{"id":"https://openalex.org/W2575474148","doi":null,"title":"New Generation Silver Conductor System for LTCC Applications","display_name":"New Generation Silver Conductor System for LTCC Applications","publication_year":2001,"publication_date":"2001-01-01","ids":{"openalex":"https://openalex.org/W2575474148","mag":"2575474148"},"language":"en","primary_location":{"id":"mag:2575474148","doi":null,"is_oa":false,"landing_page_url":"http://www.ferro.com/non-cms/EMS/ltcc/LTCCDesignGuide-_New%20Generation%20Silver%20Conductor%20System%20for%20LTCC%20Ap_43.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null},"volume":null,"type":"article","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109519029","display_name":"Liang Chai","orcid":"https://orcid.org/0009-0001-4714-6459","observed_orcids":["https://orcid.org/0009-0001-4714-6459"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Liang Chai","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0009-0001-4714-6459","affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111935732","display_name":"AZIZ S. SHAIKH","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Aziz Shaikh","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5082315196","display_name":"Vern Stygar","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Vern Stygar","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.801,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.77396626,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12155","display_name":"Microwave Dielectric Ceramics Synthesis","score":0.8920999765396118,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12155","display_name":"Microwave Dielectric Ceramics Synthesis","score":0.8920999765396118,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.05790000036358833,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.030899999663233757,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/silver-conductors","display_name":"silver conductors","score":0.8629999756813049},{"id":"https://openalex.org/keywords/low-temperature-co-fired-ceramic","display_name":"low temperature co-fired ceramic","score":0.9850000143051147},{"id":"https://openalex.org/keywords/ceramic-packaging","display_name":"ceramic packaging","score":0.6520000100135803},{"id":"https://openalex.org/keywords/conductor-loss","display_name":"conductor loss","score":0.6930000185966492},{"id":"https://openalex.org/keywords/microwave-performance","display_name":"microwave performance","score":0.5920000076293945},{"id":"https://openalex.org/keywords/bluetooth","display_name":"Bluetooth","score":0.5},{"id":"https://openalex.org/keywords/wireless-applications","display_name":"wireless applications","score":0.6970000267028809}],"concepts":[{"id":"https://openalex.org/C34800285","wikidata":"https://www.wikidata.org/wiki/Q5159395","display_name":"Conductor","level":2,"score":0.7500277757644653},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7304121255874634},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.708359956741333},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.6949576735496521},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.5471989512443542},{"id":"https://openalex.org/C44838205","wikidata":"https://www.wikidata.org/wiki/Q127995","display_name":"Microwave","level":2,"score":0.517094612121582},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4454715847969055},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2849401831626892},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18463134765625},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10255134105682373}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:2575474148","doi":null,"is_oa":false,"landing_page_url":"http://www.ferro.com/non-cms/EMS/ltcc/LTCCDesignGuide-_New%20Generation%20Silver%20Conductor%20System%20for%20LTCC%20Ap_43.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2185084884"],"related_works":["https://openalex.org/W7098947836","https://openalex.org/W2084432483","https://openalex.org/W7166142078","https://openalex.org/W2134529088","https://openalex.org/W2243172727","https://openalex.org/W1655555620","https://openalex.org/W7095370789","https://openalex.org/W2043694735","https://openalex.org/W2149749285","https://openalex.org/W2118371236"],"abstract_inverted_index":{"Recently":[0],"there":[1],"have":[2],"been":[3],"increasing":[4],"demands":[5],"for":[6,30,102],"ceramic":[7,66],"packaging":[8,67],"materials":[9],"due":[10],"to":[11,80,94,111],"the":[12,27,35,39,81,103,112,137],"growth":[13],"in":[14,109],"wireless":[15],"applications,":[16],"such":[17],"as":[18],"Bluetooth.":[19],"Low":[20,54],"cost":[21,62,123],"and":[22,38,51,63,115,124],"high":[23,64],"volume":[24],"capability":[25],"are":[26,141],"key":[28],"factors":[29],"consumer":[31],"applications.":[32],"Silver":[33],"is":[34,73,92,100,108],"most":[36],"conducting":[37],"least":[40],"expensive":[41],"air":[42],"firable":[43],"precious":[44],"metal.":[45],"The":[46,85,118,134],"combination":[47],"of":[48,136],"silver":[49,89,120],"conductor":[50,76,90,96,139],"low":[52,61],"loss":[53],"Temperature":[55],"Co-fired":[56],"Ceramic":[57],"(LTCC)":[58],"offers":[59],"a":[60],"performance":[65],"solution.":[68],"At":[69],"microwave":[70,126],"frequencies,":[71],"it":[72],"known":[74],"that":[75],"losses":[77],"contribute":[78],"significantly":[79],"total":[82],"material":[83],"loss.":[84],"100%":[86],"new":[87],"generation":[88],"system":[91,140],"developed":[93],"minimize":[95],"losses.":[97],"Ag":[98,138],"metallurgy":[99,121],"used":[101],"solderable":[104],"surface":[105],"conductors,":[106],"which":[107],"contrast":[110],"traditional":[113],"Ag/Pd":[114],"Ag/Pt":[116],"metallurgy.":[117],"pure":[119],"reduces":[122],"improves":[125],"performance,":[127],"while":[128],"offering":[129],"improved":[130],"solder":[131],"leach":[132],"resistance.":[133],"properties":[135],"discussed.":[142]},"counts_by_year":[{"year":2018,"cited_by_count":1}],"updated_date":"2026-09-22T06:50:58.402377","created_date":"2017-01-26T00:00:00"}