{"id":"https://openalex.org/W2591921046","doi":"https://doi.org/10.1109/eptc.2016.7861491","title":"Highly efficient and accurate package electrical modeling automation","display_name":"Highly efficient and accurate package electrical modeling automation","publication_year":2016,"publication_date":"2016-11-01","ids":{"openalex":"https://openalex.org/W2591921046","doi":"https://doi.org/10.1109/eptc.2016.7861491","mag":"2591921046"},"language":"en","primary_location":{"id":"doi:10.1109/eptc.2016.7861491","doi":"https://doi.org/10.1109/eptc.2016.7861491","is_oa":false,"landing_page_url":"https://doi.org/10.1109/eptc.2016.7861491","pdf_url":null,"source":{"id":"https://openalex.org/S4363608031","display_name":"IEEE Electronics Packaging Technology Conference (EPTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073879008","display_name":"Po-Wei Chiu","orcid":"https://orcid.org/0000-0002-4211-1564","observed_orcids":["https://orcid.org/0000-0002-4211-1564"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Po-Wei Chiu","raw_affiliation_strings":["Xilinx Inc., HsinChu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xilinx Inc., HsinChu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101147668","display_name":"Chun-Hung Lin","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Chun-Hung Lin","raw_affiliation_strings":["Xilinx Inc., HsinChu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xilinx Inc., HsinChu, Taiwan","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101971391","display_name":"Hong Shi","orcid":"https://orcid.org/0000-0003-0708-9215","observed_orcids":["https://orcid.org/0000-0003-0708-9215"]},"institutions":[{"id":"https://openalex.org/I32923980","display_name":"Xilinx (United States)","ror":"https://ror.org/01rb7bk56","country_code":"US","type":"company","lineage":["https://openalex.org/I32923980"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hong Shi","raw_affiliation_strings":["Xilinx Inc., San Jose, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xilinx Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I32923980"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"289","last_page":"291"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.6689000129699707,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.6689000129699707,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.17499999701976776,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13292","display_name":"Embedded Systems and FPGA Applications","score":0.023000000044703484,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/power-distribution-networks","display_name":"power distribution networks","score":0.8899999856948853},{"id":"https://openalex.org/keywords/simultaneous-switching-noise","display_name":"simultaneous switching noise","score":0.9909999966621399}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6016045212745667},{"id":"https://openalex.org/C2777561913","wikidata":"https://www.wikidata.org/wiki/Q19599527","display_name":"Power integrity","level":4,"score":0.5842146277427673},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5225831270217896},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.49592432379722595},{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.4864899516105652},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.47073113918304443},{"id":"https://openalex.org/C74172769","wikidata":"https://www.wikidata.org/wiki/Q1446839","display_name":"Routing (electronic design automation)","level":2,"score":0.4406716525554657},{"id":"https://openalex.org/C115901376","wikidata":"https://www.wikidata.org/wiki/Q184199","display_name":"Automation","level":2,"score":0.43743154406547546},{"id":"https://openalex.org/C2777125575","wikidata":"https://www.wikidata.org/wiki/Q14088448","display_name":"Cadence","level":2,"score":0.41337841749191284},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.31666016578674316},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2729516923427582},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.12221461534500122},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/eptc.2016.7861491","doi":"https://doi.org/10.1109/eptc.2016.7861491","is_oa":false,"landing_page_url":"https://doi.org/10.1109/eptc.2016.7861491","pdf_url":null,"source":{"id":"https://openalex.org/S4363608031","display_name":"IEEE Electronics Packaging Technology Conference (EPTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7207000255584717,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1970619057","https://openalex.org/W167767621","https://openalex.org/W4401455942","https://openalex.org/W4387784280","https://openalex.org/W1744695869","https://openalex.org/W2111929278","https://openalex.org/W2068519056","https://openalex.org/W1817205798","https://openalex.org/W2161187293","https://openalex.org/W2156663155"],"abstract_inverted_index":{"In":[0,55],"recent":[1],"years,":[2],"the":[3,18,59,64,72],"requirement":[4],"of":[5,20,63],"high-end":[6],"electronic":[7],"product":[8],"is":[9],"higher":[10],"signal":[11],"speed,":[12],"storage":[13],"capacity":[14],"and":[15,50,61,67],"lower":[16],"power,":[17],"bandwidth":[19],"package":[21,32,43,86],"physical":[22],"design":[23],"becomes":[24],"more":[25],"critical,":[26],"such":[27],"as":[28],"layer":[29],"count":[30],"reduction,":[31],"routing":[33],"density.":[34],"Therefore,":[35],"there":[36],"are":[37],"many":[38],"electrical":[39,65,87],"validations":[40],"in":[41,71],"a":[42,78],"design,":[44],"including":[45],"PDN":[46],"(Power":[47],"Distribution":[48],"Network)":[49],"SSN":[51],"(Simultaneous":[52],"Switching":[53],"Noise).":[54],"order":[56],"to":[57],"control":[58],"accuracy":[60],"consistency":[62],"models,":[66],"shorten":[68],"engineering":[69],"time":[70],"modeling":[73],"cycle":[74],"time,":[75],"we":[76],"develop":[77],"tool,":[79],"XPAE":[80],"(Xilinx":[81],"PowerSI":[82],"Automated":[83],"Extraction),":[84],"for":[85],"model":[88],"auto-extraction":[89],"based":[90],"on":[91],"Cadence":[92],"PowerSI.":[93]},"counts_by_year":[{"year":2021,"cited_by_count":1}],"updated_date":"2026-10-06T10:28:23.643775","created_date":"2017-03-16T00:00:00"}