Ehrmann","raw_affiliation_strings":["Technische Universit\u00e4t Berlin, Germany","Fraunhofer Institute for Reliability and Microintegration, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universit\u00e4t Berlin, Germany","institution_ids":["https://openalex.org/I4577782"]},{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108620479","display_name":"Klaus\u2010Dieter Lang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4577782","display_name":"Technische Universit\u00e4t Berlin","ror":"https://ror.org/03v4gjf40","country_code":"DE","type":"education","lineage":["https://openalex.org/I4577782"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Klaus-Dieter Lang","raw_affiliation_strings":["Technische Universit\u00e4t Berlin, Germany","Fraunhofer Institute for Reliability and Microintegration, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universit\u00e4t Berlin, Germany","institution_ids":["https://openalex.org/I4577782"]},{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030590448","display_name":"Ha-Duong Ngo","orcid":"https://orcid.org/0000-0002-0294-537X","observed_orcids":["https://orcid.org/0000-0002-0294-537X"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Ha-Duong Ngo","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration, Germany","University of Applied Sciences, Berlin"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration, Germany","institution_ids":["https://openalex.org/I4210134425"]},{"raw_affiliation_string":"University of Applied Sciences, Berlin","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.3453,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.88927266,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"501","last_page":"505"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.8291000127792358,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.8291000127792358,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.0746999979019165,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0560000017285347,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/low-temperature-co-fired-ceramic","display_name":"low temperature co-fired ceramic","score":0.8090000152587891},{"id":"https://openalex.org/keywords/anodic-bonding","display_name":"anodic bonding","score":0.984000027179718},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"wafer-level packaging","score":0.9300000071525574},{"id":"https://openalex.org/keywords/silicon-bonding","display_name":"silicon bonding","score":0.6129999756813049},{"id":"https://openalex.org/keywords/aluminum-interlayer","display_name":"aluminum interlayer","score":0.7059999704360962},{"id":"https://openalex.org/keywords/bond-parameters","display_name":"bonding parameters","score":0.8349999785423279},{"id":"https://openalex.org/keywords/charge-transfer","display_name":"charge transfer","score":0.7889999747276306},{"id":"https://openalex.org/keywords/bonding-quality","display_name":"bonding quality","score":0.6729999780654907},{"id":"https://openalex.org/keywords/mems-packaging","display_name":"MEMS packaging","score":0.8450000286102295},{"id":"https://openalex.org/keywords/hermetic-packaging","display_name":"hermetic packaging","score":0.6779999732971191}],"concepts":[{"id":"https://openalex.org/C201414436","wikidata":"https://www.wikidata.org/wiki/Q567503","display_name":"Anodic bonding","level":3,"score":0.9049504995346069},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.856653094291687},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6717694401741028},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.6072290539741516},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.5979967713356018},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5969462990760803},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.5858637690544128},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5353838205337524},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.5114480257034302},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4029596149921417},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.36256998777389526},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.16838619112968445},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/eptc.2016.7861529","doi":"https://doi.org/10.1109/eptc.2016.7861529","is_oa":false,"landing_page_url":"https://doi.org/10.1109/eptc.2016.7861529","pdf_url":null,"source":{"id":"https://openalex.org/S4363608031","display_name":"IEEE Electronics Packaging Technology Conference (EPTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","raw_type":"proceedings-article"},{"id":"pmh:oai:publica.fraunhofer.de:publica/396173","doi":null,"is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/396173","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1533308661","https://openalex.org/W1576346893","https://openalex.org/W1605697955","https://openalex.org/W1877541199","https://openalex.org/W1973280745","https://openalex.org/W2028272761","https://openalex.org/W2046149034","https://openalex.org/W2060397787","https://openalex.org/W2101496203","https://openalex.org/W2146579635","https://openalex.org/W2360318117","https://openalex.org/W4240268077","https://openalex.org/W6634476321","https://openalex.org/W7073715991"],"related_works":["https://openalex.org/W2033681507","https://openalex.org/W2075583892","https://openalex.org/W1484586314","https://openalex.org/W2075216356","https://openalex.org/W2152276790","https://openalex.org/W1988037040","https://openalex.org/W2077687425","https://openalex.org/W7096762899","https://openalex.org/W2131414343","https://openalex.org/W2110997148"],"abstract_inverted_index":{"This":[0,121],"work":[1,65],"helps":[2],"to":[3,34,44,59,126],"clarify":[4],"the":[5,74,83,91,95,114,118,134],"effects":[6],"on":[7],"bondable":[8],"Low":[9],"Temperature":[10],"Cofiered":[11],"Cofired":[12],"Ceramic(LTCC)":[13],"material":[14],"from":[15,56],"Fraunhofer":[16],"IKTS":[17],"under":[18],"different":[19],"bonding":[20,51,71,84,108,119],"conditions":[21],"as":[22],"changes":[23],"in":[24,133],"temperature,":[25],"voltage":[26],"and":[27,36,46,78,98,149],"time.":[28],"The":[29,61,107],"Paper":[30],"investigates":[31],"silicon":[32,37],"bonded":[33,43,96],"LTCC":[35,45],"with":[38,49,113],"a":[39,67,102,128],"thin":[40],"aluminum":[41],"layer":[42],"compares":[47],"both":[48],"anodic":[50],"of":[52,63,70,82,94,131,136,147],"standard":[53],"Borofloat":[54,76],"33\u00ae":[55,77],"Schott":[57],"GmbH":[58],"silicon.":[60],"result":[62],"this":[64],"provides":[66],"comprehensive":[68],"overview":[69],"parameters":[72],"for":[73,141],"materials":[75],"LTCC.":[79],"An":[80],"inspection":[81,93],"quality":[85,109],"is":[86,110],"carried":[87],"out,":[88],"which":[89],"includes":[90],"optical":[92],"area":[97],"interface":[99],"observation":[100],"via":[101],"scanning":[103],"electron":[104],"microscope":[105],"(SEM).":[106],"also":[111],"shown":[112],"charge":[115],"transfer":[116],"during":[117],"process.":[120],"paper":[122],"can":[123],"be":[124],"used":[125],"achieve":[127],"higher":[129],"degree":[130],"freedom":[132],"design":[135],"hermetic":[137],"wafer":[138],"level":[139],"packaging":[140],"various":[142],"Micro-Electro-Mechanical":[143],"System(MEMS)":[144],"devices":[145],"made":[146],"glass":[148],"ceramic":[150],"materials.":[151]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":3}],"updated_date":"2026-10-14T16:39:01.820549","created_date":"2017-03-16T00:00:00"}