{"id":"https://openalex.org/W2591676402","doi":"https://doi.org/10.1109/eptc.2016.7861547","title":"Pressureless low temperature sintering paste for NiAu PCB substrate","display_name":"Pressureless low temperature sintering paste for NiAu PCB substrate","publication_year":2016,"publication_date":"2016-11-01","ids":{"openalex":"https://openalex.org/W2591676402","doi":"https://doi.org/10.1109/eptc.2016.7861547","mag":"2591676402"},"language":"en","primary_location":{"id":"doi:10.1109/eptc.2016.7861547","doi":"https://doi.org/10.1109/eptc.2016.7861547","is_oa":false,"landing_page_url":"https://doi.org/10.1109/eptc.2016.7861547","pdf_url":null,"source":{"id":"https://openalex.org/S4363608031","display_name":"IEEE Electronics Packaging Technology Conference (EPTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5025409289","display_name":"Yong Ling Xin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210155686","display_name":"Heraeus (Germany)","ror":"https://ror.org/051tn6h07","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210155686"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Yong Ling Xin","raw_affiliation_strings":["Heraeus Material Singapore Pte Ltd, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Heraeus Material Singapore Pte Ltd, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany","institution_ids":["https://openalex.org/I4210155686"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Tan Juo Yan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210155686","display_name":"Heraeus (Germany)","ror":"https://ror.org/051tn6h07","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210155686"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Tan Juo Yan","raw_affiliation_strings":["Heraeus Material Singapore Pte Ltd, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Heraeus Material Singapore Pte Ltd, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany","institution_ids":["https://openalex.org/I4210155686"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091810029","display_name":"Wolfgang Schmitt","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210155686","display_name":"Heraeus (Germany)","ror":"https://ror.org/051tn6h07","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210155686"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Wolfgang Schmitt","raw_affiliation_strings":["Heraeus Material Singapore Pte Ltd, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Heraeus Material Singapore Pte Ltd, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany","institution_ids":["https://openalex.org/I4210155686"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057794024","display_name":"Jens Nachreiner","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210155686","display_name":"Heraeus (Germany)","ror":"https://ror.org/051tn6h07","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210155686"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Jens Nachreiner","raw_affiliation_strings":["Heraeus Material Singapore Pte Ltd, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Heraeus Material Singapore Pte Ltd, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany","institution_ids":["https://openalex.org/I4210155686"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5005883308","display_name":"Chew Ly May","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210155686","display_name":"Heraeus (Germany)","ror":"https://ror.org/051tn6h07","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210155686"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Chew Ly May","raw_affiliation_strings":["Heraeus Material Singapore Pte Ltd, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Heraeus Material Singapore Pte Ltd, Heraeus Deutschland GmbH & Co. KG, Hanau, Germany","institution_ids":["https://openalex.org/I4210155686"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210155686"],"apc_list":null,"apc_paid":null,"fwci":0.465,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.62832848,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"584","last_page":"588"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/pressureless-sintering","display_name":"pressureless sintering","score":0.8029999732971191},{"id":"https://openalex.org/keywords/low-temperature-sintering","display_name":"low-temperature sintering","score":0.953000009059906},{"id":"https://openalex.org/keywords/die-attach","display_name":"die attach","score":0.8230000138282776},{"id":"https://openalex.org/keywords/electrically-conductive-adhesives","display_name":"conductive