{"id":"https://openalex.org/W2525973537","doi":null,"title":"MSE 376 Lecture 1: Film Deposition Methods","display_name":"MSE 376 Lecture 1: Film Deposition Methods","publication_year":2006,"publication_date":"2006-10-04","ids":{"openalex":"https://openalex.org/W2525973537","mag":"2525973537"},"language":"en","primary_location":{"id":"mag:2525973537","doi":null,"is_oa":false,"landing_page_url":"http://nanohub.org/resources/1872/questions","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null},"volume":null,"type":"article","indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020649130","display_name":"Mark C. Hersam","orcid":"https://orcid.org/0000-0003-4120-1426","observed_orcids":["https://orcid.org/0000-0003-4120-1426"]},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Mark C. Hersam","raw_affiliation_strings":["Northwestern University"],"raw_orcid":"https://orcid.org/0000-0003-4120-1426","affiliations":[{"raw_affiliation_string":"Northwestern University","institution_ids":["https://openalex.org/I111979921"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5020649130"],"corresponding_institution_ids":["https://openalex.org/I111979921"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.30783952,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13889","display_name":"Advanced Materials and Semiconductor Technologies","score":0.8535000085830688,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13889","display_name":"Advanced Materials and Semiconductor Technologies","score":0.8535000085830688,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.07180000096559525,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.019700000062584877,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/film-deposition","display_name":"film deposition","score":0.8029999732971191},{"id":"https://openalex.org/keywords/thin-film-fabrication","display_name":"thin film fabrication","score":0.6819999814033508},{"id":"https://openalex.org/keywords/thin-films","display_name":"thin films","score":0.5199999809265137},{"id":"https://openalex.org/keywords/deposition-techniques","display_name":"deposition techniques","score":0.5899999737739563}],"concepts":[{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.5069758892059326},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.373504638671875},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.3282162547111511},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.20082175731658936},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:2525973537","doi":null,"is_oa":false,"landing_page_url":"http://nanohub.org/resources/1872/questions","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2543405025","https://openalex.org/W2485741780","https://openalex.org/W7099299428","https://openalex.org/W2528011952","https://openalex.org/W2943072770","https://openalex.org/W7097391161","https://openalex.org/W7058160325","https://openalex.org/W2727198611","https://openalex.org/W2247119976","https://openalex.org/W7218263152"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-10-01T08:54:57.152042","created_date":"2016-10-07T00:00:00"}