{"id":"https://openalex.org/W2563393553","doi":null,"title":"Fusion bonding for next- generation 3D-ICs","display_name":"Fusion bonding for next- generation 3D-ICs","publication_year":2014,"publication_date":"2014-01-01","ids":{"openalex":"https://openalex.org/W2563393553","mag":"2563393553"},"language":"en","primary_location":{"id":"mag:2563393553","doi":null,"is_oa":false,"landing_page_url":"http://www.monolithic3d.com/uploads/6/0/5/5/6055488/evg_sst_july_2014_fusion_bonding.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null},"volume":null,"type":"article","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5055527138","display_name":"Thomas Uhrmann","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Thomas Uhrmann","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111798869","display_name":"Thorsten Matthias","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Thorsten Matthias","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088214525","display_name":"Thomas Wagenleitner","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Thomas Wagenleitner","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5042006175","display_name":"Paul F. Lindner","orcid":"https://orcid.org/0000-0001-5384-1864","observed_orcids":["https://orcid.org/0000-0001-5384-1864"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Paul Lindner","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.1725,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.63458193,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.0,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fusion-bonding","display_name":"fusion bonding","score":0.9679999947547913},{"id":"https://openalex.org/keywords/3d-integrated-circuits","display_name":"3D integrated circuits","score":0.8650000095367432},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"wafer bonding","score":0.6150000095367432},{"id":"https://openalex.org/keywords/chip-stacking","display_name":"chip stacking","score":0.421999990940094},{"id":"https://openalex.org/keywords/interconnects","display_name":"interconnects","score":0.4620000123977661}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45675477385520935}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:2563393553","doi":null,"is_oa":false,"landing_page_url":"http://www.monolithic3d.com/uploads/6/0/5/5/6055488/evg_sst_july_2014_fusion_bonding.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1560224562","https://openalex.org/W2018994146","https://openalex.org/W2031756623","https://openalex.org/W2045318207","https://openalex.org/W2053597733","https://openalex.org/W2088741702","https://openalex.org/W2323547137","https://openalex.org/W2615030411"],"related_works":["https://openalex.org/W2531809851","https://openalex.org/W3128567481","https://openalex.org/W2970652461","https://openalex.org/W2616065569","https://openalex.org/W2264202987","https://openalex.org/W2008678858","https://openalex.org/W7164994775","https://openalex.org/W7165036305","https://openalex.org/W2091806520","https://openalex.org/W193898604"],"abstract_inverted_index":null,"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2026-10-01T08:54:57.152042","created_date":"2017-01-06T00:00:00"}