adhesives","score":0.7620000243186951},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.44999998807907104},{"id":"https://openalex.org/keywords/halogen-free-materials","display_name":"halogen-free materials","score":0.7580000162124634},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.6899999976158142},{"id":"https://openalex.org/keywords/reliability","display_name":"reliability","score":0.7250000238418579},{"id":"https://openalex.org/keywords/power-modules","display_name":"power modules","score":0.3959999978542328},{"id":"https://openalex.org/keywords/power-mosfet","display_name":"power MOSFET","score":0.921999990940094}],"concepts":[{"id":"https://openalex.org/C2777581544","wikidata":"https://www.wikidata.org/wiki/Q844613","display_name":"Sintering","level":2,"score":0.9235659837722778},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8672729730606079},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.5218731164932251},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5100749135017395},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5065687894821167},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.5046175718307495},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.5034634470939636},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.39761197566986084},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.1281229853630066},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.11203032732009888},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/eptc.2016.7861547","doi":"https://doi.org/10.1109/eptc.2016.7861547","is_oa":false,"landing_page_url":"https://doi.org/10.1109/eptc.2016.7861547","pdf_url":null,"source":{"id":"https://openalex.org/S4363608031","display_name":"IEEE Electronics Packaging Technology Conference (EPTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2020378435","https://openalex.org/W2310785440"],"related_works":["https://openalex.org/W4416884611","https://openalex.org/W2886742848","https://openalex.org/W2901224988","https://openalex.org/W2196448307","https://openalex.org/W2131508128","https://openalex.org/W2463543237","https://openalex.org/W2489886326","https://openalex.org/W2000085971","https://openalex.org/W2217284644","https://openalex.org/W3023161541"],"abstract_inverted_index":{"Conductive":[0],"adhesive":[1,19],"has":[2,20,94],"been":[3,95],"one":[4,55],"of":[5,33,48,56,89,110,180,198,209],"the":[6,21,43,57,61,85,90,115,178,185,192,206],"popular":[7],"choices":[8],"for":[9,37,64,99,158],"die":[10,29],"attachment":[11],"on":[12,42,127],"PCB":[13,39,173],"NiAu":[14,38,159],"substrate.":[15],"However,":[16],"typical":[17],"conductive":[18],"lowest":[22],"thermal":[23,66,196],"and":[24,67,75,103,118,195],"electrical":[25],"conductivity":[26],"among":[27],"all":[28],"attach":[30],"material.":[31],"Consideration":[32],"silver":[34,144,150,211],"sinter":[35,52,101,105,131,145,212],"paste":[36,53,102,132,146,200,213],"substrate":[40,174],"is":[41,54,71,79,168],"raise":[44],"due":[45],"to":[46,60,172],"several":[47],"its":[49],"advantages.":[50],"Silver":[51],"key":[58],"solution":[59],"increasing":[62],"demand":[63],"high":[65],"reliable":[68],"devices.":[69],"It":[70],"also":[72,124,215],"lead":[73],"free":[74,77],"halogen":[76],"which":[78],"very":[80],"much":[81,96],"in":[82,114],"line":[83],"with":[84],"future":[86],"environmental":[87],"requirement":[88],"microelectronic":[91],"industry.":[92],"There":[93,122],"work":[97,126],"developed":[98],"pressure":[100],"pressure-less":[104,130],"using":[106,133,147],"higher":[107],"sintering":[108,162,187],"temperature":[109,143,163],"at":[111,155],"least":[112],"230\u00b0C":[113],"power":[116,119],"module":[117],"MOSFET":[120],"segment.":[121],"are":[123],"reported":[125],"low":[128,142],"temperature,":[129],"nano-scale":[134],"silver.":[135],"In":[136,189,204],"this":[137,190,199,210],"paper,":[138],"we":[139],"report":[140],"a":[141],"micron":[148],"scale":[149],"that":[151],"can":[152],"be":[153,165,202,216],"sintered":[154],"200\u00b0C":[156,161],"suitable":[157],"surface.":[160],"would":[164,201],"favorable":[166],"(but":[167],"not":[169],"limited":[170],"to)":[171],"as":[175],"it":[176],"minimize":[177],"risk":[179],"epoxy":[181],"laminate":[182],"decomposition":[183],"during":[184],"long":[186],"profile.":[188],"study,":[191],"general":[193],"properties":[194],"performance":[197,208],"reviewed.":[203],"addition,":[205],"reliability":[207],"will":[214],"share.":[217]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-10-05T09:50:58.205359","created_date":"2017-03-16T00:00:00"}